公开(公告)号：US20240055779A1

公开(公告)日：2024-02-15

申请号：US18347587

申请日：2023-07-06

Applicant: Intel Corporation

Inventor： Maruti TAMRAKAR ,  Prathibha PEDDIREDDY ,  Jayprakash THAKUR ,  Anoop PARCHURU ,  Prasanna PICHUMANI

IPC: H01Q21/28

CPC classification number: H01Q21/28

Abstract: A circuitry including a first antenna configured to communicate via a first RAT; including a substrate; and a second antenna located on the substrate of the first antenna configured to communicate via a second RAT, wherein communication via the first RAT does not interfere with communication via the second RAT.

公开(公告)号：US20230361802A1

公开(公告)日：2023-11-09

申请号：US18029932

申请日：2020-11-03

Applicant: Intel Corporation

Inventor： Jayprakash THAKUR ,  Ofir DEGANI ,  Ronen KRONFELD ,  Ehud RESHEF ,  Seong-Youp J. SUH ,  Tal SHOSHANA ,  Eytan MANN ,  Maruti TAMRAKAR ,  Ashoke RAVI ,  Jose Rodrigo CAMACHO PEREZ ,  Timo Sakari HUUSARI ,  Eli BOROKHOVICH ,  Amir RUBIN ,  Ofer BENJAMIN ,  Tae Young YANG ,  Harry SKINNER ,  Kwan ho LEE ,  Jaejin LEE ,  Dong-Ho Han ,  Shahar GROSS ,  Eran SEGEV ,  Telesphor KAMGAING

IPC: H04B1/40

CPC classification number: H04B1/40

Abstract: In various aspects, a radio frequency circuit is provided. The radio frequency circuit may include a substrate that may include a radio frequency front-end to antenna (RF FE-to-Ant) connector. The RF FE-to-Ant connector may include a conductor track structure and a substrate connection structure coupled to the conductor track structure. The substrate may include radio frequency front-end circuitry monolithically integrated in the substrate. The substrate connection structure may include at least one of a solderable structure, a weldable structure, or an adherable structure. The substrate connection structure may be configured to form at least one radio frequency signal interface with an antenna circuit connection structure of a substrate-external antenna circuit. The substrate may include an edge region. The substrate connection structure may be disposed in the edge region.

公开(公告)号：US20230198123A1

公开(公告)日：2023-06-22

申请号：US18057802

申请日：2022-11-22

Applicant: Intel Corporation

Inventor： Maruti TAMRAKAR ,  Jay Vishnu GUPTA ,  Jayprakash THAKUR ,  Sagar GUPTA ,  Sandeep MASTI

IPC: H01Q1/22 ,  H01Q1/36 ,  G06F1/16

CPC classification number: H01Q1/2266 ,  H01Q1/36 ,  G06F1/1681 ,  G06F1/1698

Abstract: A portable computing device comprises a first body portion, a second body portion and a hinge connecting the first body portion and the second body portion. An antenna for a radio frequency transceiver is placed in a vicinity of the hinge.

公开(公告)号：US20230198122A1

公开(公告)日：2023-06-22

申请号：US17557059

申请日：2021-12-21

Applicant: Intel Corporation

Inventor： Maruti TAMRAKAR ,  Prasanna PICHUMANI ,  Jayprakash THAKUR ,  Sagar GUPTA

IPC: H01Q1/22 ,  H04M1/02

CPC classification number: H01Q1/2266 ,  H04M1/026

Abstract: A communication device including a chassis; and a wireless communication interface arranged at least in part on a mounting structure, wherein the chassis houses the wireless communication interface, wherein the wireless communication interface comprises an antenna; and wherein the chassis comprises a recess, and wherein the mounting structure is rotatably arranged in the recess.

公开(公告)号：US20220200149A1

公开(公告)日：2022-06-23

申请号：US17448722

申请日：2021-09-24

Applicant: Intel Corporation

Inventor： Maruti TAMRAKAR ,  Jayprakash THAKUR

IPC: H01Q9/04 ,  H01Q5/392 ,  H01Q21/06

Abstract: Examples relate to concepts for patch antennas and particular to a method for forming a multiband patch antenna. A multiband patch antenna may comprise a ground layer and an excitation layer, comprising a first excitation patch, a second excitation patch and a feeding patch, wherein the patch is arranged to excite the first excitation patch and the second excitation simultaneously.

公开(公告)号：US20220200123A1

公开(公告)日：2022-06-23

申请号：US17455928

申请日：2021-11-22

Applicant: Intel Corporation

Inventor： Jayprakash THAKUR ,  Prasanna PICHUMANI ,  Maruti TAMRAKAR ,  Doddi RAGHAVENDRA ,  Sagar GUPTA

IPC: H01Q1/02 ,  H01Q1/12 ,  H01Q9/04

Abstract: Examples relate to concepts for antenna arrangement and particular to an antenna for an electronic device. An electronic device comprises, a case, a lid and a heat spreading structure. Further, an electronic device comprises a hinge arrangement between the case and the lid. The hinge arrangement comprises at least one hinge structure connecting the lid to the case. Further, the electronic device comprises an antenna. The antenna is arranged in an area of the hinge arrangement. The heat spreading structure extends from the case through the area of the hinge arrangement to the lid.