-
公开(公告)号：US20250118895A1
公开(公告)日：2025-04-10
申请号：US18984922
申请日：2024-12-17
Applicant: Innolux Corporation
Inventor： Ying-Jen Chen , Chih-Yung Hsieh , Yan-Zheng Wu
Abstract: An electronic device includes a board, a chip, a first conductive element and a second conductive element. The board has a first surface and a second surface opposite to the first surface. The board has a first through hole penetrating from the first surface to the second surface. The first conductive element is disposed between the board and the chip. The second conductive element has a first portion and a second portion connected to the first portion. The first conductive element is disposed between the first portion of the second conductive element and the board and overlaps with the first portion of the second conductive element. In a cross-sectional view of the electronic device, the second portion of the second conductive element directly contacts a side surface of the first conductive element and extends into the first through of the board.
-
公开(公告)号：US11803086B2
公开(公告)日：2023-10-31
申请号：US17535587
申请日：2021-11-25
Applicant: Innolux Corporation
Inventor： Chen-Lin Yeh , Chung-Kuang Wei , Jen-Hai Chi , Yan-Zheng Wu
IPC: G02F1/1345 , G02F1/1337 , G02F1/1339
CPC classification number: G02F1/13458 , G02F1/1337 , G02F1/1339
Abstract: An electronic device and a manufacturing method thereof are provided. The manufacturing method of the electronic device includes: providing a substrate; providing an adjustable element, including a liquid crystal layer; and bonding the adjustable element onto the substrate.
-
公开(公告)号：US20250150061A1
公开(公告)日：2025-05-08
申请号：US18902949
申请日：2024-10-01
Applicant: Innolux Corporation
Inventor： Yan-Zheng Wu
Abstract: Disclosed is an electronic device including a substrate, a radio frequency (RF) modulation element, a control circuit and a radio frequency (RF) choke. The RF modulation element, the control circuit and the RF choke are disposed on the substrate. The RF choke is electrically coupled between the RF modulation element and the control circuit. The orthographic projections of the RF modulation element, the control circuits and the RF choke on the substrate do not overlap each other.
-
公开(公告)号：US12125829B2
公开(公告)日：2024-10-22
申请号：US18093331
申请日：2023-01-05
Applicant: InnoLux Corporation
Inventor： Jen-Hai Chi , Chia-Ping Tseng , Chen-Lin Yeh , Yan-Zheng Wu
CPC classification number: H01L25/072 , H01L23/3121 , H01L23/481 , H01L23/49822 , H01L23/66 , H01L24/16 , H01L2223/6677 , H01L2224/16227
Abstract: An electronic device includes a carrier, a plurality of electronic elements and a connecting terminal. The carrier has at least one bonding pad. The electronic elements are disposed on the carrier, and each of the electronic elements includes a substrate. A distance between two adjacent substrates of the electronic elements is not less than 300 μm. The connecting terminal is disposed between one of the substrate and the carrier. One of the electronic elements are electrically connected to the at least one bonding pad via the connecting terminal.
-
公开(公告)号：US20240069083A1
公开(公告)日：2024-02-29
申请号：US18360772
申请日：2023-07-27
Applicant: Innolux Corporation
Inventor： Chih-Yung Hsieh , Yan-Zheng Wu
IPC: G01R29/08
CPC classification number: G01R29/0878
Abstract: A detection device detects an output electromagnetic wave signal passing through a test object. The detection device includes an electromagnetic wave signal generating unit, an output element, a receiving element and a measuring unit. The electromagnetic wave signal generating unit is used for generating an initial electromagnetic wave signal. The output element is used for outputting the initial electromagnetic wave signal. The receiving element is used for receiving the output electromagnetic wave signal. The measuring unit is used for measuring the value of the output electromagnetic wave signal.
-
Patent Agency Ranking
公开(公告)号：US20240047633A1
公开(公告)日：2024-02-08
申请号：US18347584
申请日：2023-07-06
Applicant: Innolux Corporation
Inventor： Yi-Hung Lin , Yeong-E Chen , Yan-Zheng Wu
IPC: H01L33/62 , H01L25/075
CPC classification number: H01L33/62 , H01L25/0753 , H01L2933/0066
Abstract: An electronic device and a manufacturing method thereof are provided. The electronic device includes a substrate, a first metal layer, a first insulating layer, a second metal layer, and a second insulating layer. The first metal layer is disposed on the substrate and configured to transmit a ground signal. The first insulating layer is disposed on the first metal layer and includes at least one first opening. The second metal layer is disposed on the first insulating layer and electrically connected to the first metal layer through the at least one first opening. The second insulating layer is disposed on the second metal layer and includes at least one second opening. In the top view direction, the at least one first opening is separated from the at least one second opening. The electronic device in the embodiments of the disclosure and the manufacturing method thereof may improve the process yield.
