EDGE COUPLERS IN THE BACK-END-OF-LINE STACK OF A PHOTONICS CHIP

    公开(公告)号:US20220229250A1

    公开(公告)日:2022-07-21

    申请号:US17151955

    申请日:2021-01-19

    Abstract: Structures including an edge coupler and methods of forming a structure including an edge coupler. The structure includes a waveguide core over a dielectric layer and a back-end-of-line stack over the dielectric layer and the waveguide core. The back-end-of-line stack includes a side edge and a truncated layer that is overlapped with a tapered section of the waveguide core. The truncated layer has a first end surface adjacent to the side edge and a second end surface above the tapered section of the waveguide core. The truncated layer is tapered from the first end surface to the second end surface.

    OPTICAL RING MODULATOR WITH PHOTONIC CRYSTAL

    公开(公告)号:US20220187676A1

    公开(公告)日:2022-06-16

    申请号:US17119042

    申请日:2020-12-11

    Abstract: Embodiments of the disclosure provide an optical ring modulator. The optical ring modulator includes waveguide with a first semiconductor material of a first doping type, and a second semiconductor material having a second doping type adjacent the first semiconductor material. A P-N junction is between the first semiconductor material and the second semiconductor material. A plurality of photonic crystal layers, each embedded within the first semiconductor material or the second semiconductor material, has an upper surface that is substantially coplanar with an upper surface of the waveguide structure.

    METAMATERIAL EDGE COUPLERS IN THE BACK-END-OF-LINE STACK OF A PHOTONICS CHIP

    公开(公告)号:US20220252785A1

    公开(公告)日:2022-08-11

    申请号:US17173639

    申请日:2021-02-11

    Abstract: Structures for an edge coupler and methods of forming a structure for an edge coupler. The structure includes a waveguide core over a dielectric layer, and a back-end-of-line stack over the waveguide core and the dielectric layer. The back-end-of-line stack includes an interlayer dielectric layer, a side edge, a first feature, a second feature, and a third feature laterally arranged between the first feature and the second feature. The first feature, the second feature, and the third feature are positioned on the interlayer dielectric layer adjacent to the side edge, and the third feature has an overlapping relationship with a tapered section of the waveguide core.

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