公开(公告)号：US10901472B2

公开(公告)日：2021-01-26

申请号：US16473838

申请日：2016-12-29

Applicant: Huawei Technologies Co., Ltd.

Inventor： Wei Li ,  Chunyang Chen ,  Baochun Chen ,  Zhiguo Zhang ,  Quanming Li

IPC: H05K7/20 ,  G06F1/20 ,  F28D20/02 ,  H04M1/02

Abstract: A heat dissipation apparatus applied to a terminal device includes a phase change material (PCM) and a heat transfer unit. The heat transfer unit is in contact with the PCM to conduct heat of the terminal device to the PCM. Because the PCM maintains a temperature substantially unchanged during a phase change, a temperature of the heat dissipation apparatus is not excessively high while heat is absorbed.

公开(公告)号：US11839055B2

公开(公告)日：2023-12-05

申请号：US17683698

申请日：2022-03-01

Applicant: Huawei Technologies Co., Ltd.

Inventor： Yongfu Sun ,  Guo Yang ,  Quanming Li

IPC: H05K7/20 ,  H04M1/02 ,  G06F1/20

CPC classification number: H05K7/20336 ,  H04M1/026 ,  H05K7/205 ,  G06F1/203 ,  H04M1/02

Abstract: A heat-conducting assembly includes a middle frame and a heat-conducting structure. The middle frame is plate-shaped, having a first side surface and a second side surface that are opposite to each other, and being provided with a first through hole through which the first side surface communicates with the second side surface. The heat-conducting structure includes a heat dissipation part and a conducting part. The heat dissipation part is fastened to the second side surface, and the conducting part extends into the first through hole. The conducting part includes a conductor being connected to the heat dissipation part and a heat insulator which is fastened in the first through hole through the heat insulator, and is in contact with a heat source, which is close to one end that is of the first through hole and that is located on the first side surface.

公开(公告)号：US11778772B2

公开(公告)日：2023-10-03

申请号：US17859259

申请日：2022-07-07

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Jiajia Sui ,  Quanming Li ,  Guo Yang ,  Shuainan Lin

IPC: H05K7/20 ,  H02J50/00 ,  H02J50/12 ,  H02J7/00 ,  H01F27/08

CPC classification number: H05K7/20145 ,  H01F27/085 ,  H02J7/0042 ,  H02J50/005 ,  H02J50/12 ,  H05K7/20172 ,  H05K7/20909

Abstract: Embodiments of the present invention relate to a wireless charging device. The wireless charging device includes a housing, an induction coil, a ferrite, a printed circuit board (PCB), and a fan. The housing includes a first surface and a second surface, a protrusion is disposed on the first surface, and the protrusion is configured to: support a to-be-charged device, and leave a gap between the to-be-charged device and the first surface when the to-be-charged device is installed on the wireless charging device. At least one first air guiding opening and at least one second air guiding opening are disposed on the housing. When the fan runs, the first air guiding opening, the fan, and the second air guiding opening form an air duct that passes through the ferrite and the PCB.

公开(公告)号：US11419238B2

公开(公告)日：2022-08-16

申请号：US16759890

申请日：2018-10-27

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Jiajia Sui ,  Quanming Li ,  Guo Yang ,  Shuainan Lin

IPC: H05K7/20 ,  H02J50/00 ,  H02J50/12 ,  H02J7/00 ,  H01F27/08

Abstract: Embodiments of the present invention relate to a wireless charging device. The wireless charging device includes a housing, an induction coil, a ferrite, a printed circuit board (PCB), and a fan. The housing includes a first surface and a second surface, a protrusion is disposed on the first surface, and the protrusion is configured to: support a to-be-charged device, and leave a gap between the to-be-charged device and the first surface when the to-be-charged device is installed on the wireless charging device. At least one first air guiding opening and at least one second air guiding opening are disposed on the housing. When the fan runs, the first air guiding opening, the fan, and the second air guiding opening form an air duct that passes through the ferrite and the PCB.

公开(公告)号：US20210222919A1

公开(公告)日：2021-07-22

申请号：US17224539

申请日：2021-04-07

Applicant: Huawei Technologies Co., Ltd.

Inventor： Xing Fu ,  Chengpeng Yang ,  Ningjun Zhu ,  Quanming Li

IPC: F25B21/02 ,  H01L23/38 ,  H01L35/04 ,  H01S5/024 ,  H01S5/06

Abstract: A thermoelectric cooler (TEC) configured to support a heat source device and perform temperature control on the heat source device. The TEC includes a first base plate, a second base plate disposed opposite to the first base plate, and first elements. The first base plate is configured to support the heat source device. An accommodation space is formed between the first base plate and the second base plate. The first elements are arranged at intervals within the accommodation space, and are all connected to the first base plate and the second base plate.

公开(公告)号：US20210007238A1

公开(公告)日：2021-01-07

申请号：US17031040

申请日：2020-09-24

Applicant: Huawei Technologies Co., Ltd.

Inventor： Yongfu Sun ,  Guo Yang ,  Quanming Li

IPC: H05K7/20 ,  H04M1/02

Abstract: A heat-conducting assembly is described, the assembly includes a middle frame and a heat-conducting structure. The middle frame is plate-shaped, having a first side surface and a second side surface that are opposite to each other, and being provided with a first through hole through which the first side surface communicates with the second side surface. The heat-conducting structure includes a heat dissipation part and a conducting part. The heat dissipation part is fastened to the second side surface, and the conducting part extends into the first through hole. The conducting part includes a conductor being connected to the heat dissipation part and a heat insulator which is fastened in the first through hole through the heat insulator, and is in contact with a heat source, which is close to one end that is of the first through hole and that is located on the first side surface.