-
公开(公告)号：US11593052B1
公开(公告)日：2023-02-28
申请号：US17855238
申请日：2022-06-30
Applicant: Hewlett Packard Enterprise Development LP
Inventor： Vincent W. Michna , Peter Alexander Hansen , Quoc Hung C. Vu
IPC: G06F3/14 , G06F3/0489 , G06F3/0354 , G06F3/0482 , G06F13/42 , G06F13/38 , G06F3/023
Abstract: An apparatus comprises a switch and nodes coupled to the switch. Each node does not include an integrated video controller and transmits data to the switch via a USB and a serial connection. The switch comprises a controller which stores video output generated based on data received via serial connections. The controller: receives a user selection for a first node; transmits the user selection to a first multiplexer; retrieves a first video output generated based on data received via the corresponding serial connection; and transmits the first video output to a second multiplexer. The first multiplexer transmits USB data received from the first node to the second multiplexer. If the first node is in a pre-boot environment, the second multiplexer selects the first video output for transmission. If the first node is in a post-boot environment, the second multiplexer selects the data received from the first node for transmission.
-
公开(公告)号：US11289857B2
公开(公告)日：2022-03-29
申请号：US16368809
申请日：2019-03-28
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Nilashis Dey , Vincent W. Michna , Patrick Raymond
Abstract: An example electrical connector includes a magnetic core embedded in the overmold and encircling conductive paths therein and a Hall-effect sensor embedded in the overmold and configured to sense a magnetic field of the magnetic core. The Hall-effect sensor generates an output that indicates whether or not the supply current flowing through the connector matches the return current flowing through the connector, and this output may be used to detect stray-current faults in which current bypasses the connector to return via alternative paths such as through a device chassis. The connector may include one or more supply wires embedded in the overmold, one or more return wires embedded in the overmold, one or more supply terminals embedded in the overmold and terminating the supply wires, and one or more return terminals embedded in the overmold and terminating the return wires. The magnetic core embedded in the overmold may encircle (a) the supply terminals or the supply wires or both, and (b) the return terminals or the return wires or both.
-
公开(公告)号：US11251603B2
公开(公告)日：2022-02-15
申请号：US16190769
申请日：2018-11-14
Applicant: Hewlett Packard Enterprise Development LP
Inventor： Vincent W. Michna , David G. Carpenter , Patrick Raymond
Abstract: Systems and methods are provided for providing thermal protection to a power backplane printed circuit board. A distributed hotspot detection grid is included in the printed circuit board, the distributed hotspot detection grid comprising a plurality of passive temperature sensors spread across the printed circuit board to measure temperature increases. The plurality of passive temperature sensors are connected to a detection circuit for comparing signals from the passive temperature sensors to a reference signal. If the temperature increases on the PCB, electrical characteristics of at least one passive temperature sensor will change, resulting in a change of the input signal to the detection circuit. When the threshold is exceeded (indicating a potential short circuit or hotspot), the detection circuit outputs a shut down signal to the one or more power supplies connected to the of the backplane printed circuit board, to avoid catastrophic damage to the printed circuit board.
-
公开(公告)号：US20230359256A1
公开(公告)日：2023-11-09
申请号：US18330578
申请日：2023-06-07
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： David Scott Chialastri , Vincent W. Michna , Nilashis Dey , Yasir Jamal
CPC classification number: G06F1/206 , G06F1/26 , G06F11/3058
Abstract: A compute device may include one or more processors operable at variable performance levels depending upon power supplied from a compute device power supply. A baseboard management controller of the compute device may periodically calculate an adjustment value for the power supply to adjust the power delivered to the one or more processors. The adjustment value may be calculated as a function of a thermal margin between the temperature of the one or more processors over time and a thermal operating limit of the one or more processors.
-
公开(公告)号：US11644879B2
公开(公告)日：2023-05-09
申请号：US17466762
申请日：2021-09-03
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Vincent W. Michna , Nilashis Dey
CPC classification number: G06F1/26 , G06F1/181 , G06F1/189 , H05K7/1492
Abstract: Example implementations relate to a power control system for controlling transmission of power from one or more power supply devices to one or more loads of a modular server enclosure. The power control system includes an electronic fuse and a threshold control unit. The electronic fuse is connected between one or more loads and the one or more power supply devices of the modular server enclosure. The threshold control unit is connected to the electronic fuse and to the one or more power supply devices. The threshold control circuit dynamically adjusts a threshold current for the electronic fuse based on a power supply capacity of the one or more power supply devices. The electronic fuse controls the transmission of the power from the one or more power supply devices to the one or more loads based on threshold current and a load current drawn by the one or more loads.
