摘要:
Doped polysilicon plugs are formed in contact with MOSFET device regions and passing through the buried oxide region into the opposite type silicon substrate of an SOI structure. The polysilicon plugs are in contact with the sources and drains of the MOSFET devices to provide paths for dissipating positive and negative ESD stresses. In addition, the polysilicon plugs provide a thermal dissipation pathway for directing heat away from the circuitry, and provide a diode for the structure.
摘要:
A semiconductor memory device including at least three of the following cell structures: an NVRAM cell structure, an FERAM cell structure, a DRAM cell structure, and an SRAM cell structure. The cell structures are disposed on the same substrate and preferably have gate surfaces which are substantially coplanar. An NVRAM cell structure. Processes for forming a memory structure that includes NVRAM, FERAM, DRAM, and/or SRAM memory structures on one substrate and processes for forming a new NVRAM cell structure.
摘要:
Doped polysilicon plugs are formed in contact with MOSFET device regions and passing through the buried oxide region into the opposite type silicon substrate of an SOI structure. The polysilicon plugs are in contact with the sources and drains of the MOSFET devices to provide paths for dissipating positive and negative ESD stresses. In addition, the polysilicon plugs provide a thermal dissipation pathway for directing heat away from the circuitry, and provide a diode for the structure.
摘要:
A circuit includes a phase interpolator and a self test circuit. The phase interpolator is to provide a interpolator output having a phase corresponding to a respective phase step in a plurality of phase steps. The interpolator output is a weighted combination of one or more of a plurality of phasor signals. The self test circuit includes a phase detector coupled to a reference signal and the interpolator output, a phase-difference-to-voltage converter coupled to the phase detector, an analog-to-digital converter (ADC) coupled to the phase-difference-to-voltage converter, and control logic. The phase detector is to generate an output that is proportional to a phase difference between the reference signal and the interpolator output. The phase-difference-to-voltage converter is to convert the output from the phase detector into a corresponding voltage. The ADC is to convert an output from the phase-difference-to-voltage converter into a corresponding digital value. The control logic is to test the phase interpolator using the self-test circuit.
摘要:
A semiconductor memory device comprising: an SOI substrate having a thin silicon layer on top of a buried insulator; and an SRAM comprising four NFETs and two PFETs located in the thin silicon layer, each the NFET and PFET having a body region between a source region and a drain region, wherein the bodies of two of the NFETs are electrically connected to ground. Additionally, the bodies of the two PFETs are electrically connected to VDD.
摘要:
A silicon-on-insulator (SOI) structure and method of making the same includes an SOI wafer having a silicon layer of an original thickness dimension formed upon an isolation oxidation layer. At least two p-type bodies of at least two SOI field effect transistors (PFETs) are formed in the silicon layer. At least two n-type bodies of at least two SOI field effect transistors (NFETs) are also formed in the silicon layer. Lastly, an SOI body link is formed in the silicon layer of the SOI wafer adjacent the isolation oxidation layer for selectively connecting desired bodies of either the p-type SOI FETs or the n-type SOI FETs and for allowing the connected bodies to float.
摘要:
A semiconductor memory device including an NVRAM cell structure, a DRAM cell structure, and an SRAM cell structure. The NVRAM cell structure, the DRAM cell structure, and the SRAM cell structure are on the same substrate. An NVRAM cell structure. Processes for forming a memory structure that includes NVRAM, DRAM, and/or SRAM memory structures on one substrate and processes for forming a new NVRAM cell structure.
摘要:
A semiconductor memory device including an NVRAM cell structure, a DRAM cell structure, and an SRAM cell structure. The NVRAM cell structure, the DRAM cell structure, and the SRAM cell structure are on the same substrate. An NVRAM cell structure. Processes for forming a memory structure that includes NVRAM, DRAM, and/or SRAM memory structures on one substrate and processes for forming a new NVRAM cell structure.
摘要:
Large capacitance, low-impedance decoupling capacitors in SOI and their method of fabrication. A high conductivity trench substrate contact is made adjacent to the capacitor by removal of insulator lining the capacitor by use of an extra mask thereby making a substrate contact when the trench is filled with doped polysilicon. The inventive process is compatible with and easily integrated into existing SOI logic technologies. The SOI decoupling capacitors are formed in trenches which pass through the silicon and buried oxide layers and into the underlying silicon substrate.
摘要:
A circuit includes a frequency synthesizer, N phase mixers coupled to the frequency synthesizer, a plurality of receivers, and a calibration circuit. The frequency synthesizer is to receive a reference clock signal and is to output a primary clock signal. A respective phase mixer in the N phase mixers is to output a respective secondary clock signal having a corresponding phase. A respective receiver in the plurality of receivers is coupled to two of the N phase mixers, and at a respective time is to receive data in accordance with the respective secondary clock signal from one of the two phase mixers coupled to the respective receiver. The calibration circuit is to calibrate a secondary clock signal output by a respective phase mixer in the N phase mixers by adjusting the phase of the secondary clock signal of the respective phase mixer.