公开(公告)号：US20150357258A1

公开(公告)日：2015-12-10

申请号：US14296743

申请日：2014-06-05

Applicant: Intel Corporation

Inventor： Thomas J. Fitzgerald ,  Aravindha R. Antoniswamy ,  Carl L. Deppisch ,  Nikunj P. Patel

IPC: H01L23/367 ,  H01L21/48

CPC classification number: H01L23/3675 ,  H01L21/4882 ,  H01L21/50 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/81815 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/15311 ,  Y10T29/49352 ,  H01L2924/014

Abstract: A multi-component heat spreader comprising a top component having a first surface and an opposing second surface with either a cavity extending therein from the second surface thereof or a projection extending from the second surface thereof. The multi-component heat spreader further includes at least one additional component, such as a footing component or a spacer component, having a first surface and an opposing second surface with either a cavity extending therein from the second surface thereof or a projection extending from the second surface thereof, which is opposite from the top component cavity/projection. The additional component is attached to the top component, such as by brazing, wherein the top component cavity/projection is mated to the additional component cavity/projection.

Abstract translation: 一种多组分散热器，包括具有第一表面和相对的第二表面的顶部部件，所述第二表面具有从其第二表面延伸到其中的空腔或从其第二表面延伸的突出部。 多部件散热器还包括至少一个额外的部件，例如基脚部件或间隔件部件，其具有第一表面和相对的第二表面，其中从其第二表面延伸的腔或从其中延伸的突起 第二表面与顶部部件空腔/突起相对。 附加部件例如通过钎焊附接到顶部部件，其中顶部部件空腔/突出部配合到附加部件空腔/突出部。

公开(公告)号：US11581240B2

公开(公告)日：2023-02-14

申请号：US16230021

申请日：2018-12-21

Applicant: INTEL CORPORATION

Inventor： Kedar Dhane ,  Omkar Karhade ,  Aravindha R. Antoniswamy ,  Divya Mani

IPC: H01L23/34 ,  H01L23/42 ,  H01L23/31 ,  H01L23/00

Abstract: An integrated circuit package that includes a liquid phase thermal interface material (TIM) is described. The package may include any number of die. The liquid phase TIM can be sealed in a chamber between a die and an integrated heat spreader and bounded on the sides by a perimeter layer. The liquid phase TIM can be fixed in place or circulated, depending on application. A thermal conductivity of the liquid phase TIM can be at least 15 Watts/meter-Kelvin, according to some embodiments. A liquid phase TIM eliminates failure mechanisms present in solid phase TIMs, such as cracking due to warpage and uncontained flow out of the module.

公开(公告)号：US20210125896A1

公开(公告)日：2021-04-29

申请号：US16662562

申请日：2019-10-24

Applicant: Intel Corporation

Inventor： Kyle J. Arrington ,  Aaron Mccann ,  Kelly Lofgreen ,  Aravindha R. Antoniswamy ,  Shankar Devasenathipathy

IPC: H01L23/373 ,  H01L23/532 ,  H01L21/48

Abstract: A thermal interface material may be formed comprising a liquid metal and a corrosion resistant filler material. The thermal interface material may be used in an integrated circuit assembly between at least one integrated circuit device and a heat dissipation device, wherein the corrosion resistant filler material changes the physical properties of the thermal interface material, which may prevent failure modes from occurring during the operation of the integrated circuit assembly and may assist in maintaining a bond line thickness between the at least one integrated circuit device and the heat dissipation device.

公开(公告)号：US10763188B2

公开(公告)日：2020-09-01

申请号：US14998122

申请日：2015-12-23

Applicant: Intel Corporation

Inventor： Aravindha R. Antoniswamy ,  Thomas John Fitzgerald ,  Kumaran Murugesan Chakravarthy ,  Syadwad Jain ,  Wei Hu ,  Zhizhong Tang

IPC: H01L23/373 ,  H01L21/48 ,  H01L23/367 ,  H01L23/00

Abstract: Integrated heat spreaders having electromagnetically-formed features, and semiconductor packages incorporating such integrated heat spreaders, are described. In an example, an integrated heat spreader includes a top plate flattened using an electromagnetic forming process. Methods of manufacturing integrated heat spreaders having electromagnetically-formed features are also described.

公开(公告)号：US20190027379A1

公开(公告)日：2019-01-24

申请号：US15767126

申请日：2015-11-16

Applicant: Intel Corporation

Inventor： Wei Hu ,  Aravindha R. Antoniswamy ,  Thomas J. Fitzgerald ,  Nikunj P. Patel ,  Syadwad Jain ,  Zhizhong Tang ,  Shrenik Kothari

IPC: H01L21/48 ,  H01L23/367 ,  H01L23/373 ,  H01L23/544 ,  H01L23/42

Abstract: Disclosed herein are embodiments of sintered heat spreaders with inserts and related devices and methods. In some embodiments, a heat spreader may include: a frame including aluminum and a polymer binder; an insert disposed in the frame, wherein the insert has a thermal conductivity higher than a thermal conductivity of the frame; and a recess having at least one sidewall formed by the frame. The polymer binder may be left over from sintering frame material and insert material to form the heat spreader.

公开(公告)号：US09330999B2

公开(公告)日：2016-05-03

申请号：US14296743

申请日：2014-06-05

Applicant: Intel Corporation

Inventor： Thomas J. Fitzgerald ,  Aravindha R. Antoniswamy ,  Carl L. Deppisch ,  Nikunj P. Patel

IPC: H01L21/00 ,  H01L23/367 ,  H01L21/48

CPC classification number: H01L23/3675 ,  H01L21/4882 ,  H01L21/50 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/81815 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/15311 ,  Y10T29/49352 ,  H01L2924/014

Abstract: A multi-component heat spreader comprising a top component having a first surface and an opposing second surface with either a cavity extending therein from the second surface thereof or a projection extending from the second surface thereof. The multi-component heat spreader further includes at least one additional component, such as a footing component or a spacer component, having a first surface and an opposing second surface with either a cavity extending therein from the second surface thereof or a projection extending from the second surface thereof, which is opposite from the top component cavity/projection. The additional component is attached to the top component, such as by brazing, wherein the top component cavity/projection is mated to the additional component cavity/projection.

Abstract translation: 一种多组分散热器，包括具有第一表面和相对的第二表面的顶部部件，所述第二表面具有从其第二表面延伸到其中的空腔或从其第二表面延伸的突出部。 多部件散热器还包括至少一个额外的部件，例如基脚部件或间隔件部件，其具有第一表面和相对的第二表面，其中从其第二表面延伸的腔或者从该第二表面延伸的突起 第二表面与顶部部件空腔/突起相对。 附加部件例如通过钎焊附接到顶部部件，其中顶部部件空腔/突出部配合到附加部件空腔/突出部。