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    DUPLEX FLEXIBLE HEAT EXCHANGER
    11.
    发明申请
    DUPLEX FLEXIBLE HEAT EXCHANGER 有权
    双重灵活热交换器

    公开(公告)号：US20120138269A1

    公开(公告)日：2012-06-07

    申请号：US12959477

    申请日：2010-12-03

    申请人： Maurice F. Holahan ,  Eric V. Kline ,  Paul N. Krystek ,  Michael R. Rasmussen ,  Arvind K. Sinha ,  Stephen M. Zins

    发明人： Maurice F. Holahan ,  Eric V. Kline ,  Paul N. Krystek ,  Michael R. Rasmussen ,  Arvind K. Sinha ,  Stephen M. Zins

    IPC分类号： F28D15/00

    CPC分类号： F28D15/00 ,  F04D13/024 ,  F04D29/586 ,  F28F2250/08 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A method and system for cooling an electrical heat source is disclosed. A heat exchanger has two principal sub-assemblies. A closed-loop fluid flow is provided through a second sub-assembly, disposed next to a heat source. An open-loop fluid flow is provided though a first sub-assembly in communication with a second sub-assembly. Each of the first and second sub-assemblies has a rotational element. The fluid flow entering the first sub-assembly rotates the first rotational element, and magnetic communication between the rotational elements causes movement of the second rotational element, thereby achieving fluid movement within the second sub-assembly. Operationally, the closed-loop sub-assembly removes heat from the heat source and transfers it to the open-loop sub-assembly for subsequent heat transfer in a downstream fluid flow.

    摘要翻译： 公开了一种用于冷却电热源的方法和系统。 热交换器具有两个主要子组件。 通过设置在热源旁边的第二子组件提供闭环流体流。 通过与第二子组件连通的第一子组件提供开环流体流。 第一和第二子组件中的每一个具有旋转元件。 进入第一子组件的流体流使第一旋转元件旋转，并且旋转元件之间的磁连通引起第二旋转元件的移动，从而实现第二子组件内的流体运动。 操作上，闭环子组件从热源移除热量并将其传送到开环子组件，以便在下游流体流中进行随后的热传递。

    Providing Thermal Compensation for Topographic Measurement at an Elevated Temperature Using a Non-Contact Vibration Transducer
    12.
    发明申请
    Providing Thermal Compensation for Topographic Measurement at an Elevated Temperature Using a Non-Contact Vibration Transducer 失效
    使用非接触式振动传感器在高温下提供用于地形测量的热补偿

    公开(公告)号：US20120086952A1

    公开(公告)日：2012-04-12

    申请号：US12898783

    申请日：2010-10-06

    申请人： Arvind K. Sinha

    发明人： Arvind K. Sinha

    IPC分类号： G01B11/24

    CPC分类号： G01B11/24

    摘要： A mechanism for providing thermal compensation when measuring surface topography at an elevated temperature using a non-contact vibration transducer, such as a laser Doppler vibrometer (LDV). Thermal compensation is provided to a detector output signal to correct for thermal diffraction of a reflected portion of a beam of radiant energy directed at a surface of a test object. The thermal compensation is based on a calculated deviation between the detector output signal r2 at an elevated temperature and the detector output signal r1 at approximately room temperature. In one embodiment, the thermal compensation mechanism calculates a stationary signal r3 (t) which represents the detector output signal without noise and corrected for thermal diffraction at the elevated temperature according to the following equation: r 3  ( t ) = lim T → ∞  1 / T  ∫ - t / 2 + t / 2  r 2 *  ( t ) * r 2 *  ( t + Δ   t )    t , wherein T represents the total number of spectrums measured at the elevated temperature at multiple times upon which the compensation is based, and wherein r2*=r2−r2 (baseline).

