公开(公告)号：US5764072A

公开(公告)日：1998-06-09

申请号：US771274

申请日：1996-12-20

Applicant: January Kister

Inventor： January Kister

IPC: G01R31/28 ,  G01R31/02

CPC classification number: G01R31/2886

Abstract: An assembly for making electrical connections to unpackaged integrated circuits using dual contact probes. The probes are said to be dual contact because they contact both the integrated device under test and the testing circuit. The probes have two tips. One tip is located at the end of each leg of the "U"-shaped probe. In operation, the probes are oriented with the legs of the probes extending horizontally and the tips pointing up and down, contacting the IC under test and the testing circuit. The probes are each made of a single piece of metal, and so provide an electrical connection between the IC and testing circuit. Flexing in the legs provides springiness for assuring good contact. The probes are mounted on a rigid block that is rigidly connected to the testing circuit and IC under test. Alignment plates are used to accurately position the probes. The plates can be horizontal or vertical and they have holes or slots that engage parts of the probes. The holes and slots are placed to provide proper positioning of the probes.

Abstract translation: 用于使用双接触探针与未封装的集成电路进行电连接的组件。 这些探针被称为双重接触，因为它们与被测试的集成器件和测试电路接触。 探头有两个提示。 一个尖端位于“U”型探头的每条腿的末端。 在操作中，探头定向成使探头的腿水平延伸，并且尖端朝上和向下指向，接触待测IC和测试电路。 探针各自由单块金属制成，因此在IC和测试电路之间提供电连接。 双腿弯曲提供弹性以保证良好的接触。 探针安装在刚性块上，刚性块刚性连接到测试电路和被测IC。 对准板用于精确定位探针。 板可以是水平的或垂直的，并且它们具有接合探针部分的孔或槽。 放置孔和槽以提供探针的适当定位。

公开(公告)号：US5742174A

公开(公告)日：1998-04-21

申请号：US553069

申请日：1995-11-03

Applicant: January Kister ,  Jerzy Lobacz

Inventor： January Kister ,  Jerzy Lobacz

IPC: G01R1/067 ,  G01R1/073 ,  G01R31/02

CPC classification number: G01R1/07342 ,  G01R1/06733

Abstract: A method and device for accurately mounting a probe in a probe card and for maintaining correct location of the probe tip as the probe is used for electronic testing of an IC pad. A membrane having a slot is attached to a support structure of a probe card. The probe tip is inserted into the slot and the probe is affixed to the membrane at the edges of the slot using silicon rubber. The probe is then mounted in the support structure which has a groove for receiving the probe. A distal end of the probe is bonded to the walls of the groove so that the probe is free to move vertically in the groove, but constrained from moving laterally to prevent side-buckling. The membrane and silicon rubber hold the probe tip in proper location during thermal treating of the probe card assembly. Once mounted in the probe card by this method, the probe and probe tip will maintain proper location as they are used for electronic testing of an IC pad. During testing, the probe tip and attached membrane are deflected from their initial position by force of contact with the IC pad. Upon completion of the test, the contact force is removed from the probe tip. The elasticity of the membrane causes the membrane and the attached probe tip to return to their initial position, ensuring that the probe tip is in the proper location for the next test.

Abstract translation: 一种用于将探头精确地安装在探针卡中并用于在探针用于IC垫的电子测试时保持探针尖端的正确位置的方法和装置。 具有狭缝的膜附接到探针卡的支撑结构。 探头尖端插入槽中，探针用硅橡胶固定在槽边缘的膜上。 然后将探针安装在具有用于接收探针的凹槽的支撑结构中。 探针的远端结合到槽的壁上，使得探针可自由地在凹槽中垂直移动，但是限制横向运动以防止侧向弯曲。 在探针卡组件的热处理过程中，膜和硅橡胶将探针尖端保持在适当的位置。 一旦通过这种方法安装在探针卡中，探针和探针尖端将保持适当的位置，因为它们用于IC垫的电子测试。 在测试期间，探针尖端和连接的膜通过与IC焊盘接触的力而从初始位置偏转。 在测试完成时，接触力从探针尖端移除。 膜的弹性导致膜和附着的探针尖端返回到其初始位置，确保探针尖端处于适当位置进行下一次测试。

公开(公告)号：US08907689B2

公开(公告)日：2014-12-09

申请号：US12871420

申请日：2010-08-30

Applicant: January Kister ,  Alex Shtarker

Inventor： January Kister ,  Alex Shtarker

IPC: G01R31/20 ,  G01R1/073 ,  G01R3/00

CPC classification number: G01R31/2887 ,  G01R1/0408 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07357 ,  G01R1/07371 ,  G01R3/00 ,  Y10T29/49826

Abstract: A retention arrangement that includes one or more templates for securing and aligning probes for testing a device under test.

