公开(公告)号：US20100117664A1

公开(公告)日：2010-05-13

申请号：US12597842

申请日：2008-04-23

申请人： Eckhard Schleicher ,  Tobias Sühnel ,  Frank Fischer ,  Hein Futterschneider ,  Dieter Boden

发明人： Eckhard Schleicher ,  Tobias Sühnel ,  Frank Fischer ,  Hein Futterschneider ,  Dieter Boden

IPC分类号： G01R27/08

CPC分类号： G01N27/07

摘要： A grid sensor significantly reduces the complexity of a production process. The cost for installing and running the grid sensor are significantly reduced and the service life, pressure and heat resistance of the grid sensor can be significantly increased over previous grid sensors. Channels, which are wider than the diameter of the wire electrodes and have a depth of less than half the thickness of the sensor board, run outwardly from the edge of the measurement cross section in the sensor board. The channels are coated by a metal layer and the wire electrodes are inserted into the periphery of the measurement cross section. The two ends of the electrode, each in one of the opposite channels, and the electrodes are fixed in the channels by means of a conductive sealing compound. In each channel, the conductive sealing compound terminates in a planar fashion with the upper side of the sensor board, and the sensor board is clamped between two clamping plates.

摘要翻译： 网格传感器显着降低了生产过程的复杂性。 安装和运行电网传感器的成本显着降低，并且网格传感器的使用寿命，压力和耐热性可以比以前的电网传感器显着增加。 通道比导线电极的直径宽，并且具有小于传感器板的厚度的一半的深度，从传感器板中的测量横截面的边缘向外延伸。 通道由金属层涂覆，线电极插入测量横截面的周边。 电极的两端各自在相对的通道之一中，并且电极通过导电密封化合物固定在通道中。 在每个通道中，导电密封化合物以传感器板的上侧的平面方式终止，并且传感器板夹在两个夹紧板之间。

公开(公告)号：US20100002543A1

公开(公告)日：2010-01-07

申请号：US12084477

申请日：2006-11-14

申请人： Roman Schlosser ,  Stefan Weiss ,  Frank Fischer ,  Christoph Schelling

发明人： Roman Schlosser ,  Stefan Weiss ,  Frank Fischer ,  Christoph Schelling

IPC分类号： H04R19/00

CPC分类号： H04R19/005

摘要： A micromechanical structure and a method for producing a micromechanical structure are provided, the micromechanical structure being configured for receiving and/or generating acoustic signals in a medium at least partially surrounding the structure. The structure includes a first counterelement that has first openings and essentially forms a first side of the structure, a second counterelement that has second openings and essentially forms a second side of the structure, and an essentially closed diaphragm disposed between the first counterelement and the second counterelement.

摘要翻译： 提供微机械结构和用于产生微机械结构的方法，所述微机械结构被配置为在至少部分地围绕所述结构的介质中接收和/或产生声信号。 该结构包括具有第一开口并且基本上形成该结构的第一侧面的第一反应体，具有第二开口并且基本上形成该结构的第二侧的第二反应体，以及设置在该第一反应体和该第二反应器之间的基本封闭的隔膜 反数

公开(公告)号：US07495302B2

公开(公告)日：2009-02-24

申请号：US11072859

申请日：2005-03-03

申请人： Frank Fischer ,  Hans Artmann ,  Lars Metzger ,  Arnim Hoechst ,  Julian Gonska

发明人： Frank Fischer ,  Hans Artmann ,  Lars Metzger ,  Arnim Hoechst ,  Julian Gonska

IPC分类号： H01L27/00

CPC分类号： B81B7/0029 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81B2203/0338 ,  B81C2201/0109

摘要： A micromechanical component having a diaphragm is provided, the structure of which effectively prevents the penetration of dirt particles into the cavity. A method for manufacturing such a component is also provided. The structure of the component is implemented in a layer structure which includes at least one first sacrificial layer and a layer system over the first sacrificial layer. A cavity is formed in the first sacrificial layer underneath the diaphragm. In the region of the diaphragm between the upper layer and the lower layer of the layer system situated directly above the first sacrificial layer, at least one access channel to the cavity is formed which has at least one opening in the upper layer and at least one opening in the lower layer, the opening in the upper layer and the opening in the lower layer being offset with respect to each other.

