公开(公告)号：US20230178534A1

公开(公告)日：2023-06-08

申请号：US17989682

申请日：2022-11-18

Applicant: Innolux Corporation

Inventor： Jia-Sin Lin ,  Wen-Chi Fang ,  Jen-Hai Chi ,  Zhi-Fu Huang ,  Pei-Chi Chen ,  Wan-Chun Tsai

IPC: H01L25/18 ,  H01L29/786 ,  H01L29/93 ,  H01L25/00

CPC classification number: H01L25/18 ,  H01L29/78678 ,  H01L29/78669 ,  H01L29/7869 ,  H01L29/93 ,  H01L25/50

Abstract: This disclosure provides a communication device and a manufacturing method thereof. The manufacturing method of the communication device includes the following steps: providing a first dielectric layer, wherein the first dielectric layer includes a first region and a second region, and the first dielectric layer has a first surface and a second surface opposite to the first surface; providing a second dielectric layer; combining the first dielectric layer and the second dielectric layer with a sealing element, so that the sealing element is disposed between the first surface of the first dielectric layer and a third surface of the second dielectric layer; after combining the first dielectric layer and the second dielectric layer, thinning the second surface of the first dielectric layer; and disposing a first communication element on the first surface of the first dielectric layer in the first region.

公开(公告)号：US20230335508A1

公开(公告)日：2023-10-19

申请号：US18186970

申请日：2023-03-21

Applicant: Innolux Corporation

Inventor： Jia-Sin Lin ,  Yi-Hung Lin ,  Yan-Zheng Wu ,  Chen-Lin Yeh

IPC: H01L23/58 ,  H01L29/417 ,  H01L21/3213 ,  H01L23/552

CPC classification number: H01L23/585 ,  H01L29/41733 ,  H01L21/32131 ,  H01L23/552

Abstract: An electronic device and a repair method thereof are provided. The repair method of the electronic device includes: providing a panel, wherein the panel includes a substrate, a first conductive layer disposed on the substrate, a transistor disposed on the substrate, and a dielectric layer disposed between the first conductive layer and the transistor, wherein the transistor comprises a first electrode and a second electrode; and cutting at least one of the first electrode and the second electrode with a laser beam, wherein a cutting point formed by the laser beam does not overlap with the first conductive layer.

公开(公告)号：US20230171896A1

公开(公告)日：2023-06-01

申请号：US17976866

申请日：2022-10-30

Applicant: Innolux Corporation

Inventor： Pei-Chi Chen ,  Wen-Chi Fang ,  Jen-Hai Chi ,  Zhi-Fu Huang ,  Jia-Sin Lin ,  Wan-Chun Tsai

IPC: H05K3/00 ,  H05K3/30

CPC classification number: H05K3/0044 ,  H05K3/30 ,  H05K2203/0228 ,  H05K2203/0264 ,  H05K2203/025 ,  H05K2201/10106 ,  H05K2201/10174

Abstract: A manufacturing method of an electronic device including following steps is provided. A first substrate is provided. A thermal release adhesive layer is provided on the first substrate. A thinning process is performed on the first substrate to form a first thinned substrate. A cutting process is performed on the first thinned substrate to form a first sub-substrate. The thermal release adhesive layer is separated from the first thinned substrate or the first sub-substrate. In the manufacturing method of the electronic device provided in one or more embodiments of the disclosure, the manufacturing process of the electronic device may be simplified, and/or defects of the resultant electronic device may be reduced.