公开(公告)号：US20220394843A1

公开(公告)日：2022-12-08

申请号：US17824872

申请日：2022-05-25

Applicant: FUJIFILM Corporation

Inventor： Genya TANAKA ,  Yasuyuki SASADA

IPC: H05K1/02 ,  H05K3/10

Abstract: A wiring board, comprising: wiring patterns that are buried with the wiring board, in which at least one of thickness regions to a thickness position of 7 μm toward a direction away from the wiring patterns with each of one surface and the other surface of the wiring pattern in a thickness direction as a reference has an elastic modulus at 240° C. equal to or greater than 300 MPa, and a dielectric loss tangent is equal to or less than 0.006.

公开(公告)号：US20220394842A1

公开(公告)日：2022-12-08

申请号：US17824868

申请日：2022-05-25

Applicant: FUJIFILM Corporation

Inventor： Genya TANAKA ,  Yasuyuki SASADA

IPC: H05K1/02 ,  H05K3/10 ,  H05K3/46

Abstract: A wiring board, comprising: wiring patterns that are buried in the wiring board, in which a region positioned between wiring patterns disposed in an in-plane direction of the same plane has an elastic modulus at 140° C. equal to or less than 0.1 MPa, and a dielectric loss tangent is equal to or less than 0.006.

公开(公告)号：US20250034424A1

公开(公告)日：2025-01-30

申请号：US18898649

申请日：2024-09-26

Applicant: FUJIFILM Corporation

Inventor： Miyoko HARA ,  Yasuyuki SASADA

IPC: C09D123/12 ,  C08L23/12 ,  C08L53/00 ,  C09D153/00 ,  H05K1/03

Abstract: An embodiment of the present invention relates to a film including a layer A, and a layer B provided on at least one surface of the layer A, in which a dielectric loss tangent of the film is 0.010 or less, and a ratio of an absorbance of the layer B at a wavelength of 355 nm to an absorbance of the layer A at a wavelength of 355 nm is 0.45 or more and 1.00 or less, and a laminate including a film having a layer A and a layer B, and a metal layer or a metal wire on a B layer side of the film, in which a dielectric loss tangent of the film is 0.010 or less, and a ratio of an absorbance of the layer B at a wavelength of 355 nm to an absorbance of the layer A at a wavelength of 355 nm is 0.45 or more and 1.00 or less.

公开(公告)号：US20240407090A1

公开(公告)日：2024-12-05

申请号：US18805521

申请日：2024-08-14

Applicant: FUJIFILM Corporation

Inventor： Yasuyuki SASADA ,  Miyoko HARA

IPC: H05K1/03

Abstract: A film includes a layer A, and a layer B provided on at least one surface of the layer A, in which a ratio of an elastic modulus of the layer A at 160° C. to an elastic modulus of the layer B at 160° C. is 1.2 or more, and a thermal conductivity of the layer A is 0.05 W/(m·K) or more. A laminate includes a layer A, a layer B, and a metal layer or a metal wire, in this order, in which a ratio of an elastic modulus of the layer A at 160° C. to an elastic modulus of the layer B at 160° C. is 1.2 or more, and a thermal conductivity of the layer A is 0.05 W/(m·K) or more.

公开(公告)号：US20240399714A1

公开(公告)日：2024-12-05

申请号：US18800111

申请日：2024-08-11

Applicant: FUJIFILM Corporation

Inventor： Yasuyuki SASADA

IPC: B32B15/09 ,  B32B15/20 ,  B32B27/08 ,  B32B27/20 ,  B32B27/32 ,  B32B27/36

Abstract: Provided are a metamaterial including a base material including at least an elastic layer in which an elastic recovery rate at 25° C. is 80% or less and a pattern provided on a surface of the elastic layer, in which the pattern is composed of at least one of a conductive material or a material which transits from an insulator to a conductor; and a laminate.

