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公开(公告)号：US20210288725A1
公开(公告)日：2021-09-16
申请号：US17335423
申请日：2021-06-01
Applicant: Infineon Technologies AG
Inventor： Dirk HAMMERSCHMIDT , Erich Kolmhofer , Rudolf Lachner
Abstract: A system includes a movable part that is rotatably movable, the movable part comprising a first portion and a second portion; transceiver circuitry configured to transmit a radio signal towards the movable part and to receive a receive radio signal from the movable part; and evaluation circuitry configured to determine a rotational position of the movable part based on the receive radio signal. The first portion of the movable part has a first electromagnetic reflectivity for the radio signal and the second portion of the movable part has a second electromagnetic reflectivity for the radio signal. The first electromagnetic reflectivity differs from the second electromagnetic reflectivity.
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公开(公告)号：US20190067223A1
公开(公告)日：2019-02-28
申请号：US16173702
申请日：2018-10-29
Applicant: Infineon Technologies AG
Inventor： Rudolf Lachner , Linus Maurer , Maciej Wojnowski
CPC classification number: H01L23/66 , H01L23/3128 , H01L23/3135 , H01L24/12 , H01L24/19 , H01L2223/6611 , H01L2223/6655 , H01L2223/6677 , H01L2223/6683 , H01L2224/0401 , H01L2224/04042 , H01L2224/04105 , H01L2224/12105 , H01L2224/16225 , H01L2224/32225 , H01L2224/48247 , H01L2224/73204 , H01L2924/01005 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01072 , H01L2924/01074 , H01L2924/01075 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/1423 , H01L2924/181 , H01L2924/1815 , H01L2924/18162 , H01L2924/19107 , H01L2924/3011 , H01L2924/351 , H01Q1/2283 , H01Q9/0407 , H01Q9/045 , H01Q9/0457 , H01L2924/00
Abstract: A semiconductor radar module includes an integrated circuit (IC) radar device embedded within a wafer level package compound layer, the wafer level package compound layer extending at least partially lateral to the IC radar device. An interface layer abutting the wafer level package compound layer comprises a redistribution layer coupled to the IC radar device for connecting the IC radar device externally. An underfill material extends between the interface layer and an external substrate and abuts the interface layer and the external substrate. The interface layer is disposed between the wafer level package compound layer and the underfill material.
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公开(公告)号：US10121751B2
公开(公告)日：2018-11-06
申请号：US15137594
申请日：2016-04-25
Applicant: Infineon Technologies AG
Inventor： Rudolf Lachner , Linus Maurer , Maciej Wojnowski
Abstract: A semiconductor module comprises an integrated circuit device, the IC device embedded in a compound material, wherein the compound material at least partially extends lateral to the IC device. The semiconductor module further comprises interconnect structures arranged lateral to the IC device to provide at least one external electrical contact; a patch antenna structure integrated in the semiconductor module and electrically connected to the IC device and a layer interfacing the IC device and the compound, wherein the layer comprises first and second planar metal structures coupled to the IC device, wherein the first planar metal structure is electrically connected to the IC device and the interconnect structures and wherein the second planar metal structure is electrically connected to the IC device and the patch antenna structure.
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公开(公告)号：US20170222738A1
公开(公告)日：2017-08-03
申请号：US15416273
申请日：2017-01-26
Applicant: Infineon Technologies AG
Inventor： Dirk Hammerschmidt , Erich Kolmhofer , Rudolf Lachner
CPC classification number: H04B17/103 , G01P3/487 , G01P3/488 , G01S13/585 , G01S13/881 , H01Q1/2283 , H01Q1/24 , H01Q1/42 , H01Q21/00 , H04B17/27
Abstract: Embodiments relate to machines comprising a movable part, transceiver circuitry configured to transmit a radio signal towards the movable part and to receive a reflection of the radio signal from the movable part, evaluation circuitry configured to determine a position or a speed of the movable part based on at least the received radio signal. A distance between an antenna of the transceiver circuitry and the movable part is less than 5 cm.
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公开(公告)号：US09349696B2
公开(公告)日：2016-05-24
申请号：US14148585
申请日：2014-01-06
Applicant: Infineon Technologies AG
Inventor： Rudolf Lachner , Linus Maurer , Maciej Wojnowski
CPC classification number: H01L23/66 , H01L23/3128 , H01L23/3135 , H01L24/12 , H01L24/19 , H01L2223/6611 , H01L2223/6655 , H01L2223/6677 , H01L2223/6683 , H01L2224/0401 , H01L2224/04042 , H01L2224/04105 , H01L2224/12105 , H01L2224/16225 , H01L2224/32225 , H01L2224/48247 , H01L2224/73204 , H01L2924/01005 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01072 , H01L2924/01074 , H01L2924/01075 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/1423 , H01L2924/181 , H01L2924/1815 , H01L2924/18162 , H01L2924/19107 , H01L2924/3011 , H01L2924/351 , H01Q1/2283 , H01Q9/0407 , H01Q9/045 , H01Q9/0457 , H01L2924/00
Abstract: A semiconductor module comprises a wafer package comprising an integrated circuit (IC) device embedded within the wafer package and a layer comprising at least one antenna structure and redistribution structures, wherein the antenna structure is coupled to the IC device and wherein the redistribution structures are coupled to the IC device.
