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公开(公告)号:US20160110662A1
公开(公告)日:2016-04-21
申请号:US14888033
申请日:2013-05-22
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Gary J. Dispoto , Jun Zeng , Gidi AMIR , Noam Shaham
IPC: G06Q10/06
CPC classification number: G06Q10/067 , G06Q10/06 , G06Q10/06311 , G06Q10/0633 , G06Q10/087 , G06Q50/04 , Y02P90/30
Abstract: Examples disclosed herein relate to simulating production of an order. In one implementation, a processor extracts information about process flow of an order through resources, resource policy, and prioritization within the production environment from information related to the fulfillment of the previous orders. The processor may create a simulation of the fulfillment of new orders within the production environment based on the extracted information.
Abstract translation: 本文公开的示例涉及模拟订单的生产。 在一个实现中,处理器通过资源,资源策略和生产环境中的优先级排序从涉及先前订单的信息中提取关于订单的流程的信息。 处理器可以基于所提取的信息来创建在生产环境内实现新订单的模拟。
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公开(公告)号:US11691339B2
公开(公告)日:2023-07-04
申请号:US16463542
申请日:2017-02-15
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Wei Huang , Steven J. Simske , Ingeborg Tastl , Melanie M. Gottwals , Gary J. Dispoto
IPC: B29C64/00 , B29C64/171 , B33Y10/00 , B33Y30/00 , B33Y40/00 , B33Y40/20 , B22F12/00 , B29C64/245 , B29C64/255 , B33Y80/00 , B33Y40/10 , B29C64/182 , B29C64/30 , B33Y70/00 , B29C64/20 , B29C64/307 , B29C64/25 , B22F10/85 , B33Y50/02 , B22F10/00 , B01D67/00 , B29C64/205 , B29C64/176 , B29C64/10 , B29C64/40 , B33Y99/00 , B29C64/227 , B29C64/393 , B33Y50/00 , B22F12/82 , B29C64/386
CPC classification number: B29C64/171 , B01D67/00045 , B01D67/00415 , B22F10/00 , B22F10/85 , B22F12/00 , B22F12/82 , B29C64/00 , B29C64/10 , B29C64/176 , B29C64/182 , B29C64/20 , B29C64/205 , B29C64/227 , B29C64/245 , B29C64/25 , B29C64/255 , B29C64/30 , B29C64/307 , B29C64/386 , B29C64/393 , B29C64/40 , B33Y10/00 , B33Y30/00 , B33Y40/00 , B33Y40/10 , B33Y40/20 , B33Y50/00 , B33Y50/02 , B33Y70/00 , B33Y80/00 , B33Y99/00 , G03G2215/2054 , G05B2219/49023 , G05B2219/49246 , Y10T156/1722 , Y10T156/1798
Abstract: An example system includes an object and a support frame supporting the object. The support frame constrains movement of the object relative to the support frame, and the support frame includes at least one of a cage or a shackle to non-rigidly constrain movement of at least a part of the object.
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公开(公告)号:US20230146931A1
公开(公告)日:2023-05-11
申请号:US17912078
申请日:2020-04-13
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Wei Huang , Gary J. Dispoto
IPC: B29C64/393 , B29C64/165
CPC classification number: B29C64/393 , B29C64/165 , B33Y10/00
Abstract: A device comprises a control portion to additively manufacturing a 3D object to include a first interior portion having a first thermal history different from a second thermal history of at least second interior portions surrounding the selectable first interior portion to induce an authentication surface feature at a first exterior surface portion overlying the first interior portion.
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公开(公告)号:US20230020856A1
公开(公告)日:2023-01-19
申请号:US17783423
申请日:2020-01-13
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Wei Huang , Gary J. Dispoto
IPC: B29C64/393 , B29C64/171
Abstract: In one example in accordance with the present disclosure, a method is described. According to the method, a characteristic of each of multiple three-dimensional (3D) objects to be printed is determined. 3D objects to be printed are grouped based on characteristic similarity. For a group of 3D objects to be printed, an additive manufacturing setting is altered based on the characteristics of the 3D objects to be printed that form the group.