Abstract translation: 一种保留装置，包括一个或多个模板，用于固定和对准探头以测试被测设备。

公开(公告)号：USRE44407E1

公开(公告)日：2013-08-06

申请号：US12646661

申请日：2009-12-23

Applicant: January Kister

Inventor： January Kister

IPC: G01R31/20

CPC classification number: G01R1/07378 ,  G01R1/07357

Abstract: Method and apparatus for electrical testing of a device under test (DUT) that employs a connection board with signal contacts for applying test signals and a space transformer that has low pitch contacts arranged on one or more circumferential shelves that define an enclosure in the space transformer. The apparatus has a substrate with fine pitch contacts positioned such that these are within the enclosure. A set of wire bonds is used for pitch reduction by interconnecting the fine pitch contacts with the low pitch contacts arranged on the shelves. The probes are connected to the fine pitch contacts and are used to apply the test signals to a DUT by contacting its pads. In some embodiments, the fine pitch contacts may be embodied by plugs or by blind metal vias.

Abstract translation: 一种用于对被测设备（DUT）进行电气测试的方法和装置，该设备采用具有用于施加测试信号的信号触点的连接板和具有低间距触点的空间变压器，所述空间变压器布置在定义空间变压器中的外壳的一个或多个周向架上 。 该装置具有定位为使得它们在外壳内的细间距触点的基板。 通过将细间距触点与布置在搁架上的低音调触点相互连接，一组引线键被用于降低音调。 探头连接到细间距触点，并用于通过接触其焊盘将测试信号施加到DUT。 在一些实施例中，细间距触点可以由插头或盲金属通孔来实现。

公开(公告)号：US20120313621A1

公开(公告)日：2012-12-13

申请号：US13557879

申请日：2012-07-25

Applicant: January Kister

Inventor： January Kister

IPC: G01R1/067

CPC classification number: G01R3/00 ,  Y10T29/49158 ,  Y10T29/49163 ,  Y10T29/49208 ,  Y10T29/49213 ,  Y10T29/4922 ,  Y10T29/49222

Abstract: In assembly of probe arrays for electrical test, a problem can arise where a bonding agent undesirably wicks between probes. According to embodiments of the invention, this wicking problem is alleviated by disposing an anti-wicking agent on a surface of the probe assembly such that wicking of the bonding agent along the probes toward the probe tips is hindered. The anti-wicking agent can be a solid powder, a liquid, or a gel. Once probe assembly fabrication is complete, the anti-wicking agent is removed. In preferred embodiments, a template plate is employed to hold the probe tips in proper position during fabrication. In this manner, undesirable bending of probes caused by introduction or removal of the anti-wicking agent can be reduced or eliminated.

Abstract translation: 在用于电测试的探针阵列的组装中，可能会出现问题，其中粘结剂不期望地在探针之间吸取。 根据本发明的实施方案，通过在探针组件的表面上设置防虫剂来减轻这种芯吸问题，从而妨碍沿着探针朝向探针尖端的粘合剂的芯吸。 抗毛细作用剂可以是固体粉末，液体或凝胶。 探针组件制造完成后，除去防虫剂。 在优选的实施例中，采用模板来在制造期间将探针头保持在适当的位置。 以这种方式，可以减少或消除由引入或除去抗毛细作用剂引起的探针的不期望的弯曲。

公开(公告)号：US08230593B2

公开(公告)日：2012-07-31

申请号：US12156131

申请日：2008-05-29

Applicant: January Kister

Inventor： January Kister

IPC: H01R43/00

CPC classification number: G01R3/00 ,  Y10T29/49158 ,  Y10T29/49163 ,  Y10T29/49208 ,  Y10T29/49213 ,  Y10T29/4922 ,  Y10T29/49222

Abstract: In assembly of probe arrays for electrical test, a problem can arise where a bonding agent undesirably wicks between probes. According to embodiments of the invention, this wicking problem is alleviated by disposing an anti-wicking agent on a surface of the probe assembly such that wicking of the bonding agent along the probes toward the probe tips is hindered. The anti-wicking agent can be a solid powder, a liquid, or a gel. Once probe assembly fabrication is complete, the anti-wicking agent is removed. In preferred embodiments, a template plate is employed to hold the probe tips in proper position during fabrication. In this manner, undesirable bending of probes caused by introduction or removal of the anti-wicking agent can be reduced or eliminated.

Abstract translation: 在用于电测试的探针阵列的组装中，可能会出现问题，其中粘结剂不期望地在探针之间吸取。 根据本发明的实施方案，通过在探针组件的表面上设置防虫剂来减轻这种芯吸问题，从而妨碍沿着探针朝向探针尖端的粘合剂的芯吸。 抗毛细作用剂可以是固体粉末，液体或凝胶。 探针组件制造完成后，除去防虫剂。 在优选的实施例中，采用模板来在制造期间将探针头保持在适当的位置。 以这种方式，可以减少或消除由引入或除去抗毛细作用剂引起的探针的不期望的弯曲。

公开(公告)号：US20100182031A1

公开(公告)日：2010-07-22

申请号：US12703063

申请日：2010-02-09

Applicant: January Kister

Inventor： January Kister

IPC: G01R31/02

CPC classification number: G01R1/06761 ,  G01R1/06738 ,  G01R1/07314 ,  G01R1/07357

Abstract: The present invention is a probe for testing an electrical device under test comprising a core layer that is highly conductive.

