公开(公告)号：US20240027512A1

公开(公告)日：2024-01-25

申请号：US18336939

申请日：2023-06-16

Applicant: Innolux Corporation

Inventor： Ker-Yih Kao ,  Kuang-Ming Fan ,  Wang-Chih Tsai ,  Chien-Li Lin

IPC: G01R31/26 ,  G01N21/84

CPC classification number: G01R31/2607 ,  G01N21/84

Abstract: A measuring equipment and a measuring method for measuring electronic properties and optical properties are disclosed. The measuring equipment is used to measure electronic and optical properties. The measuring equipment includes a test socket, a light-emitting element circuit, an optical device, a signal conversion circuit, and a control host. The test socket has measuring probes. The test socket tests the electronic properties of the semiconductor device through the measuring probes. The light-emitting element circuit has a light-emitting element. The optical device measures the optical properties of the light-emitting element. The signal conversion circuit converts the electronic properties to an electronic signal. The control host analyzes and stores the electronic signal and the optical properties.

公开(公告)号：US11798875B2

公开(公告)日：2023-10-24

申请号：US17535167

申请日：2021-11-24

Applicant: InnoLux Corporation

Inventor： Chung-Chun Cheng ,  Kuang-Ming Fan ,  Yao-Wen Hsu

IPC: H05K1/11 ,  H05K1/02 ,  H01L23/498 ,  H01L21/48 ,  H01L23/00

CPC classification number: H01L23/49838 ,  H01L21/4857 ,  H01L24/19 ,  H01L24/20 ,  H05K1/11 ,  H05K1/111 ,  H01L23/49822 ,  H01L2224/19 ,  H01L2224/214 ,  H05K1/0268 ,  H05K2201/0338 ,  H05K2201/0347 ,  H05K2201/09372

Abstract: An electronic component includes: an insulating layer; and a first metal bump disposed on the insulating layer and provided with: a first metal layer disposed on the insulating layer; and a second metal layer disposed on the first metal layer, wherein, in a cross-sectional view of the electronic component, the first metal layer has a first width, the second metal layer has a second width, and the first width is smaller than the second width.

公开(公告)号：US11693285B2

公开(公告)日：2023-07-04

申请号：US17477862

申请日：2021-09-17

Applicant: InnoLux Corporation

Inventor： Tai-Chi Pan ,  Chin-Lung Ting ,  I-Chang Liang ,  Chih-Chiang Chang Chien ,  Po-Wen Lin ,  Kuang-Ming Fan ,  Sheng-Nan Chen

IPC: G02F1/1362 ,  G02F1/1335 ,  G02F1/1337

CPC classification number: G02F1/136259 ,  G02F1/133504 ,  G02F1/133516 ,  G02F1/133562 ,  G02F1/133788 ,  G02F1/133528

Abstract: An electronic device is disclosed. The electronic device includes a panel, a defect in and/or on the panel and an optical film above the panel. The panel includes a first substrate, a second substrate disposed opposite to the first substrate, and a plurality of display units disposed on the first substrate. There is a defect between the first substrate and the second substrate, or on the second substrate. In a top view of the electronic device, an optical film has a first processed area corresponding to the defect, and the first processed area at least partially overlaps at least two display units.

公开(公告)号：US20230178452A1

公开(公告)日：2023-06-08

申请号：US17828039

申请日：2022-05-31

Applicant: Innolux Corporation

Inventor： Chin-Lung Ting ,  Liang-Lu Chen ,  Kuang-Ming Fan ,  Chia-Lin Yang ,  Chun-Hung Chen

IPC: H01L23/367 ,  H01L23/00 ,  H01L21/48 ,  H01L21/66

CPC classification number: H01L23/3677 ,  H01L21/4882 ,  H01L22/32 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/211 ,  H01L2224/214 ,  H01L2224/2101 ,  H01L2224/2105 ,  H01L2924/3511 ,  H01L2924/30105 ,  H01L2924/35121

Abstract: An electronic device and a manufacturing method thereof are disclosed. The electronic device includes a connector, an electronic component, and a heat sink. The connector has at least one conductive structure and at least one first heat dissipation structure. The at least one conductive structure and the at least one first heat dissipation structure are physically separated and electrically insulated from each other. The electronic component is electrically connected to the at least one conductive structure. The heat sink is connected to the at least one first heat dissipation structure. The heat sink and the electronic component are disposed on opposite sides of the connector.