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公开(公告)号：US5194880A
公开(公告)日：1993-03-16
申请号：US632260
申请日：1990-12-21
IPC分类号： B41J2/065
CPC分类号： B41J2/065
摘要： An ejector for ejecting droplets from an ink-filled reservoir is disclosed. The ejector comprises a substrate with a generally planar surface. The substrate is submerged in the reservoir so that the substrate surface is parallel to the reservoir surface at a shallow predetermined depth. On the substrate surface around a center is a plurality of concentric, circular electrodes. A coupled oscillator excites the electrodes in a temporal relationship such that the capillary waves generated at the ink reservoir surface are reinforced so that droplets may be ejected from the reservoir at the center of the electrodes.
摘要翻译： 公开了一种用于从填充墨水的储存器喷射液滴的喷射器。 喷射器包括具有大致平坦表面的基板。 将基板浸没在储存器中，使得基板表面在浅预定深度处平行于储存器表面。 在中心周围的基板表面上是多个同心圆形电极。 耦合振荡器以时间关系激发电极，使得在墨水储存器表面处产生的毛细管波被加强，使得液滴可以从电极中心处的储存器喷出。
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12.发明授权Fabrication of integrated acoustic ink printhead with liquid level control and device thereof 失效具有液位控制的集成声学油墨打印头的制造及其装置
公开(公告)号：US5111220A
公开(公告)日：1992-05-05
申请号：US640661
申请日：1991-01-14
CPC分类号： B41J2/14008
摘要： A method of fabricating an acoustic ink printhead with an integrated liquid level control layer is presented. With standard photolithographic techniques, acoustic lenses and ink supply channels are defined in a substrate. Apertures are created in a spacer layer plate to define cavities to hold the ink reservoirs for each ejector. Corresponding alignment holes also made in the substrate and in the spacer layer plate. With spheres matching the size of the alignment holes, the spheres engage the alignment holes to precisely align the apertures in the spacer layer plate with the acoustic lenses in the substrate. The plate and substrate are then bonded for an integrated acoustic printhead with liquid level control by capillary action.
摘要翻译： 提出了一种制造具有集成液位控制层的声学墨水打印头的方法。 在标准光刻技术中，声透镜和供墨通道被限定在基板中。 在间隔层板中产生孔以限定用于保持每个喷射器的油墨储存器的空腔。 在衬底和间隔层板中也制成相应的对准孔。 利用与对准孔的尺寸匹配的球体，球体与对准孔接合，以使间隔层板中的孔与衬底中的声透镜精确对准。 然后通过毛细作用将板和衬底粘合用于具有液位控制的集成声学打印头。
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公开(公告)号：US5077695A
公开(公告)日：1991-12-31
申请号：US434236
申请日：1989-11-13
CPC分类号： B82Y15/00 , G01N29/06 , G01N29/221 , G01S15/8906
摘要： An acoustic microscope in which acoustic energy is focused onto a membrane which includes an aperture which is a fraction of the size of the focal spot of the acoustic beam at the membrane to form fringing fields on the other side of the membrane. Acoustic energy reflected from the membrane is detected. An object to be examined is placed in cooperative relationship with the fringing fields.
摘要翻译： 一种声学显微镜，其中声能聚焦在膜上，该膜包括孔，该孔是膜的声束的焦点尺寸的一部分，以在膜的另一侧上形成边缘场。 检测从膜反射的声能。 被检查对象与边缘领域保持合作关系。
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公开(公告)号：US20120259249A1
公开(公告)日：2012-10-11
申请号：US13441650
申请日：2012-04-06
CPC分类号： A61N7/022 , A61B8/0808
摘要： Focused ultrasound is a promising technology for neural stimulation that is non-invasive, and capable of passing through the skull. Here we use the isolated retina to characterize the effect of ultrasound on an intact neural circuit and compared these effects to those of visual stimulation of the same retinal ganglion cells. Ultrasound stimuli evoked precise, stable responses that looked qualitatively similar to strong visual responses but with shorter latency. We found that ultrasonic stimulation activates cells presynaptic to ganglion cells, which may include photoreceptors and interneurons. Ultrasonic stimulation is an effective and spatial-temporally precise method to activate the retina. Ultrasonic stimulation may have diagnostic potential to probe remaining retinal function in cases of photoreceptor degeneration, and therapeutic potential for use in a retinal prosthesis. In addition, ultrasound promises to be a useful tool to understand the dynamic activity in the interneuron population of the retina.
