公开(公告)号：US20210074677A1

公开(公告)日：2021-03-11

申请号：US16567766

申请日：2019-09-11

Applicant: Google LLC

Inventor： Woon-Seong Kwon ,  Namhoon Kim ,  Teckgyu Kang ,  Ryohei Urata

IPC: H01L25/065 ,  G02B6/42 ,  H01L23/538 ,  H01L23/498

Abstract: The technology relates to an integrated circuit (IC) package. The IC package may include a substrate. An IC die may be mounted to the substrate. One or more photonic modules may be attached to the substrate and one or more serializer/deserializer (SerDes) interfaces may connect the IC die to the one or more photonic modules. The IC die may be an application specific integrated circuit (ASIC) die and the one or more photonic modules may include a photonic integrated circuit (PIC) and fiber array. The one or more photonic modules may be mounted to one or more additional substrates which may be attached to the substrate via one or more sockets.

公开(公告)号：US10818567B2

公开(公告)日：2020-10-27

申请号：US16358203

申请日：2019-03-19

Applicant: Google LLC

Inventor： Woon Seong Kwon ,  Ryohei Urata ,  Teckgyu Kang

IPC: H01L23/495 ,  H01L23/29 ,  H01L23/31 ,  H01L23/498 ,  H01L25/065 ,  H01L23/00 ,  H01L21/56 ,  H01L23/538

Abstract: Integrated circuit substrates having features for containing liquid adhesive, and methods for fabricating such substrates, are provided. A device can include a first substrate layer and a second substrate layer adhered to the first substrate layer such that a portion of the top surface of the first substrate layer is exposed to define a bottom of a cavity, and an edge of the second substrate layer adjacent to the exposed top surface of the first substrate layer defines an edge of the cavity. The device can include an integrated circuit die adhered to the exposed top surface of first substrate layer with a liquid adhesive. The first substrate layer can define a trench in the bottom of the cavity between a region of the integrated circuit die and the edge of the cavity such that the trench can receive bleed-out of the liquid adhesive from between the integrated circuit die and the top surface of the first substrate layer.

公开(公告)号：US10788632B2

公开(公告)日：2020-09-29

申请号：US16261211

申请日：2019-01-29

Applicant: Google LLC

Inventor： Daoyi Wang ,  Lieven Verslegers ,  Ryohei Urata

IPC: G02B6/42

Abstract: A photonic integrated circuit for coupling a laser from an optical assembly to a grating coupler is disclosed. A method for coupling a laser to a photonic integrated circuit is disclosed. The optical assembly includes an optical system disposed on a v-groove bench. The optical system typically includes a laser source, a coupling lens or lens system, an optional isolator, a beam redirector that includes a prism or other light turning element and a cylindrical tube mounted on the v-groove bench. The method of tuning the angle of incidence from the optical assembly to the grating coupler is also disclosed.

公开(公告)号：US20190171029A1

公开(公告)日：2019-06-06

申请号：US15975268

申请日：2018-05-09

Applicant: Google LLC

Inventor： Ryohei Urata ,  Lieven Verslegers ,  Hong Liu ,  Daoyi Wang

IPC: G02B27/28 ,  G02B6/10 ,  G02B6/126 ,  G02B27/09

Abstract: A photonic integrated circulator can be fabricated by including a plurality of polarizing beam splitters and optical polarization rotators such that two copies of the optical signal are output at a receiver in substantially aligned polarization states. The circulator can be used for facilitating bi-directional communications between photonic integrated circuit devices, which are inherently polarization sensitive, while reducing signal loss.

公开(公告)号：US12255692B2

公开(公告)日：2025-03-18

申请号：US18196783

申请日：2023-05-12

Applicant: Google LLC

Inventor： Xiang Zhou ,  Cedric F. Lam ,  Ryohei Urata ,  Hong Liu

IPC: H04B10/60 ,  H04B10/532 ,  H04B10/548 ,  H04B10/40 ,  H04B10/61 ,  H04J14/06

Abstract: Coherent optical communications technology for recovery of 1D and 2D formatted optical signals. For example, 1D or 2D formatted signals that travel through fiber optic media may be recovered by separating the light into X- and Y-polarization components, rotating one polarization component (e.g., Y-component) into the polarization space of the other component (e.g., Y-component into the X-polarization space), delaying the rotated component enough to avoid destructive interference and combining the delayed component with the undelayed component to form a folded optical signal, which may then be processed as a X-polarized signal.

