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公开(公告)号：US20230421135A1
公开(公告)日：2023-12-28
申请号：US18325083
申请日：2023-05-29
Applicant: Innolux Corporation
Inventor： Chia-Ping Tseng , Yan-Zheng Wu
CPC classification number: H03H11/245 , H01L23/585 , H01L27/1255
Abstract: A modulation device includes a substrate, a metal layer, at least one driving element, and a modulation unit. The metal layer is disposed on the substrate and has at least one hole. The at least one driving element is disposed on the substrate and overlapped with the at least one hole. The modulation unit is electrically connected to the at least one driving element.
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公开(公告)号：US20230118076A1
公开(公告)日：2023-04-20
申请号：US17955510
申请日：2022-09-28
Applicant: Innolux Corporation
Inventor： Yan-Zheng Wu , Ming-Sheng Lai
Abstract: An electronic device, including a substrate and multiple modulation units, is provided. The modulation units are disposed on the substrate. Each modulation unit includes a first electronic element, a second electronic element, a first signal line, a second signal line, and a third signal line. The first signal line provides a first voltage to the first electronic element. The second signal line provides a second voltage to the second electronic element. The third signal line provides a third voltage to the first electronic element and/or the second electronic element. The first voltage is different from the second voltage, and the third voltage is different from the first voltage and/or the second voltage.
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公开(公告)号：US20220201864A1
公开(公告)日：2022-06-23
申请号：US17535572
申请日：2021-11-25
Applicant: Innolux Corporation
Inventor： Chen-Lin Yeh , Ming-Sheng Lai , Yan-Zheng Wu
IPC: H05K1/18
Abstract: An electronic device includes a substrate, a plurality of conductive patterns, and a tunable element. A plurality of conductive patterns are disposed on the substrate. The tunable element is disposed on at least one conductive pattern in the plurality of conductive patterns and includes a first pad, a second pad, and a third pad. The first pad, the second pad, and the third pad are separated from each other. The first pad and the second pad are overlapped with the at least one conductive pattern in the plurality of conductive patterns. The third pad is disposed between the first pad and the second pad.
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公开(公告)号：US20250125178A1
公开(公告)日：2025-04-17
申请号：US18830572
申请日：2024-09-10
Applicant: Innolux Corporation
Inventor： Chen-Lin Yeh , Yan-Zheng Wu
IPC: H01L21/68 , H01L21/67 , H01L21/687
Abstract: Disclosed is a method of transferring a target object to a target substrate including the following steps; first, defining a plurality of units recurring on the target substrate, wherein one of the plurality of units is made up of a plurality of target locations on the target substrate; next, disposing the plurality of target objects on a unit transfer stamp, wherein the plurality of target objects on the unit transfer stamp correspond to the plurality of target locations; afterwards, transferring the plurality of target objects to the target substrate using the unit transfer stamp; then, transferring at least one target object to the remaining target locations on the target substrate.
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公开(公告)号：US12212075B2
公开(公告)日：2025-01-28
申请号：US17748057
申请日：2022-05-19
Applicant: Innolux Corporation
Inventor： Ying-Jen Chen , Chih-Yung Hsieh , Yan-Zheng Wu
Abstract: The disclosure provides an electronic device. The electronic device includes a plurality of units. Each of the units includes an integrated substrate. The integrated substrate includes a first dielectric layer, a first conductive layer, a second dielectric layer, and a second conductive layer. The first dielectric layer has a first side and a second side opposite to the first side. The first conductive layer is disposed on the first side. The second dielectric layer has a third side facing the second side and a fourth side opposite to the third side. The second conductive layer is disposed on the fourth side. A loss tangent of at least one of the first dielectric layer and the second dielectric layer is less than or equal to 0.1 and greater than 0. The electronic device of an embodiment of the disclosure may improve product yield.
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Patent Agency Ranking
公开(公告)号：US20240356234A1
公开(公告)日：2024-10-24
申请号：US18602036
申请日：2024-03-12
Applicant: Innolux Corporation
Inventor： Yan-Zheng Wu , Yung-Wei Chen , Chen-Lin Yeh
CPC classification number: H01Q15/002 , H01Q3/44
Abstract: Disclosed is a reconfigurable surface configured to modulate a phase of an electromagnetic wave. The reconfigurable surface includes a first substrate, a plurality of modulating units, and a ground signal layer. The plurality of modulating units are disposed on the first substrate. One of the plurality of modulating units includes a first electrode, a second electrode, and a modulating medium. The first electrode is disposed on the first substrate. The second electrode is disposed adjacent to the first electrode. The modulating medium is located between the first electrode and the second electrode. The ground signal layer is disposed under the first substrate. A manufacturing method of a reconfigurable surface is also provided.