-
Patent Agency Ranking
公开(公告)号：US20200313365A1
公开(公告)日：2020-10-01
申请号：US16368809
申请日：2019-03-28
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Nilashis Dey , Vincent W. Michna , Patrick Raymond
IPC: H01R13/66 , H01R13/717 , H02H7/20 , H02H1/00 , G01R31/40
Abstract: An example electrical connector includes a magnetic core embedded in the overmold and encircling conductive paths therein and a Hall-effect sensor embedded in the overmold and configured to sense a magnetic field of the magnetic core. The Hall-effect sensor generates an output that indicates whether or not the supply current flowing through the connector matches the return current flowing through the connector, and this output may be used to detect stray-current faults in which current bypasses the connector to return via alternative paths such as through a device chassis. The connector may include one or more supply wires embedded in the overmold, one or more return wires embedded in the overmold, one or more supply terminals embedded in the overmold and terminating the supply wires, and one or more return terminals embedded in the overmold and terminating the return wires. The magnetic core embedded in the overmold may encircle (a) the supply terminals or the supply wires or both, and (b) the return terminals or the return wires or both.
-
公开(公告)号：US20190033349A1
公开(公告)日：2019-01-31
申请号：US15661612
申请日：2017-07-27
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Vincent W. Michna , Peter Hansen , Julie Victoria Tan
IPC: G01R19/25
Abstract: Examples disclosed herein relate to determining a power sense output based on a current sense line and a voltage sense line. A first stage circuit has a first voltage input of the current sense line of a server. The first stage circuit also has a feedback voltage input based on an output voltage of the first stage circuit and a variable resistance value based on the voltage sense line of the server. A second stage circuit is used to buffer the first output voltage to yield a second output voltage. A third stage circuit yields a power sense output based on a difference between the second output voltage and the first voltage input.
-
公开(公告)号：US20180376611A1
公开(公告)日：2018-12-27
申请号：US16066869
申请日：2016-01-29
Applicant: Hewlett Packard Enterprise Development LP
Inventor： Zheila N. Madanipour , Vincent W. Michna , Patrick Raymond , John Franz
Abstract: According to an example, a server may include a housing including a bottom portion, a first node defined by first and second printed circuit assemblies, and a second node defined by third and fourth printed circuit assemblies.
-
公开(公告)号：US12111706B2
公开(公告)日：2024-10-08
申请号：US18330578
申请日：2023-06-07
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： David Scott Chialastri , Vincent W. Michna , Nilashis Dey , Yasir Jamal
CPC classification number: G06F1/206 , G06F1/26 , G06F11/3058
Abstract: A compute device may include one or more processors operable at variable performance levels depending upon power supplied from a compute device power supply. A baseboard management controller of the compute device may periodically calculate an adjustment value for the power supply to adjust the power delivered to the one or more processors. The adjustment value may be calculated as a function of a thermal margin between the temperature of the one or more processors over time and a thermal operating limit of the one or more processors.
-
公开(公告)号：US12004317B2
公开(公告)日：2024-06-04
申请号：US17731415
申请日：2022-04-28
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Vincent W. Michna , Martha Gomez
CPC classification number: H05K7/1487 , G06F1/20 , G08B21/182 , H05K7/1489 , H05K7/20145 , H05K7/20727 , H05K7/20836
Abstract: Example implementations relate to a computing system having a flexible filter assembly. The computing system includes a chassis having an internal volume, a pair of guide rails, a flexible filter assembly, and a plurality of first electronic components. The pair of guide rails is disposed spaced apart from each other and coupled to the chassis. The flexible filter assembly is disposed within and connected to the chassis via the pair of guide rails. The flexible filter assembly splits the internal volume into first and second volume portions. The first volume portion is located downstream relative to flow of supply air. The flexible filter assembly slides into the chassis along the pair of guide rails to detachably connect to the chassis. The flexible filter assembly cleans the supply air and directs clean air towards the plurality of first electronic components disposed in the first volume portion and coupled to the chassis.
-
-
-
-
-
-
-
-
-
Search Results
24
records
(took 0.02 seconds)
