公开(公告)号：US09799584B2

公开(公告)日：2017-10-24

申请号：US14942281

申请日：2015-11-16

Applicant: Intel Corporation

Inventor： Aravindha R. Antoniswamy ,  Thomas J. Fitzgerald

IPC: H01L23/00 ,  H01L23/367 ,  B22D19/00 ,  B22D31/00 ,  B23K26/362 ,  F28F21/00 ,  H01L21/48 ,  H01L23/373 ,  F28F3/02 ,  F28F21/08

CPC classification number: H01L23/3675 ,  B22D19/00 ,  B22D19/04 ,  B22D31/00 ,  B23K26/362 ,  F28F3/02 ,  F28F21/00 ,  F28F21/08 ,  H01L21/4882 ,  H01L23/3731 ,  H01L23/3732 ,  H01L23/3736 ,  H01L24/83

Abstract: Embodiments of heat spreaders with integrated preforms, and related devices and methods, are disclosed herein. In some embodiments, a heat spreader may include: a frame formed of a metal material, wherein the metal material is a zinc alloy or an aluminum alloy; a preform secured in the frame, wherein the preform has a thermal conductivity higher than a thermal conductivity of the metal material; and a recess having at least one sidewall formed by the frame. The metal material may have an equiaxed grain structure. In some embodiments, the equiaxed grain structure may be formed by squeeze-casting or rheocasting the metal material.

公开(公告)号：US10969840B2

公开(公告)日：2021-04-06

申请号：US15768915

申请日：2015-11-16

Applicant: Intel Corporation

Inventor： Aravindha R. Antoniswamy ,  Syadwad Jain ,  Zhizhong Tang ,  Wei Hu

IPC: G06F1/20 ,  H01L21/48 ,  H01L23/40 ,  H01L23/373 ,  H01L23/367 ,  H01L23/36

Abstract: Disclosed herein are embodiments of heat spreaders with interlocked inserts, and related devices and methods. In some embodiments, a heat spreader may include: a frame formed of a first material, wherein the frame includes an opening, a projection of the frame extends into the opening, and the projection has a top surface, a side surface, and a bottom surface; a recess having at least one sidewall formed by the frame; and an insert formed of a second material different from the first material, wherein the insert is disposed in the frame and in contact with the top surface, the side surface, and the bottom surface of the projection.

公开(公告)号：US20210028084A1

公开(公告)日：2021-01-28

申请号：US16518643

申请日：2019-07-22

Applicant: Intel Corporation

Inventor： Sergio Antonio Chan Arguedas ,  Edvin Cetegen ,  Baris Bicen ,  Aravindha R. Antoniswamy

IPC: H01L23/367 ,  H01L23/00

Abstract: Embodiments may relate to a microelectronic package that includes a die, a thermal interface material (TIM) coupled with the die, and an integrated heat spreader (IHS) coupled with the TIM. The IHS may include a feature with a non-uniform cross-sectional profile that includes a thin point and a thick point as measured in a direction perpendicular to a face of the die to which the TIM is coupled. Other embodiments may be described or claimed.

公开(公告)号：US20180012820A1

公开(公告)日：2018-01-11

申请号：US15711435

申请日：2017-09-21

Applicant: Intel Corporation

Inventor： Aravindha R. Antoniswamy ,  Thomas J. Fitzgerald

IPC: H01L23/367 ,  H01L23/373 ,  H01L21/48 ,  F28F21/08 ,  F28F21/00 ,  F28F3/02 ,  B23K26/362 ,  B22D31/00 ,  B22D19/04 ,  H01L23/00 ,  B22D19/00

CPC classification number: H01L23/3675 ,  B22D19/00 ,  B22D19/04 ,  B22D31/00 ,  B23K26/362 ,  F28F3/02 ,  F28F21/00 ,  F28F21/08 ,  H01L21/4882 ,  H01L23/3731 ,  H01L23/3732 ,  H01L23/3736 ,  H01L24/83

Abstract: Embodiments of heat spreaders with integrated preforms, and related devices and methods, are disclosed herein. In some embodiments, a heat spreader may include: a frame formed of a metal material, wherein the metal material is a zinc alloy or an aluminum alloy; a preform secured in the frame, wherein the preform has a thermal conductivity higher than a thermal conductivity of the metal material; and a recess having at least one sidewall formed by the frame. The metal material may have an equiaxed grain structure. In some embodiments, the equiaxed grain structure may be formed by squeeze-casting or rheocasting the metal material.

公开(公告)号：US20210020537A1

公开(公告)日：2021-01-21

申请号：US16516692

申请日：2019-07-19

Applicant: Intel Corporation

Inventor： Sergio Antonio Chan Arguedas ,  Manish Dubey ,  Peng Li ,  Aravindha R. Antoniswamy ,  Anup Pancholi

IPC: H01L23/367 ,  H01L23/00

Abstract: Embodiments may relate to a microelectronic package that includes a die coupled with a package substrate. A solder thermal interface material (STIM) may be coupled with the die such that the die is between the STIM and the package substrate. An integrated heat spreader (IHS) may be coupled with the STIM such that the STIM is between the IHS and the die, and the IHS may include a feature that is to control bleed-out of the STIM during STIM reflow based on surface tension of the STIM. Other embodiments may be described or claimed.

