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公开(公告)号：US07435311B1
公开(公告)日：2008-10-14
申请号：US11215683
申请日：2005-08-30
IPC分类号： B32B37/00
CPC分类号： B32B37/003 , B32B37/10 , B32B37/12 , B32B38/18 , B32B2457/00
摘要： A method of adhering a first panel, such as an OLED assembly, to a second panel, such as a protective cover plate, is disclosed. An adhesive is applied to a face of at least one of the first and second panels. The first panel is positioned to be responsive to movement of any of a plurality of independently controlled expandable elements. The second panel is held adjacent the first panel. At least one of the expandable elements is selectively expanded so that a first edge of the first panel contacts a first edge of the second panel. The expandable elements are further selectively expanded so that the adhesive fully contacts the first and second panels.
摘要翻译： 公开了将诸如OLED组件的第一面板粘合到诸如保护盖板的第二面板上的方法。 将粘合剂施加到第一和第二面板中的至少一个的面上。 第一面板被定位成响应于多个独立控制的可扩张元件中的任何一个的移动。 第二个面板与第一个面板相邻。 可膨胀元件中的至少一个被选择性地膨胀，使得第一面板的第一边缘接触第二面板的第一边缘。 可膨胀元件进一步选择性地膨胀，使得粘合剂完全接触第一和第二面板。
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12.发明授权公开(公告)号：US08603288B2
公开(公告)日：2013-12-10
申请号：US12009472
申请日：2008-01-18
IPC分类号： B32B37/10
CPC分类号： B29D7/01 , B29C33/20 , B29C43/12 , B29C43/203 , B29C43/3642 , B29C53/18 , B29C2043/3233 , B29C2043/3647 , B29C2043/3649 , B32B7/12 , B32B15/08 , B32B25/08 , B32B27/08 , B32B27/32 , B32B2250/05 , B32B2250/40 , B32B2255/10 , B32B2255/26 , B32B2457/00 , B32B2457/08 , B32B2457/202 , B32B2457/206 , B32B2457/208 , Y10T428/28
摘要： The present invention is a process for performing a planarization treatment of pressure-sensitive adhesive (PSA). The process includes positioning a first substrate onto a support surface of a planarization tool. The process further includes placing at least one layer of PSA onto the first substrate. The process further includes positioning a second substrate onto the layer(s) of PSA. The process further includes applying a pressure to the second substrate via a flexible membrane, said pressure being applied in a generally uniform, unidirectional and localized manner. Further, the applied pressure flattens the PSA between the first substrate and the second substrate for promoting suitability of the PSA for use in rigid-to-rigid lamination processes.
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公开(公告)号：US08540002B2
公开(公告)日：2013-09-24
申请号：US13420381
申请日：2012-03-14
IPC分类号： B32B37/00
CPC分类号： B32B37/10 , B32B17/10018 , B32B37/003 , B32B37/0046 , B32B37/1009 , B32B37/1018 , B32B37/12 , B32B2457/202 , G02F1/1303 , H05K3/4611
摘要： The present invention is a process for performing rigid-to-rigid substrate lamination implementing pressure-sensitive adhesive (PSA). The process may include pressurizing a first sealed cavity to a first pressure. The process may further include creating a vacuum within a second sealed cavity, the second sealed cavity being sealed from the first sealed cavity by a flexible membrane. The process may further include applying the first pressure to a laminate assembly stack via the flexible membrane, the laminate assembly stack including a first substrate, a second substrate, and a PSA layer, the PSA layer being positioned between the first substrate and the second substrate. The process may further include applying the vacuum created within the second sealed cavity to the laminate assembly stack. The applied first pressure and the applied vacuum promote intimate contact between the first substrate and the second substrate of the laminate assembly stack via the PSA layer.
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14.发明授权System and method for completing lamination of rigid-to-rigid substrates by the controlled application of pressure 有权通过控制压力完成刚性 - 刚性基材层压的系统和方法公开(公告)号：US08137498B2
公开(公告)日：2012-03-20
申请号：US12009393
申请日：2008-01-18
IPC分类号： B32B37/00
CPC分类号： B32B37/10 , B32B17/10018 , B32B37/003 , B32B37/0046 , B32B37/1009 , B32B37/1018 , B32B37/12 , B32B2457/202 , G02F1/1303 , H05K3/4611
摘要： The present invention is a process for performing rigid-to-rigid substrate lamination implementing pressure-sensitive adhesive (PSA). The process may include pressurizing a first sealed cavity to a first pressure. The process may further include creating a vacuum within a second sealed cavity, the second sealed cavity being sealed from the first sealed cavity by a flexible membrane. The process may further include applying the first pressure to a laminate assembly stack via the flexible membrane, the laminate assembly stack including a first substrate, a second substrate, and a PSA layer, the PSA layer being positioned between the first substrate and the second substrate. The process may further include applying the vacuum created within the second sealed cavity to the laminate assembly stack. The applied first pressure and the applied vacuum promote intimate contact between the first substrate and the second substrate of the laminate assembly stack via the PSA layer.
