Phase-change TaN resistor based triple-state/multi-state read only memory
    11.
    发明授权
    Phase-change TaN resistor based triple-state/multi-state read only memory 有权
    相变TaN电阻器基于三态/多态只读存储器

    公开(公告)号:US07715248B2

    公开(公告)日:2010-05-11

    申请号:US12109081

    申请日:2008-04-24

    IPC分类号: G11C7/00 G11C7/22

    摘要: The present invention relates to a nonvolatile memory such as, for example a ROM or an EPROM, in which the information density of the memory is increased relative to a conventional nonvolatile memory that includes two logic state devices. Specifically, the nonvolatile memory of the present invention includes a SiN/TaN/SiN thin film resistor embedded within a material having a thermal conductivity of about 1 W/m-K or less; and a non-linear Si-containing device coupled to the resistor. Read and write circuits and operations are also provided in the present application.

    摘要翻译: 本发明涉及诸如ROM或EPROM的非易失性存储器,其中存储器的信息密度相对于包括两个逻辑状态器件的常规非易失性存储器而增加。 具体地,本发明的非易失性存储器包括嵌入在热导率为约1W / m-K以下的材料中的SiN / TaN / SiN薄膜电阻器; 以及耦合到电阻器的非线性含Si器件。 读写电路和操作也在本申请中提供。

    On-Chip Real-Time Moisture Sensor For and Method of Detecting Moisture Ingress in an Integrated Circuit Chip
    12.
    发明申请
    On-Chip Real-Time Moisture Sensor For and Method of Detecting Moisture Ingress in an Integrated Circuit Chip 审中-公开
    片上实时湿度传感器及其检测集成电路芯片中水分入口的方法

    公开(公告)号:US20080191716A1

    公开(公告)日:2008-08-14

    申请号:US11672535

    申请日:2007-02-08

    申请人: Fen Chen Kai D. Feng

    发明人: Fen Chen Kai D. Feng

    IPC分类号: G01R27/26

    CPC分类号: G01N27/223

    摘要: On-chip real-time moisture detection circuitry for monitoring ingress of moisture into an integrated circuit chip during the operational lifetime of the chip. The moisture detection circuitry includes one or more moisture-sensing units and a common moisture monitor for monitoring the state of each moisture-sensing units. The moisture monitor can be configured to provided a real-time moisture-detected signal for signaling that moisture ingress into the integrated circuit chip has occurred.

    摘要翻译: 片上实时水分检测电路,用于在芯片的使用寿命期间监测水分进入集成电路芯片。 湿度检测电路包括一个或多个湿度感测单元和用于监测每个湿度感测单元的状态的公共湿度监视器。 水分监测器可以被配置为提供实时湿度检测信号,用于发信号通知已经发生湿气进入集成电路芯片。

    ANALYZING EM PERFORMANCE DURING IC MANUFACTURING
    13.
    发明申请
    ANALYZING EM PERFORMANCE DURING IC MANUFACTURING 有权
    在IC制造过程中分析EM性能

    公开(公告)号:US20130049793A1

    公开(公告)日:2013-02-28

    申请号:US13222306

    申请日:2011-08-31

    IPC分类号: G01R31/26 G01R31/02

    CPC分类号: G01R31/2858

    摘要: A testing structure, system and method for monitoring electro-migration (EM) performance. A system is described that includes an array of testing structures, wherein each testing structure includes: an EM resistor having four point resistive measurement, wherein a first and second terminals provide current input and a third and fourth terminals provide a voltage measurement; a first transistor coupled to a first terminal of the EM resistor for supplying a test current; the voltage measurement obtained from a pair of switching transistors whose gates are controlled by a selection switch and whose drains are utilized to provide a voltage measurement across the third and fourth terminals. Also included is a decoder for selectively activating the selection switch for one of the array of testing structures; and a pair of outputs for outputting the voltage measurement of a selected testing structure.

    摘要翻译: 用于监测电迁移(EM)性能的测试结构,系统和方法。 描述了包括测试结构阵列的系统,其中每个测试结构包括:具有四点电阻测量的EM电阻器,其中第一和第二端子提供电流输入,第三和第四端子提供电压测量; 耦合到所述EM电阻器的第一端子以提供测试电流的第一晶体管; 由一对开关晶体管获得的电压测量,其栅极由选择开关控制,并且其漏极用于在第三和第四端子处提供电压测量。 还包括用于选择性地激活测试结构阵列之一的选择开关的解码器; 以及用于输出所选择的测试结构的电压测量的一对输出。

    Design structure for an on-chip real-time moisture sensor for and method of detecting moisture ingress in an integrated circuit chip
    14.
    发明授权
    Design structure for an on-chip real-time moisture sensor for and method of detecting moisture ingress in an integrated circuit chip 失效
    片上实时湿度传感器的设计结构和集成电路芯片中水分进入检测方法

