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公开(公告)号：US11917790B2
公开(公告)日：2024-02-27
申请号：US16859202
申请日：2020-04-27
Applicant: Intel Corporation
Inventor： Prabhakar Subrahmanyam , Casey Winkel , Yingqiong Bu , Ming Zhang , Yuehong Fan , Yi Xia , Ying-Feng Pang
IPC: H05K7/20
CPC classification number: H05K7/20154 , H05K7/209 , H05K7/20209 , H05K7/20927
Abstract: The present disclosure is directed to systems and methods of improving the thermal performance of processor-based devices. Such thermal performance improvement may include limiting the degree of tilt experienced by a semiconductor device as a thermal solution coupled to the semiconductor device is tightened to the substrate. Such thermal performance improvements may include increasing the available heat transfer area associated with a particular heat producing semiconductor device. Such thermal performance improvements may include thermally coupling one or more cool blocks thermally coupled to one or more remote heat-producing devices to a central cool block that may be cooled using a cooling medium or coupled to a central heat-producing semiconductor device.
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Patent Agency Ranking
公开(公告)号：US20220091645A1
公开(公告)日：2022-03-24
申请号：US17543398
申请日：2021-12-06
Applicant: Intel Corporation
Inventor： Yanbing Sun , Xiaoguo Liang , Haifeng Gong , Ming Zhang
Abstract: Provided are devices and methods relating to temperature control in a solid state drive (SSD). One embodiment include a SSD including a housing including a plurality of sides surrounding an interior region. The SSD includes at least one vent on the housing, the at least one vent configured to be opened and closed in response to a signal. The SSD also includes a temperature sensor and a controller, the controller configured to send a signal to open the at least one vent when a temperature sensed inside the interior region reaches a first temperature, and the controller configured to close the at least one vent when a temperature sensed inside the interior region reaches a second temperature, wherein the first temperature is greater than the second temperature. Other embodiments are described and claimed.
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公开(公告)号：US11194372B2
公开(公告)日：2021-12-07
申请号：US16642161
申请日：2017-09-29
Applicant: INTEL CORPORATION
Inventor： Yanbing Sun , Xiaoguo Liang , Haifeng Gong , Ming Zhang
Abstract: Provided are devices and methods relating to temperature control in a solid state drive (SSD). A SSD (10, 110, 210, 310, 410, 510, 610, 710) including a housing (12, 112, 212, 312, 412, 512, 612, 712) including a plurality of sides surrounding an interior region. The SSD (10, 110, 210, 310, 410, 510, 610, 710) includes at least one vent (14, 114, 214, 314, 414, 514, 614, 714) on the housing (12, 112, 212, 312, 412, 512, 612, 712), the at least one vent (14, 114, 214, 314, 414, 514, 614, 714) configured to be opened and closed in response to a signal. The SSD (10, 110, 210, 310, 410, 510, 610, 710) also includes a temperature sensor and a controller, the controller configured to send a signal to open the at least one vent (14, 114, 214, 314, 414, 514, 614, 714) when a temperature sensed inside the interior region reaches a first temperature, and the controller configured to close the at least one vent (14, 114, 214, 314, 414, 514, 614, 714) when a temperature sensed inside the interior region reaches a second temperature, wherein the first temperature is greater than the second temperature.
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公开(公告)号：US20170059263A1
公开(公告)日：2017-03-02
申请号：US15122424
申请日：2014-03-31
Applicant: Yanbing SUN , Mark MACDONALD , Jiancheng TAO , Intel Corporation
Inventor： Yanbing Sun , Mark MacDonald , Jiancheng Tao , Ming Zhang
CPC classification number: F28G7/00 , B08B7/026 , F28G15/003 , G05B15/02 , G06F1/203 , H05K7/20181
Abstract: A system and method are disclosed for using a sonic frequency to induce a vibration useful for clearing dust accumulation from microelectronics, such as a laptop computer. A speaker driver may be mounted onto a support structure for a heat exchanger (220). At an advantageous time, such as boot up, a sonic frequency may be driven onto the speaker (250), thus inducing vibration in the heat exchanger (220) and helping to clear dust accumulation. In some cases, a resonant frequency may be used to optimize the amount of vibration per unit power delivery.
Abstract translation: 公开了一种系统和方法，用于使用声频来引起用于清除诸如膝上型计算机之类的微电子的灰尘积聚的振动。 扬声器驱动器可以安装在用于热交换器（220）的支撑结构上。 在有利的时间，例如引导，声音频率可以被驱动到扬声器（250）上，从而引起热交换器（220）中的振动并帮助清除灰尘积聚。 在某些情况下，可以使用谐振频率来优化每单位功率输送的振动量。
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公开(公告)号：US10528473B2
公开(公告)日：2020-01-07
申请号：US15621401
申请日：2017-06-13
Applicant: Intel Corporation
Inventor： Christopher Wilkerson , Muhammad M. Khellah , Vivek De , Ming Zhang , Jaume Abella , Javier Carretero Casado , Pedro Chaparro Monferrer , Xavier Vera , Antonio Gonzalez
IPC: G06F12/00 , G06F12/0864 , G06F12/0804 , G06F1/3234
Abstract: Methods and apparatus relating to disabling one or more cache portions during low voltage operations are described. In some embodiments, one or more extra bits may be used for a portion of a cache that indicate whether the portion of the cache is capable at operating at or below Vccmin levels. Other embodiments are also described and claimed.
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公开(公告)号：US09857848B2
公开(公告)日：2018-01-02
申请号：US15120352
申请日：2014-03-27
Applicant: Intel Corporation
Inventor： Xiaoguo Liang , Cheng Feng , Jiancheng Tao , Ming Zhang , Hong W. Wong , Zhi Wei
CPC classification number: G06F1/1681 , E05D11/082 , E05Y2201/462 , E05Y2900/606 , G06F1/1616 , G06F1/1677 , G06F3/016
Abstract: A control mechanism and method for a hybrid hinge for electronic devices are disclosed. A particular embodiment includes: a hybrid hinge for an electronic device, the hybrid hinge comprising: a pivot; and an auxiliary component including one or more electro-magnetic or electro-mechanical devices and a variable electrical power source, the one or more electro-magnetic or electro-mechanical devices being configured to apply a variable degree of torque force to the pivot based on a degree of electrical power supplied by the electrical power source.
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