公开(公告)号：US20210117743A1

公开(公告)日：2021-04-22

申请号：US17075730

申请日：2020-10-21

Applicant: Infineon Technologies AG

Inventor： Frank Pueschner ,  Walther Pachler ,  Josef Gruber ,  Jens Pohl ,  Stephan Rampetzreiter ,  Thomas Spoettl ,  Peter Stampka

IPC: G06K19/07 ,  G06K19/077 ,  G06K9/00

Abstract: A sensor device is provided that includes a fingerprint sensor and an antenna coupled with the fingerprint sensor for inductive coupling of the fingerprint sensor with a booster antenna.

公开(公告)号：US10484050B2

公开(公告)日：2019-11-19

申请号：US15901950

申请日：2018-02-22

Applicant: Infineon Technologies AG

Inventor： Walther Pachler ,  Josef Gruber ,  Juergen Hoelzl ,  Stephan Rampetzreiter

IPC: H04B5/00 ,  H04B1/03 ,  A44C9/00 ,  H04B7/08

Abstract: A near field communication ring configured to be worn by a user is provided. The NFC ring may include at least one metal ring having a gap, a chip, and an antenna, wherein the chip and the antenna may be fixed to the at least one metal ring having a gap, and wherein the chip, using the antenna, is configured to provide a near field communication with an external device.

公开(公告)号：US10411507B2

公开(公告)日：2019-09-10

申请号：US15208661

申请日：2016-07-13

Applicant: Infineon Technologies AG

Inventor： Georg Skacel ,  Stephan Rampetzreiter

IPC: H01F38/14 ,  H02J50/05 ,  H02J50/10 ,  H04B5/00

Abstract: In accordance with various embodiments, a circuit arrangement may include a first circuit, which is designed for contactless communication, and a second circuit, which is designed in accordance with a predefined functionality. The circuit arrangement may further include at least one electronic component which in a first operating mode together with the first circuit implements the contactless communication and in a second operating mode together with the second circuit implements the predefined functionality.

公开(公告)号：US10096902B2

公开(公告)日：2018-10-09

申请号：US14258032

申请日：2014-04-22

Applicant: Infineon Technologies AG

Inventor： Peter Raggam ,  Oliver Kronschlaeger ,  Stephan Rampetzreiter ,  Josef Gruber

IPC: H01Q7/08 ,  H01Q1/22

Abstract: In various embodiments, an antenna arrangement is provided. The antenna arrangement may include at least one integrated circuit; at least one loop antenna that is coupled to the integrated circuit and that forms a loop antenna region; at least one antenna that is coupled to the integrated circuit and that has a magnet core; wherein at least one portion of the magnet core is arranged above a portion of the loop antenna region; wherein the portion of the magnet core overlaps the portion of the loop antenna region; or wherein the portion of the magnet core does not overlap the portion of the loop antenna region.

公开(公告)号：US20180248586A1

公开(公告)日：2018-08-30

申请号：US15901950

申请日：2018-02-22

Applicant: Infineon Technologies AG

Inventor： Walther Pachler ,  Josef Gruber ,  Juergen Hoelzl ,  Stephan Rampetzreiter

IPC: H04B5/00 ,  A44C9/00

Abstract: A near field communication ring configured to be worn by a user is provided. The NFC ring may include at least one metal ring having a gap, a chip, and an antenna, wherein the chip and the antenna may be fixed to the at least one metal ring having a gap, and wherein the chip, using the antenna, is configured to provide a near field communication with an external device.

公开(公告)号：US20170316303A1

公开(公告)日：2017-11-02

申请号：US15477128

申请日：2017-04-03

Applicant: Infineon Technologies AG

Inventor： Walther Pachler ,  Stephan Rampetzreiter

IPC: G06K19/077 ,  H01L49/02 ,  H01L23/00 ,  H01L23/66 ,  H01L25/04

CPC classification number: G06K19/07775 ,  G06K19/07722 ,  G06K19/07743 ,  H01L23/66 ,  H01L24/03 ,  H01L24/06 ,  H01L25/04 ,  H01L28/60 ,  H01L2223/6677

Abstract: In various embodiments, a chip card module for a chip card is provided. The chip card module may include a carrier with a first side and an opposite second side, a chip arranged over the first side of the carrier, an antenna arranged over the carrier. The antenna may be electrically conductively coupled to the chip and configured to inductively couple to a second antenna formed on a chip card body of the chip card. The chip card module may further include a capacitor electrically conductively coupled to the chip, the capacitor including a first electrode arranged over the first side of the carrier, and a second electrode arranged over the second side of the carrier.

公开(公告)号：US20150097040A1

公开(公告)日：2015-04-09

申请号：US14049331

申请日：2013-10-09

Applicant: INFINEON TECHNOLOGIES AG

Inventor： Stephan Rampetzreiter ,  Andreas Woerle

IPC: G06K19/077 ,  H01Q7/00

CPC classification number: G06K19/07794 ,  G06K19/07779 ,  H01Q1/2225 ,  H01Q7/00

Abstract: In various embodiments, a booster antenna structure is provided, comprising a chip coupling region; a coil having a conductor forming multiple windings, wherein the coil encloses the chip coupling region substantially completely, wherein the conductor is arranged around the chip coupling region in a crossover-free manner.

Abstract translation: 在各种实施例中，提供了一种增强天线结构，包括芯片耦合区域; 具有形成多个绕组的导体的线圈，其中所述线圈基本上完全包围所述芯片耦合区域，其中所述导体以无交叉的方式布置在所述芯片耦合区域周围。

公开(公告)号：US20140084070A1

公开(公告)日：2014-03-27

申请号：US13625888

申请日：2012-09-25

Applicant: INFINEON TECHNOLOGIES AG

Inventor： Frank Pueschner ,  Siegfried Hoffner ,  Peter Stampka ,  Wolfgang Schindler ,  Stephan Rampetzreiter

IPC: G06K19/02 ,  H05K13/00 ,  G06K19/077

CPC classification number: G06K7/10178 ,  Y10T29/49018

Abstract: According to one embodiment, a chip card is provided comprising a booster antenna wherein the booster antenna comprises a material having an electrical resistivity of at least 0.05 Ohm*mm2/m.

Abstract translation: 根据一个实施例，提供了包括增强天线的芯片卡，其中所述增强天线包括具有至少0.05欧姆* mm 2 / m的电阻率的材料。