摘要翻译： 提供了具有隔膜的微机械部件，其结构有效地防止了灰尘颗粒进入空腔。 还提供了制造这种部件的方法。 组件的结构以包括至少一个第一牺牲层和第一牺牲层上的层系统的层结构来实现。 在隔膜下方的第一牺牲层中形成空腔。 在位于第一牺牲层正上方的层系统的上层和下层之间的隔膜区域中，形成至少一个到空腔的通道，其在上层中具有至少一个开口，并且至少一个开口 在下层中开口，上层中的开口和下层中的开口相对于彼此偏移。

公开(公告)号：US20080154560A1

公开(公告)日：2008-06-26

申请号：US11960002

申请日：2007-12-19

申请人： Alexander Fink ,  Frank Fischer ,  Gregor Kuchler

发明人： Alexander Fink ,  Frank Fischer ,  Gregor Kuchler

IPC分类号： G06G7/70

CPC分类号： B60C23/007 ,  B60C23/008 ,  B60C23/0408 ,  B60C23/0416 ,  B60C23/044

摘要： A method for stimulating wheel electronics systems of single tires of at least one tire group in a motor vehicle. The wheel electronics systems are stimulated with a low frequency trigger signal, as follows: a trigger signal is emitted from an LF trigger to the wheel electronics systems of the relevant tire group at a variably adjustable first transmission field strength. Radio frequency signals are transmitted from those wheel-side wheel electronics systems, at which a sufficiently high transmission field strength of the trigger signal has arrived containing an item of trigger information, to a vehicle-side receiving unit. A determination is made of the number of RF signals received by the vehicle-side receiving unit, each containing one item of trigger information.

摘要翻译： 一种用于刺激机动车辆中的至少一个轮胎组的单个轮胎的车轮电子系统的方法。 车轮电子系统用低频触发信号进行激励，如下所述：将触发信号从LF触发发射到相关轮胎组的车轮电子系统，并以可变的第一传输场强可调。 从车轮侧车轮电子系统向车辆侧接收单元发送射频信号，在这些车轮侧电子系统中，触发信号的足够高的发射场强度已经到达包含触发信息的项目。 确定由车辆侧接收单元接收的RF信号的数量，每个包含一个触发信息项。

公开(公告)号：US07294894B2

公开(公告)日：2007-11-13

申请号：US10483011

申请日：2002-07-04

申请人： Frank Fischer ,  Peter Hein ,  Eckhard Graf

发明人： Frank Fischer ,  Peter Hein ,  Eckhard Graf

IPC分类号： H01L29/84

CPC分类号： B81B7/0064 ,  B81B2201/0235 ,  B81C1/00269 ,  B81C2203/0118 ,  B81C2203/019 ,  B81C2203/031

摘要： A micromechanical cap structure and a corresponding manufacturing method are described. The micromechanical cap structure includes a first wafer with a micromechanical functional structure, and a second wafer to form a cap over the micromechanical functional structure. The first and second wafers have in their interior a support structure with a metal-semiconductor contact, and in their edge zone a bonding structure. The edge zone of the second wafer, when in the capped state, is arched in relation to the interior of the second wafer.

摘要翻译： 描述了微机械帽结构和相应的制造方法。 微机械帽结构包括具有微机械功能结构的第一晶片和在微机械功能结构上形成盖的第二晶片。 第一和第二晶片在其内部具有金属 - 半导体接触的支撑结构，并且在其边缘区域具有接合结构。 当处于封盖状态时，第二晶片的边缘区域相对于第二晶片的内部是拱形的。

公开(公告)号：US20070255256A1

公开(公告)日：2007-11-01

申请号：US11547537

申请日：2005-03-24

申请人： Frank Fischer ,  Thomas Foster ,  Tracy Willis

发明人： Frank Fischer ,  Thomas Foster ,  Tracy Willis

IPC分类号： A61M25/00

CPC分类号： A61M25/003 ,  A61M3/0283 ,  A61M25/0032 ,  A61M25/0068 ,  A61M25/007 ,  A61M25/0071 ,  A61M25/008 ,  A61M2025/0073

摘要： An irrigation catheter having at least two lumens for supplying irrigation fluid in minimally-invasive surgical procedures is revealed. The catheter works alongside but independently of an endoscope or other diagnostic or therapeutic instrument. The catheter may direct flow of the irrigation fluid in the same direction as the body's natural flow, thus enhancing visualization by the endoscope or other instrument.

