摘要:
A power plane including a supply power pin receptacle, a first connector power pin receptacle, and a second power pin receptacle, where a first electrical resistance between the supply power pin receptacle and the first connector power pin receptacle is substantially equal to a second electrical resistance between the supply power pin receptacle and the second connector power pin receptacle.
摘要:
According to some embodiments, a capacitor includes a first external capacitor plane including a first at least one terminal of a first polarity, and a first internal capacitor plane including a second at least one terminal of the first polarity. The second at least one terminal of the first polarity may be electrically coupled to the first at least one terminal of the first polarity, and a total area of the second at least one terminal of the first polarity may be less than a total area of the first at least one terminal of the first polarity.
摘要:
Method and apparatus to control delay between lanes in an I/O interface is disclosed. To control the delay between the lanes in the I/O system a programmed delay may be determined and introduced between the lanes. For this purpose the effective time “T” of the lanes is determined. The number of lanes “N” in the I/O interface is identified. The programmed lane to lane delay “D” is determined and a delay circuit having the programmed delay may be introduced between the lanes to reduce AC peak to peak noise in the I/O system.
摘要:
A series of plated through hole (PTH) vias are interconnected by traces that alternate between a top surface and a bottom surface of a dielectric board. The PTH vias in the series can be positioned to create a collinear inductive filter, a coil-type inductive filter, or a transformer. Multiple, electrically isolated series of interconnected PTH vias can be used as a multi-phase inductive filter in one embodiment. In another embodiment, multiple series of interconnected PTH vias are electrically connected by a linking portion of conductive material, resulting in a low-resistance inductive filter. Ferromagnetic material patterns can be embedded in the dielectric board to enhance the inductive characteristics of the interconnected via structures. In one embodiment, a closed-end pattern is provided with two series of interconnected vias coiling around the pattern, resulting in an embedded transformer structure. A method of producing an interconnected series of PTH vias includes providing a dielectric board having a series of holes. In some embodiments, the board includes an embedded ferromagnetic material pattern. The holes and the top and bottom surface of the dielectric board have a conductive material thereupon. Portions of the conductive material are selectively removed, resulting in the embedded inductive filter and/or transformer structure.
摘要:
A multilayer capacitor comprises separate terminals on at least three sides, and on as many as six sides. The capacitor can be fabricated in a large number of different configurations, types, and sizes, depending upon the target application. The separate terminals that are disposed on different sides of the capacitor can be readily coupled to a variety of different adjacent conductors, such as die terminals (including bumpless terminals or bars), IC package terminals (including pads or bars), and the terminals of adjacent discrete components. Methods of fabrication, as well as application of the capacitor to an electronic assembly, are also described.
摘要:
An integrated circuit socket with capacitors and shunts is disclosed. According to one embodiment of the invention, a socket is divided into a shunt area, a socket pin area, and a land side capacitor area. The shunt area may contain a variable number of power shunts, ground shunts, and capacitors. The capacitors are connected across, and serve to decouple, power shunts and ground shunts. The shunts are to supply an electrical current from the capacitors to an integrated circuit device. The socket pin area may be surrounded by a metal fence serving as to lessen electromagnetic interference and as a ground and/or signal reference. The fence may be divided into sub-areas each comprising a coaxial differential signal pin opening pair. In alternate designs, an elongated power bar may serve as a power or ground shunt and may be used with several capacitors.
摘要:
In one embodiment of the invention, an embedded enclosure includes a power plane and first and second ground planes. The power plane has a power surface and a power periphery, and couples power to signals of an integrated circuit operating at a fundamental frequency. The first and second ground planes have first and second ground surfaces and first and second ground peripheries, respectively. The first and second ground planes couple ground to the signals. The first and second ground planes are separated from the power plane by first and second distances, respectively. The first and second ground surfaces are larger than the power surface. The first and second ground peripheries extend at least third and fourth distances from the power periphery, respectively. The third and fourth distances are N and M times larger than the first and second distances, respectively.
摘要:
To accommodate the operational and structural requirements of high performance integrated circuits, an integrated circuit package includes conductive trenches that are formed within a substrate. The trenches provide increased current carrying capacity, lower inductance, higher capacitance, and single and/or dual reference planes for signal conductors. Trench structures can be provided at various locations within the substrate, such as adjacent to signal conductors and embedded capacitors, as well as on the substrate periphery to couple the package to a socket. Trenches can be formed by routing, drilling, imprinting, and/or microperforation. Methods of fabrication, as well as application of the package to an electronic assembly and to an electronic system, are also described.
摘要:
In one embodiment of the invention, an integral capacitor includes a power plane, a ground plane, and a dielectric layer. The power plane has a power surface and a power periphery. The power plane couples power to signals of an integrated circuit operating at a fundamental frequency. The first ground plane have a first ground surface and a first ground periphery. The first ground plane couples ground to the signals. The first ground plane is separated from the power plane by a first distance. The first ground surface is larger than the power surface and the first ground periphery extends at least a second distance from the power periphery. The second distance is at least larger than N times the first distance. The dielectric layer is formed between the power plane and the first ground plane.
摘要:
The invention provides an electronic assembly including a semiconductor chip and a semiconductor package substrate having power and ground shunts. The power and ground shunts of the semiconductor chip include contact pads on a surface thereof that are electrically connected to one another to protect electrical signal contacts on the contact pads from high, low-frequency current. The power shunt in the semiconductor package substrate connects one power plane to another and the ground shunts in the semiconductor package substrate connects one ground plane to another. The power and ground shunts in the semiconductor package substrate dictate terminal pins thereon from high, low-frequency current.