公开(公告)号：US20240213215A1

公开(公告)日：2024-06-27

申请号：US18596076

申请日：2024-03-05

Applicant: Google LLC

Inventor： Woon-Seong Kwon ,  Nam Hoon Kim ,  Teckgyu Kang ,  Ryohei Urata

IPC: H01L25/065 ,  G02B6/42 ,  H01L23/31 ,  H01L23/367 ,  H01L23/498 ,  H01L23/538 ,  H01L25/04 ,  H01L25/075 ,  H01L25/16 ,  H01L31/12 ,  H10K39/00

CPC classification number: H01L25/0652 ,  G02B6/4257 ,  H01L23/3121 ,  H01L23/3672 ,  H01L23/49805 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/5385 ,  H01L23/5386 ,  H01L25/162 ,  H01L25/041 ,  H01L25/075 ,  H01L25/167 ,  H01L31/12 ,  H01L2225/06517 ,  H10K39/601

Abstract: The technology relates to an integrated circuit (IC) package. The IC package may include a substrate. An IC die may be mounted to the substrate. One or more photonic modules may be attached to the substrate and one or more serializer/deserializer (SerDes) interfaces may connect the IC die to the one or more photonic modules. The IC die may be an application specific integrated circuit (ASIC) die and the one or more photonic modules may include a photonic integrated circuit (PIC) and fiber array. The one or more photonic modules may be mounted to one or more additional substrates which may be attached to the substrate via one or more sockets.

公开(公告)号：US20240137674A1

公开(公告)日：2024-04-25

申请号：US18537005

申请日：2023-12-12

Applicant: Google LLC

Inventor： Jill Berger ,  Kevin Yasumura ,  Xiang Zhou ,  Pedram Z. Dashti ,  Ryohei Urata

IPC: H04Q11/00 ,  G02B6/35 ,  G02B26/08 ,  G02B27/30 ,  H04B10/071 ,  H04B10/079

CPC classification number: H04Q11/0005 ,  G02B6/3518 ,  G02B26/0833 ,  G02B27/30 ,  H04B10/071 ,  H04B10/0795 ,  H04Q2011/003 ,  H04Q2011/0039

Abstract: An optical links diagnostic system (LDS) and its operation within an optical circuit switch (OCS) for measurement and diagnosis of fiber-optic network fiber performance and quality is disclosed. The LDS can contain two photodetectors, a laser source, and be coupled to an OCS. Optical circulators can further be linked to the OCS. The LDS can be used both as an optical time domain reflectometer (OTDR) or as an optical return loss (ORL) meter and can automate the diagnosis of the fiber optical network fiber insertion loss and return loss.

公开(公告)号：US20230305243A1

公开(公告)日：2023-09-28

申请号：US18203302

申请日：2023-05-30

Applicant: Google LLC

Inventor： Daoyi Wang ,  Ryohei Urata ,  Lieven Verslegers ,  Jan Petykiewicz

IPC: G02B6/42 ,  G02B6/12 ,  G02B6/30

CPC classification number: G02B6/4242 ,  G02B6/12 ,  G02B6/30 ,  G02B6/423 ,  G02B6/4249

Abstract: A system for passive alignment of fibers to an interface of a photonic integrated circuit (PIC) includes an input frame, an actuator, and an output frame. The actuator arranged to apply force along a force axis to the input frame. The output frame including a tip for picking up a plate and transferring the force thereto, the output frame being connected to the input frame such that the output frame may tilt relative to the input frame and the output frame is elastically biased relative to the input frame into a position wherein the tip is aligned on the force axis.

公开(公告)号：US20220381975A1

公开(公告)日：2022-12-01

申请号：US17330512

申请日：2021-05-26

Applicant: Google LLC

Inventor： Lieven Verslegers ,  Ryohei Urata ,  Mohammad Sotoodeh ,  Liming Wang

IPC: G02B6/124 ,  G02B6/34 ,  H04B10/40

Abstract: A photonic integrated circuit (PIC) includes one or more couplers to interface a light source with the PIC, a splitter directly coupled to the one or more couplers at a coupling point of the PIC, a modulator to receive light from the couplers, and a connecting waveguide to connect the splitter to the modulator. The waveguide may be a rib waveguide. The PIC may be integrated with devices such as a CWDM or a PSM device, and may provide improved performance and lower attention for high optical power applications.

公开(公告)号：US11340468B2

公开(公告)日：2022-05-24

申请号：US16985301

申请日：2020-08-05

Applicant: Google LLC

Inventor： Ryohei Urata ,  Lieven Verslegers ,  Hong Liu ,  Daoyi Wang

IPC: G02B27/28 ,  G02B27/09 ,  G02B6/126 ,  G02B6/10 ,  G02B6/27 ,  G02F1/09 ,  G02B5/30 ,  G02B6/42

Abstract: A photonic integrated circulator can be fabricated by including a plurality of polarizing beam splitters and optical polarization rotators such that two copies of the optical signal are output at a receiver in substantially aligned polarization states. The circulator can be used for facilitating bi-directional communications between photonic integrated circuit devices, which are inherently polarization sensitive, while reducing signal loss.