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11.发明申请公开(公告)号：US20170219668A1
公开(公告)日：2017-08-03
申请号：US15487258
申请日：2017-04-13
Applicant: General Electric Company
IPC: G01R33/385 , G01R33/38
Abstract: A method of manufacturing includes producing a gradient coil assembly having one or more cooling channels for a magnetic resonance imaging system by a process that includes printing a cooling channel template having a first end, a second end, and a hollow passage extending between the first end and the second end, disposing a dielectric material over at least a portion of the cooling channel template to generate a dielectric layer having the cooling channel template, and removing the cooling channel template from the dielectric layer to thereby produce the one or more cooling channels within the dielectric layer such that the one or more cooling channels have a pattern corresponding to a geometry of the cooling channel template.
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公开(公告)号：US11692871B2
公开(公告)日：2023-07-04
申请号：US17530838
申请日：2021-11-19
Applicant: General Electric Company
Inventor： Guanghua Wang , Naveenan Thiagarajan , Todd Garrett Wetzel , Jason Edward Dees , Bernard Patrick Bewlay
CPC classification number: G01J1/0252 , F02C7/12 , G01J5/0088 , G01J5/042 , G01J5/046 , G01J5/049 , G01J5/061 , G05B13/00 , F05D2260/207 , F05D2270/112 , F05D2270/804 , G01J2005/0077
Abstract: An imaging device includes a plurality of electronic components, a phase change material, and a heat transfer structure. The plurality of electronic components is configured to collect data and have a predetermined temperature parameter. The plurality of electronic components is disposed within the phase change material. The phase change material has a first material phase and a second material phase. The phase change material has a first material phase and a second material phase. The phase change material is configured to absorb heat through changing from the first material phase to the second material phase. The heat transfer structure is disposed within the phase change material. The heat transfer structure is configured to conduct heat within the phase change material. The phase change material and the heat transfer structure are further configured to regulate a temperature of the electronic components below the predetermined temperature parameter.
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公开(公告)号：US20200088818A1
公开(公告)日：2020-03-19
申请号：US16134060
申请日：2018-09-18
Applicant: General Electric Company
Inventor： Naveenan Thiagarajan , Derek Allan Seeber , Eric George Budesheim , Charles Critcher , Dominic Michael Graziani
IPC: G01R33/385 , G01R33/421
Abstract: A magnetic resonance imaging (MRI) coil system is provided that includes a gradient coil and a flow inlet. The gradient coil includes a flow channel passing therethrough. The gradient coil defines an eye and an end. The eye is disposed proximate the center of the gradient coil. The flow inlet is disposed along the gradient coil between the eye and the end. Cooling fluid is provided to the gradient coil via the flow inlet, and removed from the gradient coil via the eye and the end.
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公开(公告)号：US20190142378A1
公开(公告)日：2019-05-16
申请号：US16243823
申请日：2019-01-09
Applicant: General Electric Company
Inventor： Warren Lee , Naveenan Thiagarajan
CPC classification number: A61B8/4433 , A61B8/546 , A61B8/56 , H02J7/0027 , H02J7/0044 , H02J7/025 , H02J50/10
Abstract: A docking station for electrically charging and managing a thermal condition of an ultrasound probe is presented. The docking station includes a first charging unit magnetically coupled to an induction unit of the ultrasound probe and configured to charge at least one battery in the ultrasound probe. Further, the docking station includes a first cooling unit thermally coupled to a thermal unit of the ultrasound probe and configured to dissipate heat from the ultrasound probe.
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15.发明授权公开(公告)号：US10206658B2
公开(公告)日：2019-02-19
申请号：US14973739
申请日：2015-12-18
Applicant: General Electric Company
Inventor： Warren Lee , Naveenan Thiagarajan
Abstract: A docking station for electrically charging and managing a thermal condition of an ultrasound probe is presented. The docking station includes a first charging unit magnetically coupled to an induction unit of the ultrasound probe and configured to charge at least one battery in the ultrasound probe. Further, the docking station includes a first cooling unit thermally coupled to a thermal unit of the ultrasound probe and configured to dissipate heat from the ultrasound probe.