    公开(公告)号:US07571637B2

    公开(公告)日:2009-08-11

    申请号:US11926241

    申请日:2007-10-29

    申请人: Fen Chen Kai D. Feng

    发明人: Fen Chen Kai D. Feng

    IPC分类号: G01N5/02

    CPC分类号: G01N27/223

    摘要: A design structure for an on-chip real-time moisture detection circuitry for monitoring ingress of moisture into an integrated circuit chip during the operational lifetime of the chip. The moisture detection circuitry includes one or more moisture-sensing units and a common moisture monitor for monitoring the state of each moisture-sensing units. The moisture monitor can be configured to provided a real-time moisture-detected signal for signaling that moisture ingress into the integrated circuit chip has occurred.

    摘要翻译: 一种片上实时水分检测电路的设计结构,用于在芯片的使用寿命期间监测水分进入集成电路芯片的情况。 湿度检测电路包括一个或多个湿度感测单元和用于监测每个湿度感测单元的状态的公共湿度监视器。 水分监测器可以被配置为提供实时湿度检测信号,用于发信号通知已经发生湿气进入集成电路芯片。

    PHASE-CHANGE TaN RESISTOR BASED TRIPLE-STATE/MULTI-STATE READ ONLY MEMORY
    15.
    发明申请
    PHASE-CHANGE TaN RESISTOR BASED TRIPLE-STATE/MULTI-STATE READ ONLY MEMORY 有权
    基于相位变化的电阻基于三态/多状态只读存储器

    公开(公告)号:US20080197337A1

    公开(公告)日:2008-08-21

    申请号:US12109085

    申请日:2008-04-24

    IPC分类号: H01L47/00

    摘要: The present invention relates to a nonvolatile memory such as, for example a ROM or an EPROM, in which the information density of the memory is increased relative to a conventional nonvolatile memory that includes two logic state devices. Specifically, the nonvolatile memory of the present invention includes a SiN/TaN/SiN thin film resistor embedded within a material having a thermal conductivity of about 1 W/m-K or less; and a non-linear Si-containing device coupled to the resistor. Read and write circuits and operations are also provided in the present application.

    摘要翻译: 本发明涉及诸如ROM或EPROM的非易失性存储器,其中存储器的信息密度相对于包括两个逻辑状态器件的常规非易失性存储器而增加。 具体地,本发明的非易失性存储器包括嵌入在热导率为约1W / m-K以下的材料中的SiN / TaN / SiN薄膜电阻器; 以及耦合到电阻器的非线性含Si器件。 读写电路和操作也在本申请中提供。

    Phase-change TaN resistor based triple-state/multi-state read only memory
    16.
    发明授权
    Phase-change TaN resistor based triple-state/multi-state read only memory 有权
    相变TaN电阻器基于三态/多态只读存储器

    公开(公告)号:US07381981B2

    公开(公告)日:2008-06-03

    申请号:US11161332

    申请日:2005-07-29

    IPC分类号: H01L29/02 H01L47/00

    摘要: The present invention relates to a nonvolatile memory such as, for example a ROM or an EPROM, in which the information density of the memory is increased relative to a conventional nonvolatile memory that includes two logic state devices. Specifically, the nonvolatile memory of the present invention includes a SiN/TaN/SiN thin film resistor embedded within a material having a thermal conductivity of about 1 W/m-K or less; and a non-linear Si-containing device coupled to the resistor. Read and write circuits and operations are also provided in the present application.

    摘要翻译: 本发明涉及诸如ROM或EPROM的非易失性存储器,其中存储器的信息密度相对于包括两个逻辑状态器件的常规非易失性存储器而增加。 具体地,本发明的非易失性存储器包括嵌入在热导率为约1W / m-K以下的材料中的SiN / TaN / SiN薄膜电阻器; 以及耦合到电阻器的非线性含Si器件。 读写电路和操作也在本申请中提供。

    Real-time on-chip EM performance monitoring
    17.
    发明授权
    Real-time on-chip EM performance monitoring 有权
    实时片上EM性能监控

    公开(公告)号:US08890556B2

    公开(公告)日:2014-11-18

    申请号:US13282090

    申请日:2011-10-26

    IPC分类号: G01R31/3187 G01R31/30

    CPC分类号: G01R31/3004

    摘要: An integrated circuit, testing structure, and method for monitoring electro-migration (EM) performance. A method is described that includes method for measuring on-chip electro-migration (EM) performance, including: providing a first on-chip sensor continuously powered with a stress current; providing a second on-chip sensor that is powered only during measurement cycles with a nominal current; obtaining a first resistance measurement from the first on-chip sensor and a second resistance measurement from the second on-chip sensor during each of a series of measurement cycles; and processing the first and second resistance measurements.