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公开(公告)号:US11229605B2
公开(公告)日:2022-01-25
申请号:US16077321
申请日:2017-02-15
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Wei Huang , Nathan Moroney , Steven J. Simske , Gary J. Dispoto
Abstract: An example device includes at least one three-dimensional (3D) printed tablet and a 3D-printed production support structure. Each 3D-printed tablet includes an excipient material and an active ingredient. The 3D-printed support structure includes a 3D-printed planar structure comprising the excipient material and at least one 3D-printed connecting member comprising the excipient material. The planar structure includes at least one aperture, each aperture corresponding to one of the at least one 3D-printed tablet. The connecting member detachably connects the at least one 3D-printed tablet with the 3D-printed planar structure and positions the at least one 3D-printed tablets within the apertures.
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公开(公告)号:US20210114290A1
公开(公告)日:2021-04-22
申请号:US16606275
申请日:2017-10-25
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Wei Huang , Gary J. Dispoto
IPC: B29C64/165 , B29C64/40 , B29C64/393 , B29C64/268 , B29C64/218
Abstract: According to examples, a three-dimensional (3D) fabrication system may include a controller to identify a feature of an object to be fabricated and based on the identified feature having a size that is smaller than a predefined size, determine a thermal support for the identified feature. The controller may also control fabrication components to form, through application of energy, the determined thermal support from a first set of particles, form an intermediate section adjacent to the formed thermal support from a second set of particles, and form, through application of energy, the feature adjacent to the intermediate section from a third set of particles, in which heat from the thermal support is to reduce a thermal bleed rate of the third set of particles.
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公开(公告)号:US10967559B2
公开(公告)日:2021-04-06
申请号:US16462679
申请日:2017-02-14
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Wei Huang , Lihua Zhao , Gary J. Dispoto
IPC: B29C64/10 , G01N27/04 , B33Y10/00 , B33Y30/00 , B33Y50/02 , B33Y80/00 , B29C64/393 , B29C70/70 , B29C70/88 , B29L31/34
Abstract: According to an example, a three-dimensional (3D) printed object may include a body formed of an electrically non-conductive material. In addition, an electrically conductive channel, a sensing device, and a signal emitter may be embedded within the body. The sensing device may be in electrical communication with the electrically conductive channel such that the sensing device is affected by a disruption in a current applied through the electrically conductive channel. In addition, the signal emitter may emit a wireless signal in response to the sensing device being affected by a disruption in the applied current.
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公开(公告)号:US20200047414A1
公开(公告)日:2020-02-13
申请号:US16344516
申请日:2017-01-17
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Sunil Kothari , Wesley R. Schalk , Francisco Jose Oblea Ramirez , Jun Zeng , Gary J. Dispoto
Abstract: A system includes an interface to receive data from a number of sensors coupled to components of a device to monitor health of each of those components and a processor and memory to, in response to a determination that a first of the components is to be replaced, locate an additive manufacturing device that is capable of fabrication of a replacement component without interrupting fabrication cycles of that additive manufacturing device before the first component fails and to instruct fabrication of the replacement component.
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公开(公告)号:US20190143605A1
公开(公告)日:2019-05-16
申请号:US16098106
申请日:2016-07-21
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Wei Huang , Lihua Zhao , Gary J. Dispoto
IPC: B29C64/393 , B29C64/153 , B33Y30/00 , B33Y70/00 , B33Y50/02
Abstract: A 3D object is additively formed via arranging non-conductive material relative to a receiving surface. During additive formation of the 3D object, a conductive channel is formed as part of the 3D object. In some instances, non-destructive fracture sensing is performed via measurement of an electrical parameter of the conductive channel.
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公开(公告)号:US10181216B2
公开(公告)日:2019-01-15
申请号:US15542901
申请日:2015-01-30
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Jun Zeng , Pu Huang , Sebastia Cortes , Scott A. White , Gary J. Dispoto
IPC: G06T17/00
Abstract: An example technique for generating slice data from a voxel representation can include obtaining a shape specification of the 3-D object. The example technique for generating slice data from a voxel representation can also include obtaining a material specification of the 3-D object. The example technique for generating slice data from a voxel representation can also include merging the shape specification and the material specification to create a voxel representation of the 3-D object, wherein each voxel in the voxel representation includes a plurality of data types. The example technique for generating slice data from a voxel representation can also include generating slice data from the voxel representation, wherein the slice data provides a higher resolution than that provided by the voxel representation using the plurality of data types.
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