摘要翻译： 揭示了具有至少两个腔的灌洗导管，用于在微创外科手术中提供冲洗液。 导管与内窥镜或其他诊断或治疗仪器一起工作，但是独立于内窥镜或其他诊断或治疗仪器。 导管可以引导冲洗流体沿与身体的自然流动相同的方向流动，从而增强内窥镜或其他器械的可视化。

公开(公告)号：US20070214887A1

公开(公告)日：2007-09-20

申请号：US11714955

申请日：2007-03-06

申请人： Frank Fischer ,  Markus Sonnemann

发明人： Frank Fischer ,  Markus Sonnemann

IPC分类号： G01P15/18 ,  G01P15/08

CPC分类号： G01P15/18 ,  G01C21/16 ,  G01D21/02

摘要： A motion sensor includes a substrate at least having one micromechanical acceleration sensor and a magnetoresistive circuit. The micromechanical acceleration sensor and the magnetoresistive circuit are constructed on the same substrate.

摘要翻译： 运动传感器包括至少具有一个微机械加速度传感器和磁阻电路的基板。 微机械加速度传感器和磁阻电路构造在相同的基板上。

公开(公告)号：US07261825B2

公开(公告)日：2007-08-28

申请号：US10522694

申请日：2003-02-21

申请人： Lars Metzger ,  Frank Fischer

发明人： Lars Metzger ,  Frank Fischer

IPC分类号： H01L21/302 ,  C23F1/00

CPC分类号： B81C1/00142 ,  B81B2201/042 ,  B81C2201/0132 ,  G02B26/0833

摘要： A method for producing a micromechanical device, e.g., a micromechanical oscillating mirror device, is provided. It is provided, starting from the front side of an SOI/EOI(epipoly on insulator) substrate, to penetrate to the desired depth of the silicon substrate layer in two successive, separate deep etching steps, and to use this in its upper region that is close to the oxide layer as sacrificial layer for vertically exposing the island structures that are positioned above the oxide layer in the functional layer. The method according to the present invention of a sacrificial layer process for generating large vertical deflections utilizes purely surface micromechanical process steps.

摘要翻译： 提供了一种用于制造微机械装置的方法，例如微机械振荡镜装置。 提供从SOI / EOI（绝缘体上的绝缘体上）的正面开始，在两个连续的，独立的深刻蚀步骤中穿透到硅衬底层的期望深度，并且在其上部区域中使用 靠近氧化层作为用于垂直曝光位于功能层中的氧化物层上方的岛状结构的牺牲层。 根据本发明的用于产生大的垂直偏转的牺牲层工艺的方法利用纯表面微机械工艺步骤。

公开(公告)号：US20070057187A1

公开(公告)日：2007-03-15

申请号：US10528181

申请日：2003-02-27

申请人： Christian Krummel ,  Michael Arndt ,  Michael Saettler ,  Frank Fischer

发明人： Christian Krummel ,  Michael Arndt ,  Michael Saettler ,  Frank Fischer

IPC分类号： G01J5/00

CPC分类号： G01J3/02 ,  G01J3/0256 ,  G01J3/26 ,  G01J5/10 ,  G01J5/602 ,  G01N21/3504 ,  G01N2021/3137 ,  G01N2021/3166 ,  G01N2021/317

摘要： A device for detecting radiation signals and a device for measuring the concentration of a substance are described, a first detector and a second detector being provided on a first chip, and a first filter and a second filter being provided on a second chip, the first chip and the second chip being connected to one another in hermetically sealed fashion.

摘要翻译： 描述了一种用于检测辐射信号的装置和用于测量物质浓度的装置，第一检测器和第二检测器设置在第一芯片上，第一滤波器和第二滤波器设置在第二芯片上，第一 芯片和第二芯片以气密密封的方式彼此连接。

公开(公告)号：US07153718B2

公开(公告)日：2006-12-26

申请号：US10829872

申请日：2004-04-21

申请人： Frank Fischer ,  Peter Hein ,  Eckhard Graf

发明人： Frank Fischer ,  Peter Hein ,  Eckhard Graf

IPC分类号： H01L21/00

CPC分类号： B81C1/00333 ,  B81B7/0006 ,  B81B7/007 ,  B81B2201/0235 ,  B81C2203/0118 ,  B81C2203/019

摘要： A micromechanical component having a substrate beneath at least one structured layer, in the structured layer at least one functional structure being formed, a cap which covers the functional structure, between the cap and the functional structure at least one cavity being formed, and a connecting layer which connects the cap to structured layer, as well as a method for producing the micromechanical component. To obtain a compact and robust component, the connecting layer is formed from an anodically bondable glass, i.e. a bond glass, which has a thickness in the range of 300 nm to 100 μm, which may in particular be in the range of 300 nm to 50 μm.