    摘要翻译： 使用诸如激光多普勒振动计（LDV）的非接触式振动传感器在高温测量表面形貌时提供热补偿的机构。 将热补偿提供给检测器输出信号，以校正指向测试对象表面的辐射能束的反射部分的热衍射。 热补偿基于在升高的温度下的检测器输出信号r2与大约室温下的检测器输出信号r1之间的计算偏差。 在一个实施例中，热补偿机构根据以下等式计算表示无噪声的检测器输出信号的稳定信号r3（t），并根据以下等式对高温下的热衍射进行校正：r 3（t）= lim T→∞ 其中T表示测量的光谱总数，其中T表示测量的光谱总数，其中T表示测量的光谱总数 在补偿所基于的多次的高温下，其中r2 * = r2-r2（基线）。

    Motherboard Assembly for Interconnecting and Distributing Signals and Power
    13.
    发明申请
    Motherboard Assembly for Interconnecting and Distributing Signals and Power 失效
    用于互连和分配信号和电源的主板组件

    公开(公告)号：US20110085313A1

    公开(公告)日：2011-04-14

    申请号：US12579051

    申请日：2009-10-14

    申请人： John L. Colbert ,  Arvind K. Sinha ,  Roger D. Weekly

    发明人： John L. Colbert ,  Arvind K. Sinha ,  Roger D. Weekly

    IPC分类号： H05K1/11 ,  G06F17/50

    CPC分类号： H05K1/144 ,  G11C5/025 ,  H05K1/113 ,  H05K1/114 ,  H05K1/141 ,  H05K3/0058 ,  H05K3/325 ,  H05K2201/044 ,  H05K2201/10378 ,  H05K2201/10545 ,  H05K2201/10719 ,  H05K2201/2009

    摘要： A system, method, and motherboard assembly are described for interconnecting and distributing signals and power between co-planar boards that function as a single motherboard. The motherboard assembly includes a multilayered first printed circuit board having opposed parallel first and second surfaces, each having at least one land grid array (LGA) disposed thereon. The assembly further includes at least one wiring layer (Y) designed to only electrically interconnect components on or within the first PCB, and at least one wiring layer (X) designed to only electrically connect the components on the first PCB to a multilayered second PCB. The multilayered second PCB has opposed parallel first and second surfaces, the first surface having at least one LGA disposed thereon. It further includes at least one wiring layer (V) designed to only electrically interconnect components on or within the second PCB, and at least one layer (X) designed to only electrically interconnect the components on the second PCB with the components on the first PCB. A first LGA interposer couples to the LGA disposed on the first surface of the first PCB, and electrically connects at least one component to the first PCB. A second LGA interposer is sandwiched between and couples to the LGA disposed on the second surface of the first PCB and to the LGA disposed on the first surface of the second PCB. It electrically connects the first PCB to components on the second PCB.

    摘要翻译： 描述了用于在用作单个主板的共面板之间互连和分配信号和功率的系统，方法和主板组件。 主板组件包括具有相对的平行的第一和第二表面的多层第一印刷电路板，每个具有设置在其上的至少一个焊盘格栅阵列（LGA）。 组件还包括至少一个布线层（Y），其被设计成仅电连接第一PCB上或其内部的部件，以及至少一个布线层（X），其设计成仅将第一PCB上的部件电连接到多层第二PCB 。 所述多层第二PCB具有相对的平行的第一和第二表面，所述第一表面具有设置在其上的至少一个LGA。 它还包括至少一个被设计成仅电连接第二PCB上或第二PCB内的组件的布线层（V），以及设计成仅将第二PCB上的部件与第一PCB上的部件电互连的至少一个层（X） 。 第一LGA插入器耦合到布置在第一PCB的第一表面上的LGA，并且将至少一个部件电连接到第一PCB。 第二LGA插入件夹在布置在第一PCB的第二表面上的LGA之间并耦合到布置在第二PCB的第一表面上的LGA。 它将第一个PCB电连接到第二个PCB上的组件。

    Methods for configuring tubing for interconnecting in-series multiple liquid-cooled cold plates
    14.
    发明授权
    Methods for configuring tubing for interconnecting in-series multiple liquid-cooled cold plates 失效
    用于配置串联多个液冷冷板的管道的方法

    公开(公告)号：US07751918B2

    公开(公告)日：2010-07-06

    申请号：US11620088

    申请日：2007-01-05

    申请人： Levi A. Campbell ,  John L. Colbert ,  Michael J. Ellsworth, Jr. ,  Arvind K. Sinha

