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231 条记录 (耗时 0.03 秒)

    Micro-fabricated device with thermoelectric device and method of making
    11.
    发明授权
    Micro-fabricated device with thermoelectric device and method of making 有权
    具有热电装置的微制造装置及其制造方法

    公开(公告)号：US07205675B2

    公开(公告)日：2007-04-17

    申请号：US10353632

    申请日：2003-01-29

    申请人： James C. McKinnell ,  John Liebeskind ,  Chien-Hua Chen

    发明人： James C. McKinnell ,  John Liebeskind ,  Chien-Hua Chen

    IPC分类号： H01L23/38 ,  H01L27/16 ,  F25B21/02

    CPC分类号： H01L35/32 ,  G11B9/10 ,  H01L23/38 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/10158 ,  Y10S257/93 ,  H01L2924/00

    摘要： A micro-fabricated device, includes a support structure having an aperture formed therein, and a device substrate disposed within the aperture. The micro-fabricated device further includes a thermally isolating structure thermally coupling the device substrate to the support structure. The thermally isolating structure includes at least one n-doped region and at least one p-doped region formed on or in the thermally isolating structure and separated from each other. In addition, the thermally isolating structure includes an electrical interconnect connecting at least one n-doped region and at least one p-doped region, forming an integrated thermoelectric device.

    摘要翻译： 微制造装置包括其中形成有孔的支撑结构和设置在孔内的装置基板。 微制造装置还包括将装置基板热耦合到支撑结构的热隔离结构。 热隔离结构包括至少一个n掺杂区域和形成在隔热结构上或隔热结构中并且彼此分离的至少一个p掺杂区域。 此外，隔热结构包括连接至少一个n掺杂区域和至少一个p掺杂区域的电互连，形成集成的热电装置。

    System and method for transferring structured material to a substrate
    13.
    发明申请
    System and method for transferring structured material to a substrate 审中-公开
    将结构材料转移到基底的系统和方法

    公开(公告)号：US20070068620A1

    公开(公告)日：2007-03-29

    申请号：US11604474

    申请日：2006-11-27

    申请人： Chien-Hua Chen ,  James McKinnell

    发明人： Chien-Hua Chen ,  James McKinnell

    IPC分类号： B44C1/17 ,  B44C1/165 ,  B32B37/00 ,  B32B38/18

    CPC分类号： B81C1/00285 ,  H01L21/2007

    摘要： A structured material is transferred to a substrate. A release film is applied to a carrier. A material is deposited on a surface of the release film. The material is processed to form the structured material. The structured material is coupled to the substrate. The release film is exposed to reduce adhesion strength between the release film and the carrier, and the carrier and the release film are removed from the structured material.

    摘要翻译： 将结构化材料转移到基底。 将剥离膜应用于载体。 材料沉积在脱模膜的表面上。 处理该材料以形成结构化材料。 结构材料耦合到基底。 暴露脱模膜以降低剥离膜和载体之间的粘合强度，并且将载体和脱模膜从结构化材料中除去。

    System and method for transferring structured material to a substrate
    15.
    发明申请
    System and method for transferring structured material to a substrate 审中-公开
    将结构材料转移到基底的系统和方法

    公开(公告)号：US20060016547A1

    公开(公告)日：2006-01-26

    申请号：US10897234

    申请日：2004-07-22

    申请人： Chien-Hua Chen ,  James McKinnell

    发明人： Chien-Hua Chen ,  James McKinnell

    IPC分类号： H01L21/00

    CPC分类号： B81C1/00285 ,  H01L21/2007

    摘要： A structured material is transferred to a substrate. A release film is applied to a carrier. A material is deposited on a surface of the release film. The material is processed to form the structured material. The structured material is coupled to the substrate. The release film is exposed to reduce adhesion strength between the release film and the carrier, and the carrier and the release film are removed from the structured material.

    摘要翻译： 将结构化材料转移到基底。 将剥离膜应用于载体。 材料沉积在脱模膜的表面上。 处理该材料以形成结构化材料。 结构材料耦合到基底。 暴露脱模膜以降低剥离膜和载体之间的粘合强度，并且将载体和脱模膜从结构化材料中除去。

    Electronic portion of an ion gauge with ion collectors bowed out of plane to form a three dimensional arrangement
    19.
    发明授权
    Electronic portion of an ion gauge with ion collectors bowed out of plane to form a three dimensional arrangement 失效
    具有离子收集器的记忆离子计的电子部分屈服于平面外以形成三维排列

    公开(公告)号：US07609067B1

    公开(公告)日：2009-10-27

    申请号：US11269960

    申请日：2005-11-09

    申请人： Chien-Hua Chen ,  James McKinnell

    发明人： Chien-Hua Chen ,  James McKinnell

    IPC分类号： G01L21/30

    CPC分类号： G01L21/32

    摘要： Embodiments of the present invention pertain to an electronic portion of a MEMs ion gauge with ion collectors bowed out of plane to form a three dimensional arrangement and a method for forming an electronic portion of a MEMs ion gauge with ion collectors bowed out of plane to form a three dimensional arrangement. In one embodiment, an ion gauge substrate is formed. The electronic portion of the MEMs ion gauge is assembled by coupling a plurality of ion collectors with the ion gauge substrate, wherein the coupling of the plurality of ion collectors with the ion gauge substrate further comprises performing an operation that causes the plurality of ion collectors to be bowed out of plane to form a three dimensional arrangement.

    摘要翻译： 本发明的实施例涉及离子收集器的电子部分，其离子收集器在平面外弯曲以形成三维布置，以及用于形成离子收集器的电子部分的方法，离子收集器在平面外弯曲以形成 三维排列。 在一个实施例中，形成离子计量基板。 通过将多个离子收集器与离子计量基板耦合来组装MEMs离子计的电子部分，其中多个离子收集器与离子计量基板的耦合还包括执行使多个离子收集器到 鞠躬ed to，形成三维安排。