摘要翻译： 聚焦超声波是一种有前途的神经刺激技术，非侵入性，能够通过颅骨。 在这里，我们使用孤立的视网膜来表征超声对完整神经回路的影响，并将这些效应与同一视网膜神经节细胞的视觉刺激相比较。 超声刺激诱发精确，稳定的反应，看起来质地与强视觉反应相似，但延迟较短。 我们发现超声波刺激激活细胞突触前神经节细胞，其可能包括光感受器和中间神经元。 超声波刺激是激活视网膜的有效和时空精确的方法。 在光感受器变性的情况下，超声波刺激可能具有探测剩余视网膜功能的诊断潜力，以及用于视网膜假体的治疗潜力。 此外，超声波有助于了解视网膜中间神经元群体的动态活动。
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公开(公告)号：US07843022B2
公开(公告)日：2010-11-30
申请号：US12288344
申请日：2008-10-17
IPC分类号： H01L29/84
CPC分类号： H02N1/008 , B06B1/0292 , Y10T29/49005
摘要： A high temperature micromachined ultrasonic transducer (HTCMUT) is provided. The HTCMUT includes a silicon on insulator (SOI) substrate having a doped first silicon layer, a doped second silicon layer, and a first insulating layer disposed between the first and second silicon layers. A cavity is disposed in the first silicon layer, where a cross section of the cavity includes a horizontal cavity portion on top of vertical cavity portions disposed at each end of the horizontal cavity portion, and the vertical cavity portion spans from the first insulating layer through the first silicon layer, such that a portion of the first silicon layer is isolated by the first insulating layer and the cavity. A membrane layer is disposed on the first silicon layer top surface, and spans across the cavity. A bottom electrode is disposed on the bottom of the second silicon layer.
摘要翻译： 提供了一种高温微加工超声波换能器（HTCMUT）。 HTCMUT包括具有掺杂的第一硅层，掺杂的第二硅层和设置在第一和第二硅层之间的第一绝缘层的绝缘体上硅（SOI）衬底。 空腔设置在第一硅层中，其中空腔的横截面包括在设置在水平空腔部分的每个端部处的垂直空腔部分的顶部上的水平空腔部分，并且垂直空腔部分从第一绝缘层穿过 第一硅层，使得第一硅层的一部分被第一绝缘层和空腔隔离。 膜层设置在第一硅层顶表面上，跨越空腔。 底部电极设置在第二硅层的底部。
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16.发明申请公开(公告)号：US20100225200A1
公开(公告)日：2010-09-09
申请号：US12660807
申请日：2010-03-03
CPC分类号： B06B1/0292 , Y10T29/49005
摘要： Low temperature wafer bonding (temperature of 450° C. or less) is employed to fabricate CMUTs on a wafer that already includes active electrical devices. The resulting structures are CMUT arrays integrated with active electronics by a low-temperature wafer bonding process. The use of a low-temperature process preserves the electronics during CMUT fabrication. With this approach, it is not necessary to make compromises in the CMUT or electronics designs, as is typical of the sacrificial release fabrication approach. Various disadvantages of sacrificial release, such as low process control, poor design flexibility, low reproducibility, and reduced performance are avoided with the present approach. With this approach, a CMUT array can be provided with per-cell electrodes connected to the substrate integrated circuitry. This enables complete flexibility in electronically assigning the CMUT cells to CMUT array elements.
摘要翻译： 采用低温晶片接合（450℃或更低的温度）在已包括有源电气设备的晶片上制造CMUT。 所得到的结构是通过低温晶片结合工艺与有源电子器件集成的CMUT阵列。 在CMUT制造期间使用低温过程保留电子元件。 采用这种方法，就像在牺牲释放制造方法中一样，不需要在CMUT或电子设计中做出妥协。 本方法避免了牺牲释放的各种缺点，如低过程控制，设计灵活性差，再现性低，性能下降。 利用这种方法，可以提供连接到衬底集成电路的每个单元电极的CMUT阵列。 这使得能够将CMUT单元电子分配给CMUT阵列元件的完全灵活性。
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17.发明授权High quality factor resonators for liquid immersion biological and chemical sensors 失效液体生物和化学传感器的高品质因子谐振器公开(公告)号：US07694552B2
公开(公告)日：2010-04-13
申请号：US12069730
申请日：2008-02-11
CPC分类号： G01N29/022 , G01N2291/014 , G01N2291/02466
摘要： A mechanical resonator capable of providing an intrinsically high mechanical quality factor in immersion is provided. The resonator includes a membrane attached at its perimeter to a frame, such that a front side of the membrane is in contact with the liquid, and the back side of the membrane is not in contact with the liquid or the frame. The membrane can act as a mechanical resonator. The quality factor of this resonator is enhanced by providing a pressure release boundary region on the frame in proximity to the membrane and in contact with the liquid. The pressure release boundary region provides a soft boundary condition, in the sense that a mechanical impedance on the solid side of the solid-liquid interface is less than the liquid mechanical impedance. Providing such a soft boundary condition reduces the mechanical energy loss due to excitation of waves in the liquid, thereby improving resonator quality factor. Such high-Q resonators are particularly useful for sensor applications.
