公开(公告)号：US20240136380A1

公开(公告)日：2024-04-25

申请号：US18491920

申请日：2023-10-22

Applicant: Infineon Technologies AG

Inventor： Stefano PARASCANDOLA ,  Dirk OFFENBERG

IPC: H01L27/146

CPC classification number: H01L27/14627 ,  H01L27/14629 ,  H01L27/14632 ,  H01L27/14685

Abstract: An active pixel sensor includes at least one pixel, including: a photoactive area, and at least one polysilicon component arranged over the photoactive area such that a photon may pass the polysilicon component prior to entering the photoactive area, wherein the polysilicon component includes a diffraction structure configured to diffract incoming photons and thereby extend the light path of the incoming photons within the photoactive area.

公开(公告)号：US20230071209A1

公开(公告)日：2023-03-09

申请号：US17823397

申请日：2022-08-30

Applicant: Infineon Technologies AG

Inventor： Hans TADDIKEN ,  Dirk OFFENBERG ,  Trinath Reddy PINNAPA ,  Steffen ROTHENHAEUSSER

IPC: H01L31/102 ,  G01S7/481 ,  G01S17/32 ,  G01S7/4915 ,  H01L27/144 ,  H01L31/18 ,  H01L31/0352

Abstract: A time of flight sensor includes at least one pixel, including: an epitaxially-grown Ge-based photosensitive structure including an upper portion and a trunk portion, a Si-based photocurrent collecting structure, a dielectric material layer arranged at least between the upper portion of the photosensitive structure and the photocurrent collecting structure, wherein the trunk portion of the photosensitive structure is arranged within an aperture in the dielectric material layer, and at least one n-contact configured to collect electrons of a photocurrent and at least one p-contact configured to collect holes of the photocurrent, the at least one n-contact and p-contact arranged in the photocurrent collecting structure.

公开(公告)号：US20140284663A1

公开(公告)日：2014-09-25

申请号：US14186390

申请日：2014-02-21

Applicant: Infineon Technologies AG

Inventor： Dirk MEINHOLD ,  Emanuele Bruno BODINI ,  Felix BRAUN ,  Hermann GRUBER ,  Uwe HOECKELE ,  Dirk OFFENBERG ,  Klemens PRUEGL ,  Ines UHLIG

IPC: H01L27/146 ,  H01L27/148

CPC classification number: H01L27/14689 ,  H01L27/14609 ,  H01L27/14627 ,  H01L27/14629 ,  H01L27/14687 ,  H01L27/14806

Abstract: Embodiments related to a method of manufacturing of an imager and an imager device are shown and depicted.

Abstract translation: 示出并描绘了与成像器和成像器件的制造方法有关的实施例。

公开(公告)号：US20140077066A1

公开(公告)日：2014-03-20

申请号：US14033317

申请日：2013-09-20

Applicant: Infineon Technologies AG

Inventor： Dirk OFFENBERG ,  Henning FEICK ,  Stefano PARASCANDOLA

IPC: H01L27/146

CPC classification number: H01L27/14856 ,  G01S7/4865 ,  G01S7/4914 ,  H01L27/14601 ,  H01L27/14683 ,  H04N5/369

Abstract: Embodiments related to the manufacturing of an imager device and an imager device are disclosed. Embodiments associated with methods of an imager device are also disclosed.

Abstract translation: 公开了与成像装置和成像装置的制造有关的实施例。 还公开了与成像器装置的方法相关联的实施例。