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Patent Agency Ranking
公开(公告)号：US09909816B2
公开(公告)日：2018-03-06
申请号：US15271280
申请日：2016-09-21
Applicant: General Electric Company
IPC: H01M10/052 , F28D15/02 , H01M10/659 , F28D15/04 , F28D20/02 , H01L23/34 , H01L23/427 , F28D20/00
CPC classification number: F28D15/0275 , F28D15/02 , F28D15/04 , F28D20/02 , F28D2020/0008 , H01L23/34 , H01L23/4275 , H01M10/052 , H01M10/659 , Y02E60/145
Abstract: A system is disclosed. The system includes a thermally conductive enclosure bounding an interior cavity, a metallic cell wall structure disposed within the cavity, in thermal communication with the enclosure, and defining a plurality of cells, and a phase change material disposed within the cells and in thermal communication with the cell walls. The plurality of cells have a cell width less than about 5 millimeters, and the cell wall thickness of the cell wall structure is in a range from about 0.25 millimeter to about 1 millimeter.
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公开(公告)号：US20220074790A1
公开(公告)日：2022-03-10
申请号：US17530838
申请日：2021-11-19
Applicant: General Electric Company
Inventor： Guanghua Wang , Naveenan Thiagarajan , Todd Garrett Wetzel , Jason Edward Dees , Bernard Patrick Bewlay
Abstract: An imaging device includes a plurality of electronic components, a phase change material, and a heat transfer structure. The plurality of electronic components is configured to collect data and have a predetermined temperature parameter. The plurality of electronic components is disposed within the phase change material. The phase change material has a first material phase and a second material phase. The phase change material has a first material phase and a second material phase. The phase change material is configured to absorb heat through changing from the first material phase to the second material phase. The heat transfer structure is disposed within the phase change material. The heat transfer structure is configured to conduct heat within the phase change material. The phase change material and the heat transfer structure are further configured to regulate a temperature of the electronic components below the predetermined temperature parameter.
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公开(公告)号：US20220069654A1
公开(公告)日：2022-03-03
申请号：US17007003
申请日：2020-08-31
Applicant: General Electric Company
Inventor： Karthik K. Bodla , Naveenan Thiagarajan , Mohamed Osama , John Russell Yagielski , David Allan Torrey , Vandana Prabhakar Rallabandi
Abstract: An electric machine can include a stator core having a plurality of core teeth that define a plurality of core slots in a surface thereof. A winding can be housed at least partially in the core slots. The winding can include a tube defining a channel through at least a portion thereof and one or more wires disposed along a surface of the tube that is opposite the channel. A cooling system can be operably coupled with the channel and configured to move a cooling fluid through the channel.
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公开(公告)号：US11193820B2
公开(公告)日：2021-12-07
申请号：US15401927
申请日：2017-01-09
Applicant: General Electric Company
Inventor： Guanghua Wang , Naveenan Thiagarajan , Todd Garrett Wetzel , Jason Edward Dees , Bernard Patrick Bewlay
Abstract: An infrared imaging device includes a plurality of electronic components, a phase change material, and a heat transfer structure. The plurality of electronic components is configured to collect data and have a predetermined temperature parameter. The plurality of electronic components is disposed within the phase change material. The phase change material has a first material phase and a second material phase. The phase change material has a first material phase and a second material phase. The phase change material is configured to absorb heat through changing from the first material phase to the second material phase. The heat transfer structure is disposed within the phase change material. The heat transfer structure is configured to conduct heat within the phase change material. The phase change material and the heat transfer structure are further configured to regulate a temperature of the electronic components below the predetermined temperature parameter.
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公开(公告)号：US11006549B2
公开(公告)日：2021-05-11
申请号：US16271259
申请日：2019-02-08
Applicant: General Electric Company
Inventor： Brian Magann Rush , Corey Bourassa , Lana Osusky , Karthik Bodla , Hendrik Pieter Jacobus de Bock , Naveenan Thiagarajan
Abstract: A cooling assembly includes a body configured to be placed into thermal contact with a heat source and one or more non-planar, hermetic walls disposed within the body. The one or more non-planar hermetic walls extending around, enclosing, and defining a cooling channel configured to carry cooling fluid through the body such that the cooling fluid contacts internal surfaces of the cooling channel inside the body. The assembly including one or more enhancement structures disposed within the body and coupled with the one or more non-planar hermetic walls. The one or more enhancement structures shaped to change a flow path of the cooling fluid as the cooling fluid moves within the cooling channel and shaped to increase a surface area contacted by the cooling fluid within the cooling channel.
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