Abstract translation: 本发明是一种用于测试被测电气装置的探针，包括具有高导电性的芯层。

公开(公告)号：US20100182030A1

公开(公告)日：2010-07-22

申请号：US12699257

申请日：2010-02-03

Applicant: January Kister

Inventor： January Kister

IPC: G01R1/06

CPC classification number: G01R1/06733 ,  G01R1/07357

Abstract: An improved knee probe for probing electrical devices and circuits is provided. The improved knee probe has a reduced thickness section to alter the mechanical behavior of the probe when contact is made. The reduced thickness section of the probe makes it easier to deflect the probe vertically when contact is made. This increased ease of vertical deflection tends to reduce the horizontal contact force component responsible for the scrub motion, thereby decreasing scrub length. Here “thickness” is the probe thickness in the deflection plane of the probe (i.e., the plane in which the probe knee lies). The reduced thickness probe section provides increased design flexibility for controlling scrub motion, especially in combination with other probe parameters affecting the scrub motion.

Abstract translation: 提供了一种用于探测电气设备和电路的改进的膝部探针。 改进的膝关节探针具有减小的厚度部分，以在接触时改变探针的机械性能。 探头的厚度减小部分使接触时更容易使探针垂直偏转。 这种增加的垂直偏转的容易性倾向于减少负责擦洗运动的水平接触力分量，从而减少擦洗长度。 这里，“厚度”是探针的偏转平面中的探针厚度（即探针膝盖所在的平面）。 减小厚度的探针部分提供增加的设计灵活性，用于控制擦洗运动，特别是与影响擦洗运动的其它探头参数组合。

公开(公告)号：US07659739B2

公开(公告)日：2010-02-09

申请号：US11521944

申请日：2006-09-14

Applicant: January Kister

Inventor： January Kister

IPC: G01R31/02

CPC classification number: G01R1/06733 ,  G01R1/07357

Abstract: An improved knee probe for probing electrical devices and circuits is provided. The improved knee probe has a reduced thickness section to alter the mechanical behavior of the probe when contact is made. The reduced thickness section of the probe makes it easier to deflect the probe vertically when contact is made. This increased ease of vertical deflection tends to reduce the horizontal contact force component responsible for the scrub motion, thereby decreasing scrub length. Here “thickness” is the probe thickness in the deflection plane of the probe (i.e., the plane in which the probe knee lies). The reduced thickness probe section provides increased design flexibility for controlling scrub motion, especially in combination with other probe parameters affecting the scrub motion.

Abstract translation: 提供了一种用于探测电气设备和电路的改进的膝部探针。 改进的膝关节探针具有减小的厚度部分，以在接触时改变探针的机械性能。 探头的厚度减小部分使接触时更容易使探针垂直偏转。 这种增加的垂直偏转的容易性倾向于减少负责擦洗运动的水平接触力分量，从而减少擦洗长度。 这里，“厚度”是探针的偏转平面中的探针厚度（即探针膝盖所在的平面）。 减小厚度的探针部分提供增加的设计灵活性，用于控制擦洗运动，特别是与影响擦洗运动的其它探头参数组合。

公开(公告)号：US20090293274A1

公开(公告)日：2009-12-03

申请号：US12156131

申请日：2008-05-29

Applicant: January Kister

Inventor： January Kister

IPC: H01R43/02

CPC classification number: G01R3/00 ,  Y10T29/49158 ,  Y10T29/49163 ,  Y10T29/49208 ,  Y10T29/49213 ,  Y10T29/4922 ,  Y10T29/49222

Abstract: In assembly of probe arrays for electrical test, a problem can arise where a bonding agent undesirably wicks between probes. According to embodiments of the invention, this wicking problem is alleviated by disposing an anti-wicking agent on a surface of the probe assembly such that wicking of the bonding agent along the probes toward the probe tips is hindered. The anti-wicking agent can be a solid powder, a liquid, or a gel. Once probe assembly fabrication is complete, the anti-wicking agent is removed. In preferred embodiments, a template plate is employed to hold the probe tips in proper position during fabrication. In this manner, undesirable bending of probes caused by introduction or removal of the anti-wicking agent can be reduced or eliminated.

Abstract translation: 在用于电测试的探针阵列的组装中，可能会出现问题，其中粘结剂不期望地在探针之间吸取。 根据本发明的实施方案，通过在探针组件的表面上设置防虫剂来减轻这种芯吸问题，从而妨碍沿着探针朝向探针尖端的粘合剂的芯吸。 抗毛细作用剂可以是固体粉末，液体或凝胶。 探针组件制造完成后，除去防虫剂。 在优选的实施例中，采用模板来在制造期间将探针头保持在适当的位置。 以这种方式，可以减少或消除由引入或除去抗毛细作用剂引起的探针的不期望的弯曲。