-
公开(公告)号：US20220216302A1
公开(公告)日：2022-07-07
申请号：US17561716
申请日：2021-12-24
Applicant: Innolux Corporation
Inventor： Chen-Lin Yeh , Chin-Lung Ting , Chung-Kuang Wei , Jen-Hai Chi , Yi-Hung Lin , Yan-Zheng Wu
Abstract: Disclosed is an electronic device, including a substrate, a first electrode, a second electrode, a modulation element, a first solder, and a switch element. The first electrode is disposed on the substrate. The second electrode is disposed on the substrate. The modulation element is disposed on the substrate and includes at least two connecting pads. The first solder is disposed between the first electrode and one connecting pad of the modulation element. The switch element is disposed on the substrate. The one connecting pad of the modulation element is electrically connected to the switch element sequentially through the first solder, the first electrode, and the second electrode.
-
公开(公告)号：US20240223246A1
公开(公告)日：2024-07-04
申请号：US18533195
申请日：2023-12-08
Applicant: Innolux Corporation
Inventor： Chen-Lin Yeh , Yan-Zheng Wu , Jen-Hai Chi , Chih-Yung Hsieh
IPC: H04B7/0456 , H04B7/0426 , H04B7/155
CPC classification number: H04B7/0478 , H04B7/043 , H04B7/15564
Abstract: A modulation method and a modulation device for modulating beamforming are provided. The modulation method includes: providing a memory element that stores a beamforming table; providing a driving element; providing a plurality of modulation element groups; providing a signal source to provide at least one initial electromagnetic wave to the modulation element groups; providing a plurality of driving signals corresponding to the modulation element groups according to the beamforming table by the driving element; modulating the at least one initial electromagnetic wave to be a main wave beam with a specific radiation waveform according to the drive signals by the modulation element groups.
-
公开(公告)号：US20240164027A1
公开(公告)日：2024-05-16
申请号：US18479125
申请日：2023-10-02
Applicant: Innolux Corporation
Inventor： Ying-Jen Chen , Yan-Zheng Wu
IPC: H05K3/46
CPC classification number: H05K3/4635 , H05K3/4697 , H05K3/0014
Abstract: A manufacturing method of an electronic device includes the following steps. First, a curved substrate is formed. Next, a first conductive layer is formed on a first insulating layer. Then, a second conductive layer is formed on a second insulating layer. Thereafter, the first insulating layer and the second insulating layer are bonded to the curved substrate. The manufacturing method of the electronic device may reduce problems such as peeling and/or offset of the manufactured electronic device.
-
公开(公告)号：US20240030580A1
公开(公告)日：2024-01-25
申请号：US18331946
申请日：2023-06-09
Applicant: Innolux Corporation
Inventor： Chen-Lin Yeh , Yan-Zheng Wu , Yung-Wei Chen
CPC classification number: H01P3/081 , H01P11/003 , H05K1/0243 , H05K3/06 , H05K3/423 , H05K3/368 , H05K2201/10151 , H05K2201/10196 , H05K2201/10098 , H05K2201/09545 , H05K2201/09618 , H05K2201/09609 , H05K3/0029
Abstract: An electronic device includes a glass substrate, a first metal layer, a second metal layer, and a third metal layer. The glass substrate includes a first surface, a second surface corresponding to the first surface, and at least two first through holes. The first through hole includes a third surface, and the third surface is connected to the first surface and the second surface. A first conductive layer is disposed on the first surface. A second conductive layer is disposed on the second surface. A third conductive layer is disposed on the third surface and is electrically connected to the first conductive layer and the second conductive layer. The first through hole has a major axis and a minor axis in a top view direction. A method of manufacturing the electronic device is also included.
-
-
-
-
-
-
-
-
-
Search Results
31
records
(took 0.014 seconds)