摘要翻译： 提供一种能够提供本质上高的浸入机械品质因子的机械谐振器。 谐振器包括在其周边附接到框架的膜，使得膜的前侧与液体接触，并且膜的背面不与液体或框架接触。 膜可以用作机械谐振器。 通过在框架上靠近膜并与液体接触来提供压力释放边界区域来增强该谐振器的品质因数。 压力释放边界区域提供了软边界条件，这在固体 - 液体界面的固体侧的机械阻抗小于液体机械阻抗的意义上。 提供这样的软边界条件降低了由于液体中的波的激发引起的机械能损失，从而改善了谐振器品质因数。 这种高Q谐振器对于传感器应用特别有用。
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18.发明授权Capacitive micromachined ultrasonic transducer array with through-substrate electrical connection and method of fabricating same 有权具有贯通衬底电气连接的电容式微加工超声波换能器阵列及其制造方法公开(公告)号：US07545075B2
公开(公告)日：2009-06-09
申请号：US11144184
申请日：2005-06-04
CPC分类号： B06B1/0292
摘要： The embodiments of the present invention provide a CMUT array and method of fabricating the same. The CMUT array has CMUT elements individually or respectively addressable from a backside of a substrate on which the CMUT array is fabricated. In one embodiment, a CMUT array is formed on a front side of a very high conductivity silicon substrate. Through wafer trenches are etched into the substrate from the backside of the substrate to electrically isolate individual CMUT elements formed on the front side of the substrate. Electrodes are formed on the backside of the substrate to individually address the CMUT elements through the substrate.
摘要翻译： 本发明的实施例提供了一种CMUT阵列及其制造方法。 CMUT阵列具有单独地或分别可从其上制造CMUT阵列的衬底的背面寻址的CMUT元件。 在一个实施例中，CMUT阵列形成在非常高导电性的硅衬底的正面上。 通过晶片沟槽从衬底的背面蚀刻到衬底中以电隔离形成在衬底前侧上的各个CMUT元件。 电极形成在衬底的背面，以通过衬底单独地寻址CMUT元件。
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公开(公告)号：US07305883B2
公开(公告)日：2007-12-11
申请号：US11543550
申请日：2006-10-04
IPC分类号： G01N29/036
CPC分类号： G01N27/221 , G01N1/26 , G01N2001/022 , G01N2291/02863 , G01N2291/0427
摘要： The present invention provides sensors based on micromachined ultrasonic transducer technology. The sensors preferably include a plurality of sensor elements, but may include only one sensor element. Arrays of sensors are also provided. Sensor elements include a functionalized membrane supported over a substrate by a support frame. The functionalized membrane, support frame and substrate together form a vacuum gap. The sensor element is connected to an electrical circuit, which is configured to operate the sensor element at or near an open circuit resonance condition. The mechanical resonance frequency of the functionalized membrane is responsive to binding of an agent to the membrane. Thus, the sensor element also includes a detector, where the detector provides a sensor output responsive to the mechanical resonance frequency of the sensor element.
摘要翻译： 本发明提供了基于微加工超声换能器技术的传感器。 传感器优选地包括多个传感器元件，但是可以仅包括一个传感器元件。 还提供了传感器阵列。 传感器元件包括通过支撑框架支撑在衬底上的功能化膜。 功能化膜，支撑框架和基板一起形成真空间隙。 传感器元件连接到电路，该电路构造成在开路谐振状态或接近开路谐振条件下操作传感器元件。 功能化膜的机械共振频率响应于试剂与膜的结合。 因此，传感器元件还包括检测器，其中检测器响应于传感器元件的机械共振频率提供传感器输出。
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公开(公告)号：US5469742A
公开(公告)日：1995-11-28
申请号：US28331
申请日：1993-03-09
CPC分类号： G01B17/025 , G01K11/22 , G01N29/041 , G01N2291/011 , G01N2291/0237 , G01N2291/02854 , G01N2291/02881 , G01N2291/0421 , G01N2291/0422 , G01N2291/105 , G01N2291/2632
摘要： An acoustic temperature and/or film thickness monitoring system for semiconductor wafers in which the velocity of acoustic waves in the wafer is employed to measure temperature and/or thickness.
摘要翻译： 用于半导体晶片的声温度和/或膜厚监测系统，其中采用晶片中的声波速度来测量温度和/或厚度。
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