Abstract translation: 半导体模块包括晶片封装，其包括嵌入在晶片封装内的集成电路（IC）器件和包括至少一个天线结构和再分配结构的层，其中天线结构耦合到IC器件，并且其中再分配结构耦合 到IC设备。
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Patent Agency Ranking
公开(公告)号：US08624381B2
公开(公告)日：2014-01-07
申请号：US13849034
申请日：2013-03-22
Applicant: Infineon Technologies AG
Inventor： Rudolf Lachner , Linus Maurer , Maciej Wojnowski
IPC: H01L23/00
CPC classification number: H01L23/66 , H01L23/3128 , H01L23/3135 , H01L24/12 , H01L24/19 , H01L2223/6611 , H01L2223/6655 , H01L2223/6677 , H01L2223/6683 , H01L2224/0401 , H01L2224/04042 , H01L2224/04105 , H01L2224/12105 , H01L2224/16225 , H01L2224/32225 , H01L2224/48247 , H01L2224/73204 , H01L2924/01005 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01072 , H01L2924/01074 , H01L2924/01075 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/1423 , H01L2924/181 , H01L2924/1815 , H01L2924/18162 , H01L2924/19107 , H01L2924/3011 , H01L2924/351 , H01Q1/2283 , H01Q9/0407 , H01Q9/045 , H01Q9/0457 , H01L2924/00
Abstract: A semiconductor module, comprises a package molding compound layer comprising an integrated circuit (IC) device embedded within a package molding compound, the integrated circuit device and the package molding compound having a common surface. Structures are formed to connect the semiconductor module to an external board, the structures electrically connected to the integrated circuit device. A layer is formed on the common surface, the layer comprising at least one integrated antenna structure, the integrated antenna structure being coupled to the IC device.
Abstract translation: 半导体模块包括封装模制化合物层，其包含嵌入封装模塑料中的集成电路（IC）器件，集成电路器件和具有共同表面的封装模塑料。 形成结构以将半导体模块连接到外部板，该结构电连接到集成电路器件。 在公共表面上形成一个层，该层包括至少一个集成天线结构，该集成天线结构耦合到该IC器件。
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公开(公告)号：US11879966B2
公开(公告)日：2024-01-23
申请号：US17248003
申请日：2021-01-05
Applicant: Infineon Technologies AG
Inventor： Josef Boeck , Rudolf Lachner , Maciej Wojnowski , Walter Hartner
CPC classification number: G01S13/86 , G01S7/006 , G01S7/02 , G01S13/003 , H04B1/40 , G01S7/032 , G01S13/878 , G01S13/931 , H01L2223/6677 , H01L2224/04105 , H01L2224/12105
Abstract: A semiconductor package having an antenna; and a semiconductor die which is coupled to the antenna and comprises a transmitter configured to transmit wirelessly via the antenna a wireless signal having information on a local oscillator signal to a further semiconductor package comprising a further semiconductor die.
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公开(公告)号：US20210247510A1
公开(公告)日：2021-08-12
申请号：US17248003
申请日：2021-01-05
Applicant: Infineon Technologies AG
Inventor： Josef Boeck , Rudolf Lachner , Maciej Wojnowski , Walter Hartner
Abstract: A semiconductor package having an antenna; and a semiconductor die which is coupled to the antenna and comprises a transmitter configured to transmit wirelessly via the antenna a wireless signal having information on a local oscillator signal to a further semiconductor package comprising a further semiconductor die.
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公开(公告)号：US11063677B2
公开(公告)日：2021-07-13
申请号：US15416273
申请日：2017-01-26
Applicant: Infineon Technologies AG
Inventor： Dirk Hammerschmidt , Erich Kolmhofer , Rudolf Lachner
Abstract: Embodiments relate to machines comprising a movable part, transceiver circuitry configured to transmit a radio signal towards the movable part and to receive a reflection of the radio signal from the movable part, evaluation circuitry configured to determine a position or a speed of the movable part based on at least the received radio signal. A distance between an antenna of the transceiver circuitry and the movable part is less than 5 cm.
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公开(公告)号：US09910145B2
公开(公告)日：2018-03-06
申请号：US14135069
申请日：2013-12-19
Applicant: Infineon Technologies AG
Inventor： Josef Boeck , Rudolf Lachner , Maciej Wojnowski , Walter Hartner
CPC classification number: G01S13/86 , G01S7/006 , G01S7/02 , G01S7/032 , G01S13/003 , G01S13/878 , G01S13/931 , H01L2223/6677 , H01L2224/04105 , H01L2224/12105 , H04B1/40
Abstract: A wireless communication system includes a first semiconductor module and a second semiconductor module. The first semiconductor module includes a semiconductor die connected to an antenna structure. The semiconductor die of the first semiconductor module and the antenna structure of the first semiconductor module are arranged within a common package. The semiconductor die of the first semiconductor module includes a transmitter module configured to transmit the wireless communication signal through the antenna structure of the first semiconductor module. The second semiconductor module includes a semiconductor die connected to an antenna structure. The semiconductor die of the second semiconductor module includes a receiver module configured to receive the wireless communication signal through the antenna structure of the second semiconductor module from the first semiconductor module.
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