摘要翻译： 本发明是一种执行压敏粘合剂（PSA）的刚性至刚性基材层压的方法。 该方法可以包括将第一密封空腔加压至第一压力。 该方法还可以包括在第二密封空腔内产生真空，第二密封空腔通过柔性膜与第一密封空腔密封。 该方法还可以包括经由柔性膜将第一压力施加到层压组件叠层，层压组件堆叠包括第一衬底，第二衬底和粘合剂层，PSA层位于第一衬底和第二衬底之间 。 该方法还可以包括将在第二密封空腔内产生的真空施加到层压组件叠层。 所施加的第一压力和施加的真空促进层压组件叠层的第一衬底和第二衬底之间经由PSA层的紧密接触。
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公开(公告)号：US20090120585A1
公开(公告)日：2009-05-14
申请号：US12009482
申请日：2008-01-18
IPC分类号： B29C65/02
CPC分类号： B32B37/003 , B32B37/0046 , B32B37/10 , B32B37/1009 , B32B38/1841 , B32B2457/202
摘要： The present disclosure is directed to a substrate lamination system and method.A substrate lamination apparatus may comprise: (a) a vacuum chamber; (b) a flexible membrane; and (c) a substrate support.A system for laminating substrates may comprise: (a) a vacuum chamber; (b) a flexible membrane; (c) a substrate support; (d) a vacuum pump; (e) a compressor; and (f) a control unit, wherein the control unit is configured to carry out the steps: (i) evacuating the vacuum chamber; and (ii) applying pressure to at least one of a first substrate and a second substrate.
摘要翻译： 本公开涉及基板层压系统和方法。 基板层压装置可以包括：（a）真空室; （b）柔性膜; 和（c）基材载体。 层压基板的系统可以包括：（a）真空室; （b）柔性膜; （c）基底支撑体; （d）真空泵; （e）压缩机; 和（f）控制单元，其中所述控制单元被配置为执行以下步骤：（i）抽真空室; 和（ii）向第一基板和第二基板中的至少一个施加压力。
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16.发明申请公开(公告)号：US20120168086A1
公开(公告)日：2012-07-05
申请号：US13420381
申请日：2012-03-14
CPC分类号： B32B37/10 , B32B17/10018 , B32B37/003 , B32B37/0046 , B32B37/1009 , B32B37/1018 , B32B37/12 , B32B2457/202 , G02F1/1303 , H05K3/4611
摘要： The present invention is a process for performing rigid-to-rigid substrate lamination implementing pressure-sensitive adhesive (PSA). The process may include pressurizing a first sealed cavity to a first pressure. The process may further include creating a vacuum within a second sealed cavity, the second sealed cavity being sealed from the first sealed cavity by a flexible membrane. The process may further include applying the first pressure to a laminate assembly stack via the flexible membrane, the laminate assembly stack including a first substrate, a second substrate, and a PSA layer, the PSA layer being positioned between the first substrate and the second substrate. The process may further include applying the vacuum created within the second sealed cavity to the laminate assembly stack. The applied first pressure and the applied vacuum promote intimate contact between the first substrate and the second substrate of the laminate assembly stack via the PSA layer.
摘要翻译： 本发明是一种执行压敏粘合剂（PSA）的刚性至刚性基材层压的方法。 该方法可以包括将第一密封空腔加压至第一压力。 该方法还可以包括在第二密封空腔内产生真空，第二密封空腔通过柔性膜与第一密封空腔密封。 该方法还可以包括经由柔性膜将第一压力施加到层压组件叠层，层压组件堆叠包括第一衬底，第二衬底和粘合剂层，PSA层位于第一衬底和第二衬底之间 。 该方法还可以包括将在第二密封空腔内产生的真空施加到层压组件叠层。 所施加的第一压力和施加的真空促进层压组件叠层的第一衬底和第二衬底之间经由PSA层的紧密接触。
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公开(公告)号：US07814676B2
公开(公告)日：2010-10-19
申请号：US12009373
申请日：2008-01-18
IPC分类号： G01D21/00
CPC分类号： B32B38/1833 , B32B2457/202
摘要： A method for alignment comprises calculating the proper alignment position for a plurality of planar items based on at least one datum per planar item of the plurality of planar items, instructing a tooling system to form a tooling aid for providing the proper alignment position in a planar substrate lamination apparatus, and inserting the tooling aid into the planar substrate lamination apparatus for the proper alignment of the plurality of planar items in the planar substrate lamination apparatus.
