公开(公告)号：US20140175655A1

公开(公告)日：2014-06-26

申请号：US13911075

申请日：2013-06-06

Applicant: Industrial Technology Research Institute

Inventor： Jui-Chin Chen ,  Cha-Hsin Lin ,  Tzu-Kun Ku

IPC: H01L23/00

CPC classification number: H01L24/80 ,  H01L21/7684 ,  H01L23/481 ,  H01L24/03 ,  H01L24/05 ,  H01L24/08 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0346 ,  H01L2224/03614 ,  H01L2224/03616 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/05541 ,  H01L2224/05547 ,  H01L2224/05548 ,  H01L2224/05551 ,  H01L2224/05647 ,  H01L2224/0807 ,  H01L2224/08146 ,  H01L2224/08147 ,  H01L2224/08148 ,  H01L2224/11845 ,  H01L2224/1191 ,  H01L2224/16145 ,  H01L2224/80097 ,  H01L2224/80345 ,  H01L2224/80895 ,  H01L2224/80896 ,  H01L2224/81203 ,  H01L2224/81895 ,  H01L2924/00014

Abstract: A chip bonding structure at least includes a first substrate, a second substrate opposite to the first substrate, and a copper bonding structure sandwiched in between the first and the second substrates. A Cu—Cu bonding interface is within the copper bonding structure and is characterized with combinations of protrusions and recesses, and the copper crystallization orientation at one side of the Cu—Cu bonding interface is different from that at another side.

Abstract translation: 芯片接合结构至少包括第一基板，与第一基板相对的第二基板和夹在第一和第二基板之间的铜接合结构。 Cu-Cu键合界面在铜结合结构内，其特征在于突起和凹陷的组合，Cu-Cu键合界面一侧的铜结晶取向与另一侧不同。