公开(公告)号：US20220210906A1

公开(公告)日：2022-06-30

申请号：US17697909

申请日：2022-03-17

Applicant: Intel Corporation

Inventor： Prabhakar SUBRAHMANYAM ,  Mark E. SPRENGER

IPC: H05K1/02 ,  H05K7/20

Abstract: An apparatus is described. The apparatus includes a cooling assembly. The cooling assembly includes a cooling mass; a first heat spreader; a second heat spreader; a spring element; and, hinge components to form a hinge that the first and second heat spreaders rotate about. The spring element to apply a force to the first and second heat spreaders that causes the first and second heat spreaders to rotate about the hinge toward a circuit board located between the first and second heat spreaders.

公开(公告)号：US20220117112A1

公开(公告)日：2022-04-14

申请号：US17068333

申请日：2020-10-12

Applicant: Intel Corporation

Inventor： Prabhakar SUBRAHMANYAM ,  Ying-Feng PANG ,  Yi XIA ,  Muhammad AHMAD

IPC: H05K7/20 ,  H01L23/367

Abstract: Embodiments disclosed herein include heatsinks with transpiration cooling features. In an embodiment, a heatsink comprises a body with a first surface, a second surface, and a sidewall surface connecting the first surface to the second surface. In an embodiment, a first hole is formed into the first surface, where the first hole terminates before reaching the second surface. In an embodiment, the heatsink further comprises a second hole into the sidewall surface, where the second hole intersects the first hole.

公开(公告)号：US20210351106A1

公开(公告)日：2021-11-11

申请号：US16871424

申请日：2020-05-11

Applicant: Intel Corporation

Inventor： Prabhakar SUBRAHMANYAM ,  Tewodros WONDIMU ,  Ying-Feng PANG ,  Muhammad AHMAD ,  Paul DIGLIO ,  David SHIA ,  Pooya TADAYON

IPC: H01L23/427 ,  G01R31/26 ,  B05B1/14

Abstract: Embodiments disclosed herein include a thermal testing unit. In an embodiment, the thermal testing unit comprises a nozzle frame, and a nozzle plate within the frame. In an embodiment, the nozzle plate comprises a plurality of orifices through a thickness of the nozzle plate. In an embodiment, the thermal testing unit further comprises a housing attached to the nozzle plate.

公开(公告)号：US20210120703A1

公开(公告)日：2021-04-22

申请号：US17134368

申请日：2020-12-26

Applicant: Intel Corporation

Inventor： Prabhakar SUBRAHMANYAM ,  Arun KRISHNAMOORTHY ,  Victor POLYANKO ,  Ying-Feng PANG ,  Yi XIA ,  Pooya TADAYON ,  Muhammad AHMAD ,  Rahima K. MOHAMMED

IPC: H05K7/20

Abstract: An apparatus is described. The apparatus includes a liquid cooling system having multiple heat-exchangers and multiple valves. The multiple valves are to enable/disable participation of individual ones of the heat-exchangers within the liquid cooling system. The apparatus includes an information keeping device to store information that correlates a number of the multiple heat exchangers to be enabled to realize one or more semiconductor chips' target temperature for a power consumption of the one or more semiconductor chips for a plurality of combinations of target temperature and power consumption. The controller is coupled to the liquid cooling system and the information keeping device to dynamically determine during runtime of a system having the one or more semiconductor chips an appropriate number of the multiple heat exchangers to enable to realize a particular target temperature for the one or more semiconductor chips for a particular power consumption of the one or more semiconductor chips, and, update the information in the information keeping device with a new correlation that correlates the appropriate number with the particular target temperature and particular power consumption

公开(公告)号：US20200229325A1

公开(公告)日：2020-07-16

申请号：US16336842

申请日：2016-09-30

Applicant: Intel Corporation

Inventor： Tong W. CHAO ,  Prabhakar SUBRAHMANYAM

IPC: H05K7/20 ,  H01L23/473 ,  H01L23/40 ,  H02K11/33

Abstract: Modular assemblies for thermal management are provided. Modularity permits or facilitates scalable thermal performance with respect to power dissipation demands Modularity also permits retrofitting a deployed cooling system based at least on a current power dissipation requirement. In some embodiments, a modular assembly can be reversibly reconfigured in order to adjust cooling capacity and fulfill a defined power dissipation target. In some embodiments, a modular assembly can include a liquid-cooled pedestal and multiple liquid-cooled attachment members that can be reversibly coupled to or reversibly decoupled from the liquid-cooled pedestal based at least on a power dissipation condition and/or a change thereof of a dissipative electronic component. The reversible coupling and reversible decoupling of the attachment members can permit or otherwise facilitate reversibly adjusting the heat transfer between the modular assembly and the dissipative electronic component. Scalability of thermal performance of the modular assembly can be achieved, at least in part, by the addition of liquid-cooled attachment members.