公开(公告)号：US20230321953A1

公开(公告)日：2023-10-12

申请号：US18319473

申请日：2023-05-17

Applicant: FUJIFILM Corporation

Inventor： Yasuyuki SASADA

IPC: B32B15/08 ,  B32B15/20

CPC classification number: B32B15/08 ,  B32B15/20 ,  B32B2250/02 ,  B32B2305/55 ,  B32B2307/7376

Abstract: Provided are a liquid crystal polymer film containing a liquid crystal polymer, in which the liquid crystal polymer film includes a portion where a density of the liquid crystal polymer is low and a portion where the density of the liquid crystal polymer is high; a liquid crystal polymer film containing a liquid crystal polymer and a compound incompatible with the liquid crystal polymer; a liquid crystal polymer film containing a liquid crystal polymer and a compound A, in which an absolute value of a difference between an SP value of the liquid crystal polymer, which is determined by Hoy method, and an SP value of the compound A, which is determined by Hoy method, is 0.1 MPa0.5 or more; and a method for manufacturing these polymer films; and a laminate using the liquid crystal polymer film.

公开(公告)号：US20230311453A1

公开(公告)日：2023-10-05

申请号：US18329553

申请日：2023-06-05

Applicant: FUJIFILM Corporation

Inventor： Yasuyuki SASADA

IPC: B32B15/08 ,  B32B27/20

CPC classification number: B32B15/08 ,  B32B27/205 ,  B32B2305/55 ,  B32B2250/02 ,  B32B2307/204 ,  B32B2457/08

Abstract: Provided are a laminate including a polymer film in which a linear expansion coefficient of at least one surface X is smaller than a linear expansion coefficient of an inside and a metal layer or a metal wire, which is provided on a surface Y side opposite to the surface X of the polymer film; and a polymer film in which a linear expansion coefficient of at least one surface X is smaller than a linear expansion coefficient of an inside.

公开(公告)号：US20230292434A1

公开(公告)日：2023-09-14

申请号：US18318705

申请日：2023-05-16

Applicant: FUJIFILM Corporation

Inventor： Yasuyuki SASADA

IPC: H05K1/03 ,  C08L67/04 ,  C08L77/12

CPC classification number: H05K1/0373 ,  C08L67/04 ,  C08L77/12 ,  C08L2203/16 ,  C08L2205/12 ,  H05K2201/0141

Abstract: Provided are a liquid crystal polymer film or a polymer film, which has low linear expansion coefficient and has excellent adhesiveness with a metal layer. The liquid crystal polymer film includes a layer A and a layer B on at least one surface of the layer A, in which the layer A contains a liquid crystal polymer and a linear expansion coefficient of the liquid crystal polymer film is −20 ppm/K to 50 ppm/K.

公开(公告)号：US20230286250A1

公开(公告)日：2023-09-14

申请号：US18318696

申请日：2023-05-16

Applicant: FUJIFILM Corporation

Inventor： Yasuyuki SASADA

IPC: B32B15/09 ,  B32B15/20 ,  B32B27/20

CPC classification number: B32B15/09 ,  B32B15/20 ,  B32B27/20 ,  B32B2250/03 ,  B32B2250/40 ,  B32B2305/55

Abstract: Provided are a film capable of suppressing a distortion of a metal wire in a case where the film is adhered to the metal wire, and a laminate formed of the film. The film has a dielectric loss tangent of 0.005 or less, and has an elastic modulus of at least one surface at 160° C., which is smaller than an elastic modulus of an inside at 160° C.

公开(公告)号：US20230278317A1

公开(公告)日：2023-09-07

申请号：US18317933

申请日：2023-05-16

Applicant: FUJIFILM Corporation

Inventor： Yasuyuki SASADA

IPC: B32B15/09 ,  B32B15/20 ,  B32B27/08

CPC classification number: B32B15/09 ,  B32B15/20 ,  B32B27/08 ,  B32B2250/03 ,  B32B2305/55

Abstract: Provided are a polymer film having excellent adhesiveness with a substrate, and a laminate using the polymer film. The polymer film includes a layer A and a layer B on at least one surface of the layer A, in which the layer B contains a polymer having a dielectric loss tangent of 0.01 or less or 0.005 or less or a liquid crystal polymer, and a compound having a functional group, and the functional group is at least one group selected from the group consisting of a covalent-bondable group, an ion-bondable group, a hydrogen-bondable group, a dipole-interactable group, and a curing reactive group.