    发明人： Levi A. Campbell ,  John L. Colbert ,  Michael J. Ellsworth, Jr. ,  Arvind K. Sinha

    IPC分类号： G06F19/00 ,  F25B7/00 ,  H01G4/002 ,  H02B1/00

    CPC分类号： H05K7/20809 ,  G06F1/20

    摘要： Methods of configuring a cooling subassembly for an electronics system are provided, that is, for establishing a coolant-carrying tube layout for interconnecting multiple liquid-cooled cold plates in series-fluid communication for cooling multiple heat-generating electronic components of an electronics system. The electronic components are to be plugged in fixed relation into a preconfigured motherboard, and the tube layout includes at least one rigid coolant-carrying tube. Simplified analysis is initially performed to evaluate stress on the rigid tube(s) and determine if loss of actuation load on the electronic components exceeds an acceptable threshold, and if so, at least one tube having high stress is identified and reconfigured. Thereafter, analysis is performed to determine whether, with available actuation load on the cooling subassembly, electrical connection loading between the electronic components and the supporting motherboard is above an acceptable minimum level. If so, the coolant-carrying tube layout is chosen as a final design.

    摘要翻译： 提供了构造用于电子系统的冷却子组件的方法，即，用于建立冷却剂承载管布局，用于将串联流体通信中的多个液冷冷板互连，以冷却电子系统的多个发热电子部件。 电子部件将以固定关系插入到预配置的主板中，并且管布置包括至少一个刚性的冷却剂输送管。 最初进行简化分析以评估刚性管上的应力，并确定电子部件上的致动负载的损失是否超过可接受的阈值，如果是，则识别和重新配置至少一个具有高应力的管。 此后，执行分析以确定在冷却子组件上的可用致动负载下，电子部件和支撑母板之间的电连接负载是否高于可接受的最低水平。 如果是这样，选择冷却剂载体管布局作为最终设计。

    Heatsink Apparatus for Applying a Specified Compressive Force to an Integrated Circuit Device
    17.
    发明申请
    Heatsink Apparatus for Applying a Specified Compressive Force to an Integrated Circuit Device 有权
    用于将特定压缩力应用于集成电路装置的散热装置

    公开(公告)号：US20080024991A1

    公开(公告)日：2008-01-31

    申请号：US11460334

    申请日：2006-07-27

    申请人： John L. Colbert ,  John S. Corbin ,  Jason R. Eagle ,  Roger Duane Hamilton ,  Amanda E. Mikhail ,  Arvind K. Sinha ,  Terry L. Sobotta

    发明人： John L. Colbert ,  John S. Corbin ,  Jason R. Eagle ,  Roger Duane Hamilton ,  Amanda E. Mikhail ,  Arvind K. Sinha ,  Terry L. Sobotta

    IPC分类号： H05K7/20

    CPC分类号： H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A method and apparatus for applying a specified compressive force by a heat dissipation device for an integrated circuit are given, including placing the integrated circuit device onto a printed circuit board and then placing the heat dissipation device onto the integrated circuit device. The method includes tightening an actuation screw in a spring plate against a portion of the heat dissipation device. The actuation screw may be prevented from being tightened beyond a mechanical constraint corresponding to a pre-set calibration for the specific compressive force, which may be greater than or equal to a minimum compressive force corresponding to the greater of a minimum thermal interface pressure and a minimum contact interface pressure. Additionally, the specific compressive force may be less than or equal to a maximum pressure which may be exerted on the integrated circuit device.