    摘要翻译: 用于监测电迁移(EM)性能的集成电路,测试结构和方法。 描述了一种包括用于测量片上电迁移(EM)性能的方法的方法,包括:提供用应力电流连续供电的第一片上传感器; 提供仅在具有额定电流的测量周期期间供电的第二片上传感器; 在一系列测量周期中的每一个期间,从第一片上传感器获得第一电阻测量值和来自第二片上传感器的第二电阻测量值; 并处理第一和第二电阻测量。

    Method and system for assessing reliability of integrated circuit
    18.
    发明授权
    Method and system for assessing reliability of integrated circuit 有权
    评估集成电路可靠性的方法和系统

    公开(公告)号:US08362794B2

    公开(公告)日:2013-01-29

    申请号:US12508111

    申请日:2009-07-23

    IPC分类号: G01R31/02

    摘要: The present invention provides a method. The method includes operating a plurality of field-effect-transistors (FETs) under a first operation condition; reversing an operation direction for at least one of the plurality of FETs for a brief period of time; measuring a second operation condition of the one of the plurality of FETs during the brief period of time; computing a difference between the second operation condition and a reference operation condition; and providing a reliability indicator based upon the difference between the second and the reference operation conditions, wherein the plurality of FETs are employed in a single integrated circuit (IC).

    摘要翻译: 本发明提供一种方法。 该方法包括在第一操作条件下操作多个场效应晶体管(FET); 短时间内反转多个FET中的至少一个的操作方向; 在短时间内测量所述多个FET中的一个的第二操作条件; 计算第二操作条件和参考操作条件之间的差; 以及基于所述第二参考操作条件和所述参考操作条件之间的差异提供可靠性指示器,其中所述多个FET用于单个集成电路(IC)。

    Phase-change TaN resistor based triple-state/multi-state read only memory
    19.
    发明授权
    Phase-change TaN resistor based triple-state/multi-state read only memory 有权
    相变TaN电阻器基于三态/多态只读存储器

    公开(公告)号:US07880158B2

    公开(公告)日:2011-02-01

    申请号:US12109085

    申请日:2008-04-24

    IPC分类号: H01L47/00

    摘要: The present invention relates to a nonvolatile memory such as, for example a ROM or an EPROM, in which the information density of the memory is increased relative to a conventional nonvolatile memory that includes two logic state devices. Specifically, the nonvolatile memory of the present invention includes a SiN/TaN/SiN thin film resistor embedded within a material having a thermal conductivity of about 1 W/m-K or less; and a non-linear Si-containing device coupled to the resistor. Read and write circuits and operations are also provided in the present application.

    摘要翻译: 本发明涉及诸如ROM或EPROM的非易失性存储器,其中存储器的信息密度相对于包括两个逻辑状态器件的常规非易失性存储器而增加。 具体地,本发明的非易失性存储器包括嵌入在热导率为约1W / m-K以下的材料中的SiN / TaN / SiN薄膜电阻器; 以及耦合到电阻器的非线性含Si器件。 读写电路和操作也在本申请中提供。

    Thermo-mechanical cleavable structure
    20.
    发明授权
    Thermo-mechanical cleavable structure 有权
    热机械可切割结构

    公开(公告)号:US08018017B2

    公开(公告)日:2011-09-13

    申请号:US10905905

    申请日:2005-01-26

    IPC分类号: H01L31/058

    摘要: A thermo-mechanical cleavable structure is provided and may be used as a programmable fuse for integrated circuits. As applied to a programmable fuse, the thermo-mechanical cleavable structure includes an electrically conductive cleavable layer adjacent to a thermo-mechanical stressor. As electricity is passed through the cleavable layer, the cleavable layer and the thermo-mechanical stressor are heated and gas evolves from the thermo-mechanical stressor. The gas locally insulates the thermo-mechanical stressor, causing local melting adjacent to the bubbles in the thermo-mechanical stressor and the cleavable structure forming cleaving sites. The melting also interrupts the current flow through the cleavable structure so the cleavable structure cools and contracts. The thermo-mechanical stressor also contracts due to a phase change caused by the evolution of gas therefrom. As the thermo-mechanical cleavable structure cools, the cleaving sites expand causing gaps to be permanently formed therein.

    摘要翻译: 提供了一种热机械可切割结构,可用作集成电路的可编程保险丝。 如应用于可编程保险丝,热机械可切割结构包括与热机械应力源相邻的导电可切割层。 当电通过可切割层时,可切割层和热机械应力器被加热并且气体从热机械应力源逸出。 气体将热机械应力局部绝缘,导致邻近热机械应力的气泡局部熔化,形成裂开位置的可切割结构。 熔化还中断当前通过可切割结构的流动,因此可切割结构冷却和收缩。 热机械应力还由于由其产生的气体引起的相变而收缩。 当热机械可裂解结构冷却时,裂解位置膨胀,导致间隙永久形成。