公开(公告)号：US06652290B2

公开(公告)日：2003-11-25

申请号：US09978128

申请日：2001-10-15

申请人： Gerald P. Audet ,  Luc Guerin ,  Jean-Luc Landreville

发明人： Gerald P. Audet ,  Luc Guerin ,  Jean-Luc Landreville

IPC分类号： H01R1200

CPC分类号： H01R12/57 ,  H01L23/49811 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/16152 ,  H05K3/325 ,  H05K7/1061 ,  Y10T29/49149

摘要： An integrated circuit package having metallized contact pads is provided with electrically conducting devices permanently attached to each contact pad. The devices are flexed when so attached, and are aligned and assembled onto corresponding pads of a second electrical component (e.g., a printed circuit board) to provide electrical connection between the integrated circuit package and the second electrical component.

公开(公告)号：US20080264606A1

公开(公告)日：2008-10-30

申请号：US12143940

申请日：2008-06-23

申请人： Gerald P. Audet ,  Sylvain Dussault ,  Pierre LaCasse ,  Jean-Luc Landreville

发明人： Gerald P. Audet ,  Sylvain Dussault ,  Pierre LaCasse ,  Jean-Luc Landreville

IPC分类号： F28D21/00

CPC分类号： H05K7/1061 ,  H01L23/4338 ,  H01L2924/0002 ,  H01L2924/00

摘要： Disclosed is a piston reset apparatus for a multichip module that includes a base with multiple projections and two unit associating pegs extending from opposite ends of the base, a hat disposed upwardly of the base and including multiple adjustable pistons vertically adjustable within the hat, each of the plurality of adjustable pistons being disposed in alignment with one of the multiple projections, a mass equivalent plate disposed upwardly of the hat and being configured to hold a spring loaded sleeve, the spring loaded sleeve including a plurality of springs, each of the springs being aligned with and configured to apply pressure upon one of the multiple pistons, a spring loaded clamp disposed upwardly of the plate and including a spring loaded portion and a retaining portion, the retaining portion defining two cavities configured to fixedly associate with an associating groove defined by each of the unit associating pegs.

摘要翻译： 公开了一种用于多芯片模块的活塞复位装置，其包括具有多个突起的基座和从基座的相对端延伸的两个单元关联钉，帽子设置在基座的上方，并且包括在帽子内可垂直调节的多个可调节活塞， 所述多个可调节活塞与所述多个突起中的一个突起对准设置，所述质量当量板设置在所述帽子的上方并且被构造成保持弹簧加载的套筒，所述弹簧加载的套筒包括多个弹簧，每个所述弹簧为 对准并构造成在多个活塞中的一个上施加压力，弹簧加载的夹具，其设置在板的上方并且包括弹簧加载部分和保持部分，所述保持部分限定两个空腔，其被构造成与由 每个单位关联栓。

公开(公告)号：US20050013124A1

公开(公告)日：2005-01-20

申请号：US10604555

申请日：2003-07-30

申请人： Jean Audet ,  Luc Guerin ,  Jean-Luc Landreville ,  Gerald Audet

发明人： Jean Audet ,  Luc Guerin ,  Jean-Luc Landreville ,  Gerald Audet

IPC分类号： H01L23/498 ,  H05K3/34 ,  H01R9/00

CPC分类号： H01R12/57 ,  H01L23/49811 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/16152 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/718 ,  H05K3/3426 ,  Y02P70/613

摘要： An area-array integrated circuit package assembly are provided with a plurality of electrically conductive connectors attached to the package I.O. pads, that are used to connect the package to a printed circuit card or other component. The connectors comprise at least two parallel conductors flexing together in the same direction, electrically insulated from each other for a portion of their length between the package and printed circuit card to provide for reduced interconnection inductance. The connection with the component contact pads can be achieved by mechanically pressing the package and circuit card together or with the use of bonding material.

摘要翻译： 区域阵列集成电路封装组件设置有多个连接到封装件I.O的导电连接器。 垫，用于将包装连接到印刷电路卡或其他组件。 连接器包括至少两个平行的导体，它们沿相同方向弯曲在一起，在封装和印刷电路卡之间的长度的一部分彼此电绝缘以提供减小的互连电感。 与元件接触焊盘的连接可以通过将封装和电路卡机械地压在一起或使用粘合材料来实现。