METHOD AND APPARATUS FOR VIBRATION WELDING
    12.
    发明申请

    公开(公告)号:US20180126483A1

    公开(公告)日:2018-05-10

    申请号:US15344748

    申请日:2016-11-07

    CPC classification number: B23K20/10 B23K20/16

    Abstract: A method and associated device for joining a first workpiece to a second workpiece employing a vibration welder includes placing the first and second workpieces in a lapped arrangement and interposing an adhesive material between contiguous surfaces of the first and second workpieces. A first compressive load is applied to a spot welding locus associated with the lapped arrangement of the first and second workpieces, and then relaxed. A second compressive load is applied to the lapped arrangement of the first and second workpieces simultaneous with applying, via a vibration welder, a vibrational excitation to the spot welding locus associated with the lapped arrangement of the first and second workpieces. The applied vibrational excitation is discontinued, and the second compressive load continues to be applied to the spot welding locus associated with the lapped arrangement of the first and second workpieces for a period of time subsequent thereto.

    SYSTEMS AND METHODS FOR REINFORCED ADHESIVE BONDING

    公开(公告)号:US20170209948A1

    公开(公告)日:2017-07-27

    申请号:US15329191

    申请日:2014-07-28

    Abstract: The present disclosure relates to a method, to distribute a solder-reinforced adhesive on a first substrate (110), comprising (i) positioning the first substrate (110) to receive an adhesive composite (250) including, an adhesive (200) and a plurality of solder balls (300) on a first contact surface (115) of the first substrate (110), (ii) applying, by a distribution nozzle (205), on the first contact surface (115), the adhesive composite (250), and (iii) distributing, by a conductive spreader (520), the adhesive composite (250). The present disclosure further relates to a method to determine electrical resistance of an solder-reinforced adhesive between a first substrate (110) and a second substrate (120), comprising (i) applying, by a distribution nozzle (205), on a first contact surface (115) of the first substrate (110), an adhesive composite (250) including, an adhesive (200) and a plurality of solder balls (300), (ii) positioning, to a portion of the adhesive composite (250) opposite the first contact surface (115), a second contact surface (125) of the second substrate (120), (iii) attaching, to the first substrate (110) and the second substrate (120), at least one electrical resistance detector (550), and (iv) applying, to the first substrate (110) and the second substrate (120), an electrical current.

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