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公开(公告)号：US20230335508A1
公开(公告)日：2023-10-19
申请号：US18186970
申请日：2023-03-21
Applicant: Innolux Corporation
Inventor： Jia-Sin Lin , Yi-Hung Lin , Yan-Zheng Wu , Chen-Lin Yeh
IPC: H01L23/58 , H01L29/417 , H01L21/3213 , H01L23/552
CPC classification number: H01L23/585 , H01L29/41733 , H01L21/32131 , H01L23/552
Abstract: An electronic device and a repair method thereof are provided. The repair method of the electronic device includes: providing a panel, wherein the panel includes a substrate, a first conductive layer disposed on the substrate, a transistor disposed on the substrate, and a dielectric layer disposed between the first conductive layer and the transistor, wherein the transistor comprises a first electrode and a second electrode; and cutting at least one of the first electrode and the second electrode with a laser beam, wherein a cutting point formed by the laser beam does not overlap with the first conductive layer.
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公开(公告)号：US11737214B2
公开(公告)日：2023-08-22
申请号：US17535572
申请日：2021-11-25
Applicant: Innolux Corporation
Inventor： Chen-Lin Yeh , Ming-Sheng Lai , Yan-Zheng Wu
CPC classification number: H05K1/181 , H01Q3/28 , H01Q3/34 , H05K1/0219 , H05K2201/1003 , H05K2201/10015 , H05K2201/10022 , H05K2201/10106 , H05K2201/10166 , H05K2201/10196 , H05K2201/10522 , H05K2201/10636 , H05K2201/10674
Abstract: An electronic device includes a substrate, a plurality of conductive patterns, and a tunable element. A plurality of conductive patterns are disposed on the substrate. The tunable element is disposed on at least one conductive pattern in the plurality of conductive patterns and includes a first pad, a second pad, and a third pad. The first pad, the second pad, and the third pad are separated from each other. The first pad and the second pad are overlapped with the at least one conductive pattern in the plurality of conductive patterns. The third pad is disposed between the first pad and the second pad.
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公开(公告)号：US20230170603A1
公开(公告)日：2023-06-01
申请号：US17975566
申请日：2022-10-27
Applicant: Innolux Corporation
Inventor： Chung-Chun Cheng , Chia-Chi Ho , Chia-Ping Tseng , Yan-Zheng Wu , Yao-Wen Hsu
CPC classification number: H01Q1/2283 , H01Q1/38
Abstract: An electronic device including a substrate, a first metal pattern, a first insulating pattern, and a second metal pattern is provided. The first metal pattern is disposed on the substrate. The first insulating pattern is disposed on the first metal pattern. The second metal pattern is disposed on the first metal pattern and the first insulating pattern. The second metal pattern includes a first contact portion and a second contact portion. In a cross-sectional view, the first contact portion and the second contact portion are in contact with the first metal pattern, and the first insulating pattern is in contact with the first metal pattern and the second metal pattern between the first contact portion and the second contact portion.
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公开(公告)号：US20220393346A1
公开(公告)日：2022-12-08
申请号：US17748057
申请日：2022-05-19
Applicant: Innolux Corporation
Inventor： Ying-Jen Chen , Chih-Yung Hsieh , Yan-Zheng Wu
Abstract: The disclosure provides an electronic device. The electronic device includes a plurality of units. Each of the units includes an integrated substrate. The integrated substrate includes a first dielectric layer, a first conductive layer, a second dielectric layer, and a second conductive layer. The first dielectric layer has a first side and a second side opposite to the first side. The first conductive layer is disposed on the first side. The second dielectric layer has a third side facing the second side and a fourth side opposite to the third side. The second conductive layer is disposed on the fourth side. A loss tangent of at least one of the first dielectric layer and the second dielectric layer is less than or equal to 0.1 and greater than 0. The electronic device of an embodiment of the disclosure may improve product yield.
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