公开(公告)号：US10236233B2

公开(公告)日：2019-03-19

申请号：US15711435

申请日：2017-09-21

Applicant: Intel Corporation

Inventor： Aravindha R. Antoniswamy ,  Thomas J. Fitzgerald

IPC: H01L23/00 ,  H01L23/367 ,  B22D19/00 ,  B22D31/00 ,  B23K26/362 ,  F28F21/00 ,  H01L21/48 ,  H01L23/373 ,  F28F3/02 ,  F28F21/08 ,  B22D19/04

Abstract: Embodiments of heat spreaders with integrated preforms, and related devices and methods, are disclosed herein. In some embodiments, a heat spreader may include: a frame formed of a metal material, wherein the metal material is a zinc alloy or an aluminum alloy; a preform secured in the frame, wherein the preform has a thermal conductivity higher than a thermal conductivity of the metal material; and a recess having at least one sidewall formed by the frame. The metal material may have an equiaxed grain structure. In some embodiments, the equiaxed grain structure may be formed by squeeze-casting or rheocasting the metal material.

公开(公告)号：US20170186628A1

公开(公告)日：2017-06-29

申请号：US14998122

申请日：2015-12-23

Applicant: Intel Corporation

Inventor： Aravindha R. Antoniswamy ,  Thomas John Fitzgerald ,  Kumaran Murugesan Chakravarthy ,  Syadwad Jain ,  Wei Hu ,  Zhizhong Tang

IPC: H01L21/48 ,  H01L23/367 ,  F28F21/08 ,  H01L23/373

CPC classification number: H01L23/3736 ,  H01L21/4878 ,  H01L23/3675 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16227 ,  H01L2224/29298 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/10253 ,  H01L2924/1432 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/16153 ,  H01L2924/16172 ,  H01L2924/16251

Abstract: Integrated heat spreaders having electromagnetically-formed features, and semiconductor packages incorporating such integrated heat spreaders, are described. In an example, an integrated heat spreader includes a top plate flattened using an electromagnetic forming process. Methods of manufacturing integrated heat spreaders having electromagnetically-formed features are also described.

公开(公告)号：US11894282B2

公开(公告)日：2024-02-06

申请号：US16446538

申请日：2019-06-19

Applicant: Intel Corporation

Inventor： Zhimin Wan ,  Sergio Antonio Chan Arguedas ,  Peng Li ,  Chandra Mohan Jha ,  Aravindha R. Antoniswamy ,  Cheng Xu ,  Junnan Zhao ,  Ying Wang

IPC: H01L23/367 ,  H01L23/433 ,  H01L23/498 ,  H01L23/053

CPC classification number: H01L23/3675 ,  H01L23/053 ,  H01L23/433 ,  H01L23/49816

Abstract: Disclosed herein are vented lids for integrated circuit (IC) packages, as well as related methods and devices. For example, in some embodiments, an IC package may include a package substrate, a lid, and a die between the package substrate and the lid. A vent may extend between the interior surface and the exterior surface of the lid, and the vent may at least partially overlap the die.

公开(公告)号：US20190079567A1

公开(公告)日：2019-03-14

申请号：US15768915

申请日：2015-11-16

Applicant: Intel Corporation

Inventor： Aravindha R. Antoniswamy ,  Syadwad Jain ,  Zhizhong Tang ,  Wei Hu

IPC: G06F1/20 ,  H01L21/48 ,  H01L23/40 ,  H01L23/373

Abstract: Disclosed herein are embodiments of heat spreaders with interlocked inserts, and related devices and methods. In some embodiments, a heat spreader may include: a frame formed of a first material, wherein the frame includes an opening, a projection of the frame extends into the opening, and the projection has a top surface, a side surface, and a bottom surface; a recess having at least one sidewall formed by the frame; and an insert formed of a second material different from the first material, wherein the insert is disposed in the frame and in contact with the top surface, the side surface, and the bottom surface of the projection.

公开(公告)号：US20170141008A1

公开(公告)日：2017-05-18

申请号：US14942281

申请日：2015-11-16

Applicant: Intel Corporation

Inventor： Aravindha R. Antoniswamy ,  Thomas J. Fitzgerald

IPC: H01L23/367 ,  H01L23/373 ,  B22D31/00 ,  F28F21/00 ,  B23K26/362 ,  B22D19/00 ,  H01L23/00 ,  H01L21/48

CPC classification number: H01L23/3675 ,  B22D19/00 ,  B22D19/04 ,  B22D31/00 ,  B23K26/362 ,  F28F3/02 ,  F28F21/00 ,  F28F21/08 ,  H01L21/4882 ,  H01L23/3731 ,  H01L23/3732 ,  H01L23/3736 ,  H01L24/83

Abstract: Embodiments of heat spreaders with integrated preforms, and related devices and methods, are disclosed herein. In some embodiments, a heat spreader may include: a frame formed of a metal material, wherein the metal material is a zinc alloy or an aluminum alloy; a preform secured in the frame, wherein the preform has a thermal conductivity higher than a thermal conductivity of the metal material; and a recess having at least one sidewall formed by the frame. The metal material may have an equiaxed grain structure. In some embodiments, the equiaxed grain structure may be formed by squeeze-casting or rheocasting the metal material.