Abstract:
There is provided a photosensitive resin composition which enables production of a lithographic printing plate precursor having a non-image portion which has good solubility in an alkali aqueous solution and which enables production of a lithographic printing plate having excellent printing durability, excellent chemical resistance, and, in particular, excellent printing durability at the time of using a low quality print material, a lithographic printing plate precursor obtained by using the photosensitive resin composition, and a method for producing a lithographic printing plate.The photosensitive resin composition contains a polymer compound having a linking group represented by Formula A-1 in the main chain; and an infrared absorbing material. In Formula A-1, R1 and R2 each independently represent a hydrogen atom or a monovalent organic group, and X1 is a specific linking group.
Abstract:
There is provided a photosensitive resin composition which enables production of a lithographic printing plate precursor having a non-image portion which has good solubility in an alkali aqueous solution and which enables production of a lithographic printing plate having excellent printing durability and excellent chemical resistance, a lithographic printing plate precursor obtained by using the photosensitive resin composition, and a method for producing a lithographic printing plate.The photosensitive resin composition contains a polymer compound having a constitutional unit represented by the following Formula A-1 as a constitutional unit A and at least one constitutional unit among constitutional units represented by the following Formulas B-1 to B-6 as a constitutional unit B in the main chain, and an infrared absorbing material.
Abstract:
There is provided a resin composition containing a polyimide or a polyimide precursor, where a cured substance obtained from the resin composition satisfies all of the following conditions (i) to (iv), and are provided a cured substance, a laminate, a manufacturing method for a cured substance, a manufacturing method for a laminate, a manufacturing method for a semiconductor device, and a semiconductor device; condition (i): a Young's modulus of the cured substance is 3.5 GPa or more, condition (ii): a coefficient of thermal expansion of the cured substance in a temperature range of 25° C. to 125° C. is less than 50 ppm/° C., condition (iii): a Tg of the cured substance is 240° C. or higher, and condition (iv): a breaking elongation of the cured substance is 40% or more.
Abstract:
There is provided a manufacturing method for a cured substance, which makes it possible to obtain a cured substance having excellent breaking elongation, a manufacturing method for a laminate, including the manufacturing method for a cured substance, a manufacturing method for a semiconductor device, including the manufacturing method for a cured substance or the manufacturing method for a laminate, and there is provided a treatment liquid that is used in the manufacturing method for a cured substance. The manufacturing method for a cured substance includes a film forming step of applying a resin composition containing a precursor of a cyclization resin onto a base material to form a film, a treatment step of bringing a treatment liquid into contact with the film, and a heating step of heating the film after the treatment step, in which the treatment liquid contains at least one compound selected from the group consisting of a basic compound having an amide group and a base generator having an amide group.
Abstract:
There are provided a curable resin composition containing at least one polymer precursor selected from the group consisting of a polyimide precursor and a polybenzoxazole precursor, where the polymer precursor has a heterocyclic ring structure containing two or more nitrogen atoms and an acid value of the polymer precursor is 1 mmol/g or less, a cured film that is obtained by curing the curable resin composition, a laminate that includes the cured film, a method for manufacturing the cured film, and a semiconductor device including the cured film or the laminate, and a novel polymer precursor.
Abstract:
Provided are a lithographic printing plate precursor having an image-recording layer on a hydrophilic support, in which the image-recording layer includes a polymer particle including an addition polymerization-type resin having a hydrophilic structure and a crosslinking structure, a method for producing a lithographic printing plate in which the lithographic printing plate precursor is used, a polymer particle including an addition polymerization-type resin having a hydrophilic structure and a crosslinking structure, and a composition including the polymer particle.
Abstract:
Provided are a positive type planographic printing plate precursor including: a support which has a hydrophilic surface; and an image recording layer on the support, the image recording layer containing: a polymer compound 1 having at least one bond selected from the group consisting of a urea bond, a urethane bond, and a carbonate bond in a main chain and containing a sulfonamide group in the main chain; a polymer compound 2-1 having at least one of a constitutional unit represented by Formula S-1 or a constitutional unit represented by Formula S-2 or a polymer compound 2-2 having a constitutional unit represented by Formula EV-1 and a constitutional unit represented by Formula EV-2; and an infrared absorbent, and a method of producing a planographic printing plate obtained by using the positive type planographic printing plate precursor.
Abstract:
Provided is a positive type photosensitive resin composition including: a polymer compound which contains, in a main chain thereof, a sulfonamide group and a structure represented by Formula A-1; and an infrared absorbent. In Formula A-1, X represents —NR1—, —S—, or —O—, R1 represents a hydrogen atom or an alkyl group, and each symbol “*” independently represents a bonding position with respect to another structure.
Abstract:
A negative type photosensitive resin composition includes a polymer compound which has, in a main chain thereof, a constitutional unit A represented by Formula A-1, a constitutional unit B that is at least one of constitutional units represented by Formulae B-1, B-2, B-3, B-4, B-5, B-6, or B-7, and a constitutional unit C containing an ethylenically unsaturated group; and a polymerization initiator.A negative type planographic printing plate precursor includes an image recording layer containing the negative type photosensitive resin composition.A method of preparing a planographic printing plate includes, in order, an exposure step of image-exposing the negative type planographic printing plate precursor; and a development step of performing development by removing a non-exposed portion of the exposed negative type planographic printing plate precursor using a developer.