SYSTEMS AND METHODS FOR REINFORCED ADHESIVE BONDING

    公开(公告)号:US20170114252A1

    公开(公告)日:2017-04-27

    申请号:US15302115

    申请日:2014-04-09

    Abstract: A bonding system comprising a first substrate, a first substrate (110) having a first contact surface (115) including a plurality of grooves (140), a second substrate (120) having a second contact surface (125), an adhesive (200) in contact with the first contact surface (115), and the second contact surface (125), and a plurality of solder balls (300) positioned at least partially in the adhesive (200) and in contact with the first contact surface (115). A bonding method comprising applying, on a first contact surface (115) including a plurality of grooves (140) an adhesive (200), positioning, at least partially in the adhesive (200), each of a plurality of solder balls (300), connecting, to a portion of the adhesive (200) opposite the first contact surface (115), a second contact surface (125), and applying heat to the first contact surface (115) such that at least one of the plurality of solder balls (300) reaches a solder-ball bonding temperature whereat the solder ball bonds to the first contact surface (115).

    Method and apparatus for vibration welding

    公开(公告)号:US10150178B2

    公开(公告)日:2018-12-11

    申请号:US15344748

    申请日:2016-11-07

    Abstract: A method and associated device for joining a first workpiece to a second workpiece employing a vibration welder includes placing the first and second workpieces in a lapped arrangement and interposing an adhesive material between contiguous surfaces of the first and second workpieces. A first compressive load is applied to a spot welding locus associated with the lapped arrangement of the first and second workpieces, and then relaxed. A second compressive load is applied to the lapped arrangement of the first and second workpieces simultaneous with applying, via a vibration welder, a vibrational excitation to the spot welding locus associated with the lapped arrangement of the first and second workpieces. The applied vibrational excitation is discontinued, and the second compressive load continues to be applied to the spot welding locus associated with the lapped arrangement of the first and second workpieces for a period of time subsequent thereto.

    Systems And Methods For Reinforced Adhesive Bonding
    4.
    发明申请
    Systems And Methods For Reinforced Adhesive Bonding 审中-公开
    用于增强粘合剂的系统和方法

    公开(公告)号:US20170028679A1

    公开(公告)日:2017-02-02

    申请号:US15302858

    申请日:2014-07-28

    Abstract: The present disclosure relates to a bonding system (100) comprising an adhesive (200), comprising thermoplastic material, in contact with a first contact surface (115) and a second contact surface (125), and a plurality of solder particles (300) positioned in the adhesive (200) in contact with the first contact surface (115). Also, the present disclosure relates to a bonding method to produce a solder-reinforced adhesive bond joining a first substrate (110) and a second substrate (120), comprising applying, on a first contact surface (115) of the first substrate (110), an adhesive (200) comprising thermoplastic material, positioning, at least partially into the adhesive (200), each of a plurality of particles (300), such that each of the plurality of solder balls (300) contacts the first contact surface (115), connecting, to a portion of the adhesive (200) opposite the first contact surface (115), a second contact surface (125) of the second substrate (120), and applying heat to the first contact surface (115) such that each of the plurality of solder particles (300) reaches a solder bonding temperature.

    Abstract translation: 本公开涉及一种粘合系统(100),其包括与第一接触表面(115)和第二接触表面(125)接触的包含热塑性材料的粘合剂(200)和多个焊料颗粒(300) 定位在与第一接触表面(115)接触的粘合剂(200)中。 此外,本公开涉及一种用于生产连接第一基板(110)和第二基板(120)的焊料增强粘合剂粘结的接合方法,包括在第一基板(110)的第一接触表面(115) ),包括热塑性材料的粘合剂(200),至少部分地位于粘合剂(200)中,多个颗粒(300)中的每一个,使得多个焊球(300)中的每一个接触第一接触表面 (115)连接到与第一接触表面(115)相对的粘合剂(200)的一部分,第二基底(120)的第二接触表面(125),并向第一接触表面(115)施加热量, 使得多个焊料颗粒(300)中的每一个达到焊接接合温度。

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