摘要翻译： 用于对准的方法包括基于多个平面物品中的每个平面物品的至少一个基准来计算多个平面物品的适当对准位置，指示工具系统形成用于在平面物体中提供适当对准位置的工具辅助 基板层压装置，并将工具辅助材料插入到平面基板层叠装置中，以便在平面基板层压装置中适当地排列多个平面物品。
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公开(公告)号：US07566254B2
公开(公告)日：2009-07-28
申请号：US11214518
申请日：2005-08-30
IPC分类号： H01J9/00
CPC分类号： H01L51/56 , H01L51/524 , H01L51/5246
摘要： A method of sealing an Organic Light-Emitting Diode (OLED) assembly is disclosed. A dry film adhesive is applied to a capping layer. An OLED assembly is placed in a cavity of a fixture. The capping layer is positioned in the cavity of the fixture such that a first edge of the capping layer contacts the OLED assembly and a second edge of the capping layer is separate from the OLED assembly. Atmospheric pressure is reduced between the capping layer and the OLED assembly. The second edge of the capping layer is dropped such that the second edge of the capping layer is adjacent the OLED assembly.
摘要翻译： 公开了一种密封有机发光二极管（OLED）组件的方法。 将干膜粘合剂施加到覆盖层。 将OLED组件放置在固定装置的空腔中。 封盖层定位在固定装置的空腔中，使得封盖层的第一边缘接触OLED组件，并且封盖层的第二边缘与OLED组件分离。 封盖层和OLED组件之间的大气压力降低。 覆盖层的第二边缘被落下，使得封盖层的第二边缘邻近于OLED组件。
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19.发明申请Planarization treatment of pressure sensitive adhesive for rigid-to-rigid substrate lamination 有权用于刚性至刚性基材层压的压敏粘合剂的平面化处理公开(公告)号：US20090186218A1
公开(公告)日：2009-07-23
申请号：US12009472
申请日：2008-01-18
CPC分类号： B29D7/01 , B29C33/20 , B29C43/12 , B29C43/203 , B29C43/3642 , B29C53/18 , B29C2043/3233 , B29C2043/3647 , B29C2043/3649 , B32B7/12 , B32B15/08 , B32B25/08 , B32B27/08 , B32B27/32 , B32B2250/05 , B32B2250/40 , B32B2255/10 , B32B2255/26 , B32B2457/00 , B32B2457/08 , B32B2457/202 , B32B2457/206 , B32B2457/208 , Y10T428/28
摘要： The present invention is a process for performing a planarization treatment of pressure-sensitive adhesive (PSA). The process includes positioning a first substrate onto a support surface of a planarization tool. The process further includes placing at least one layer of PSA onto the first substrate. The process further includes positioning a second substrate onto the layer(s) of PSA. The process further includes applying a pressure to the second substrate via a flexible membrane, said pressure being applied in a generally uniform, unidirectional and localized manner. Further, the applied pressure flattens the PSA between the first substrate and the second substrate for promoting suitability of the PSA for use in rigid-to-rigid lamination processes.
摘要翻译： 本发明是进行压敏粘合剂（PSA）的平坦化处理的方法。 该方法包括将第一衬底定位在平坦化工具的支撑表面上。 该方法还包括将至少一层PSA放置在第一衬底上。 该方法还包括将第二衬底定位在PSA的层上。 该方法还包括通过柔性膜向第二基底施加压力，所述压力以大致均匀的单向和局部化方式施加。 此外，施加的压力使PSA在第一基板和第二基板之间平坦化，以促进PSA在刚性到刚性层压工艺中的适用性。
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公开(公告)号：US20090183615A1
公开(公告)日：2009-07-23
申请号：US12009372
申请日：2008-01-18
IPC分类号： B26D7/20
CPC分类号： B26D1/547 , B26D3/28 , B26D7/10 , B32B17/1099 , B32B43/006 , B32B2457/20 , Y10S83/907 , Y10T83/0274 , Y10T83/0296 , Y10T83/041 , Y10T83/0515 , Y10T83/707 , Y10T83/7101 , Y10T83/73 , Y10T83/9292 , Y10T156/1153 , Y10T156/1911 , Y10T156/1961 , Y10T156/1967
摘要： An apparatus for separating a laminated substrate assembly comprises at least a substantially planar assembly, a cutting member housing assembly positioned on a first side of the substantially planar assembly, a cutting member receiving assembly positioned on a second side of the substantially planar assembly, substantially opposite from the first side of the planar assembly suitable for receiving an amount of the elongated cutting member. At least one of the cutting member housing assembly or the cutting member receiving assembly is configured to provide an amount of tension to the elongated cutting member as the elongated cutting member is released by the cutting member housing assembly or received by the cutting member receiving assembly, and the elongated cutting member is configured to remove an amount of adhesive from an adhesive layer of the laminated substrate assembly.
摘要翻译： 用于分离层压基板组件的装置包括至少基本平坦的组件，位于基本上平面的组件的第一侧上的切割构件壳体组件，位于基本平坦的组件的第二侧上的切割构件接收组件， 从适于接收一定量的细长切割构件的平面组件的第一侧。 切割构件壳体组件或切割构件接收组件中的至少一个构造成当细长切割构件被切割构件壳体组件释放或由切割构件接收组件接收时，向细长切割构件提供一定量的张力， 并且所述细长切割构件构造成从所述层叠基底组件的粘合剂层去除一定量的粘合剂。
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