    摘要翻译： 给出了一种通过用于集成电路的散热装置施加特定压缩力的方法和装置，包括将集成电路装置放置在印刷电路板上，然后将散热装置放置在集成电路装置上。 该方法包括将弹簧板中的致动螺钉紧固在散热装置的一部分上。 可以防止致动螺钉被紧固超过对应于对于特定压缩力的预设校准的机械约束，其可以大于或等于对应于较小的最小热界面压力的最小压缩力，并且 最小接触界面压力。 此外，比压缩力可以小于或等于可以施加在集成电路装置上的最大压力。

    A DYNAMIC AIR MOVING SYSTEM
    18.
    发明申请
    A DYNAMIC AIR MOVING SYSTEM 失效
    动态空气移动系统

    公开(公告)号：US20080024983A1

    公开(公告)日：2008-01-31

    申请号：US11461250

    申请日：2006-07-31

    申请人： William J. Anderl ,  Maurice F. Holahan ,  Arvind K. Sinha ,  Gregory S. Vande Corput

    发明人： William J. Anderl ,  Maurice F. Holahan ,  Arvind K. Sinha ,  Gregory S. Vande Corput

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20836 ,  H05K7/20727

    摘要： Disclosed is a dynamic air moving system comprising a rail system disposed in an electronic enclosure, at least one fan housing moveably disposed on the rail system, the fan being actuatable along the rail system, a pivotable fan disposed in each of the at least one fan housings, at least one blade included with the fan, the at least one blade being rotatable about at least one blade axes, a fan controller chip controlling actuation of at least one fan housing, individual rotation of at least one blade, and rotation of the fan, a chip thermal sensor disposed on at least one chip located in the electronic enclosure, the thermal sensor being linked to the fan controller chip, and a drive thermal sensor disposed on at least one disk drive associated with the electronic enclosure, the drive thermal sensor being linked to the fan controller chip.

    摘要翻译： 公开了一种动态空气移动系统，其包括设置在电子外壳中的轨道系统，至少一个风扇壳体，其可移动地设置在轨道系统上，风扇可沿轨道系统致动，可枢转风扇设置在每个至少一个风扇 壳体，包括在风扇中的至少一个叶片，所述至少一个叶片可围绕至少一个叶片轴线旋转;风扇控制器芯片，其控制至少一个风扇壳体的致动，至少一个叶片的单独旋转， 风扇，设置在位于电子外壳中的至少一个芯片上的芯片热传感器，热传感器连接到风扇控制器芯片，以及设置在与电子外壳相关联的至少一个磁盘驱动器上的驱动热传感器，驱动热 传感器连接到风扇控制器芯片。

    Land grid array socket actuation hardware for MCM applications
    20.
    发明授权
    Land grid array socket actuation hardware for MCM applications 有权
    用于MCM应用的Land Grid阵列插座致动硬件

    公开(公告)号：US06475011B1

    公开(公告)日：2002-11-05

    申请号：US09948195

    申请日：2001-09-07

    申请人： Arvind K. Sinha ,  Roger D. Hamilton ,  John L. Colbert ,  John S. Corbin, Jr. ,  Danny E. Massey

    发明人： Arvind K. Sinha ,  Roger D. Hamilton ,  John L. Colbert ,  John S. Corbin, Jr. ,  Danny E. Massey

    IPC分类号： H01R1362

    CPC分类号： H05K3/325 ,  H01R43/205

    摘要： An apparatus for applying force to a multi-chip module, a printed wiring board and an interposer to facilitate electrical contact there-between, includes a plurality of load posts, a load transfer plate, a spring member, a backside stiffener plate and a spring actuator. The load posts are affixed to the multi-chip module and pass through the printed wiring board. The load transfer plate has a first stiffness. The spring member is disposed adjacent the load transfer plate and has a second stiffness that is less than the first stiffness. The a backside stiffener plate is disposed between the spring member and the printed wiring board and has a third stiffness that is greater than the second stiffness. The spring actuator engages the spring member to apply force to the backside stiffener plate, causing the substrate, the interposer and the printed wiring board to be held in contact.

    摘要翻译： 一种用于向多芯片模块施加力的装置，印刷线路板和插入件，以便于其间的电接触，包括多个负载柱，负载传递板，弹簧构件，后侧加强板和弹簧 执行器。 负载柱固定在多芯片模块上并通过印刷电路板。 载荷传递板具有第一刚度。 弹簧构件设置在负载传递板附近并且具有小于第一刚度的第二刚度。 背面加强板设置在弹簧构件和印刷线路板之间，并且具有大于第二刚度的第三刚度。 弹簧致动器接合弹簧构件以向后侧加强板施加力，使得基板，插入器和印刷线路板保持接触。