摘要:
A JTAG interface device capable of effectively debugging a mobile terminal by interfacing the mobile terminal with a JTAG emulator without an additional interface unit by allocating test pins of the JTAG emulator to some pins of a receptacle and then electrically connecting the test pins to the pins, and a method thereof. Accordingly, an operation for debugging the mobile terminal can be easily and effectively performed.
摘要:
A method of forming a semiconductor device is provided, comprising forming a plurality of hard masks on a substrate by patterning an insulating layer; forming a plurality of trenches in the substrate, each trench having trench walls disposed between two adjacent masks and extending vertically from a bottom portion to an upper portion; forming an insulating layer on the hard masks and the trench walls; forming a conductive layer on the insulating layer; etching the conductive layer to form conductive layer patterns to fill the bottom portions of the trenches; depositing a buffer layer on the conductive layer patterns and the trench walls; and filling the upper portions of the trenches with a capping layer.
摘要:
Provided is a microwave and millimeter wave transceiver package technology that can unify the transceiver composed of an amplifier, a filter and a mixer into a low temperature co-fired ceramic (LTCC) module package by using an LTCC method utilizing a multilayer dielectric substrate, thereby achieving miniaturization, a loss reduction and moderate price. The transceiver includes a plurality of cavities arrayed in a multilayer substrate, an amplifier and a mixer mounted in the cavities and a filter provided with a strip line between the amplifier and the mixer.
摘要:
A waveguide filter is disclosed. The waveguide filter includes a lower conductive layer; a plurality of dielectric layers stacked on the lower conductive layer; an upper conductive layer formed on a top surface of the plurality of dielectric layers; a waveguide formed on the upper conductive layer; and two sets of first via metals arranged at longitudinal sides of the waveguide filter, wherein each of the sets is formed in two-fold line shape.
摘要:
Provided is a microwave and millimeter wave transceiver package technology that can unify the transceiver composed of an amplifier, a filter and a mixer into a low temperature co-fired ceramic (LTCC) module package by using an LTCC method utilizing a multilayer dielectric substrate, thereby achieving miniaturization, a loss reduction and moderate price. The transceiver includes a plurality of cavities arrayed in a multilayer substrate, an amplifier and a mixer mounted in the cavities and a filter provided with a strip line between the amplifier and the mixer.
摘要:
An apparatus for processing a digital transmission signal for a transmitter includes a transmission Finite Impulse Response (FIR) filter to perform shaping on initial setting data to convert the initial setting data into a signal having a predetermined passband, a comparator to compare the signal with data including degradation information provided as feedback by a receiver corresponding to the transmitter, to generate a control signal, and a band flatness correction filter to adjust a coefficient of the band flatness correction filter in response to the control signal, and to correct an in-band flatness.
摘要:
Provided is a digital predistortion linearizer applicable to millimeter-wave band point-to-point communications. The digital predistortion linearizer includes a transmission unit and a reception unit. The reception unit receives a first signal including a transmission signal and a distortion signal through a millimeter-wave propagation environment, detects the distortion signal from the first signal, and transmits information on the detected distortion signal with the first signal to the transmission unit. The transmission unit generates a predistortion signal using the information on the distortion signal and the first signal received from the reception unit, couples the generated predistortion signal with the transmission signal, and outputs the coupled signal.
摘要:
Disclosed is an image scanning apparatus in an image processing system, including: a frequency signal generator configured to synthesize at least two single frequency signals; a frequency up converter configured to up-convert and transmit the synthesized single frequency signals; a frequency down converter configured to down-convert and receive frequency signals reflected from an object by the up-converted frequency signals; a frequency sorter configured to sort the down-converted frequency signals so as to correspond to the at least two single frequency signals; a multiple frequency processor configured to generate a transfer function by performing parallel processing on each of the sorted frequency signals; and an image processing unit configured to generate an image of the object by using the transfer function.
摘要:
Provided are a multi-output oscillator using a single oscillator, and a method of generating multiple outputs. The multi-output oscillator includes: an oscillator outputting the single frequency; a multiplier multiplying the single frequency to output a first frequency; a first frequency divider dividing the single frequency by a first division factor; a first mixer outputting a second frequency by mixing an output of the first frequency divider and an output of the multiplier; a second frequency divider dividing the single frequency by a second division factor; a second mixer mixing the output of the second frequency divider and the output of the first mixer to output a third frequency; and a third mixer mixing the output of the second frequency divider and the output of the multiplier to output a fourth frequency.
摘要:
A method of forming a semiconductor device is provided, comprising forming a plurality of hard masks on a substrate by patterning an insulating layer; forming a plurality of trenches in the substrate, each trench having trench walls disposed between two adjacent masks and extending vertically from a bottom portion to an upper portion; forming an insulating layer on the hard masks and the trench walls; forming a conductive layer on the insulating layer; etching the conductive layer to form conductive layer patterns to fill the bottom portions of the trenches; depositing a buffer layer on the conductive layer patterns and the trench walls; and filling the upper portions of the trenches with a capping layer.