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公开(公告)号:US07989930B2
公开(公告)日:2011-08-02
申请号:US11924134
申请日:2007-10-25
IPC分类号: H01L21/00
CPC分类号: H01L23/3107 , H01L23/4334 , H01L23/49586 , H01L24/28 , H01L24/31 , H01L24/48 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/01004 , H01L2924/01068 , H01L2924/01078 , H01L2924/078 , H01L2924/12044 , H01L2924/1306 , H01L2924/14 , H01L2924/15747 , H01L2924/181 , H05K3/3426 , H05K2201/10689 , H05K2203/124 , Y02P70/613 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: A semiconductor package includes a leadframe defining a die pad, a chip electrically coupled to the die pad, encapsulation material covering the chip and the die pad, and a plurality of lead ends exposed relative to the encapsulation material and configured for electrical communication with the chip, and a nitrogen-containing hydrocarbon coating disposed over at least the lead ends of the leadframe, where the hydrocarbon coating is free of metal particles.
摘要翻译: 半导体封装包括限定芯片焊盘的引线框架,电耦合到管芯焊盘的芯片,覆盖芯片和管芯焊盘的封装材料以及相对于封装材料暴露的多个引线端子,并被配置为与芯片电连通 ,以及设置在引线框架的至少引线端上的含氮烃涂层,其中烃涂层不含金属颗粒。
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公开(公告)号:US20130084658A1
公开(公告)日:2013-04-04
申请号:US13252816
申请日:2011-10-04
CPC分类号: H01L21/78 , H01L21/50 , H01L21/561 , H01L21/565 , H01L21/568 , H01L21/67 , H01L21/67092 , H01L21/67144 , H01L21/683 , H01L21/6836 , H01L23/3107 , H01L2221/68322 , H01L2221/68327 , H01L2221/6834 , H01L2221/68368 , H01L2221/68381 , H01L2924/0002 , H01L2924/00
摘要: In accordance with an embodiment of the present invention, a semiconductor device is manufactured by arranging a plurality of semiconductor devices on a frame with an adhesive foil. The plurality of semiconductor devices is attached to the adhesive foil. The plurality of semiconductor devices is removed from the frame with the adhesive foil using a carbon dioxide snow jet and/or a laser process.
摘要翻译: 根据本发明的实施例,通过在框架上配置多个半导体器件来制造半导体器件,所述半导体器件具有粘合箔。 多个半导体器件附接到粘合箔。 使用二氧化碳喷射和/或激光工艺,使用粘合剂箔从框架中移除多个半导体器件。
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