公开(公告)号：US20090108423A1

公开(公告)日：2009-04-30

申请号：US11924134

申请日：2007-10-25

申请人： Edmund Riedl ,  Joachim Mahler ,  Johannes Lodermeyer ,  Mathias Vaupel ,  Steffen Jordan

发明人： Edmund Riedl ,  Joachim Mahler ,  Johannes Lodermeyer ,  Mathias Vaupel ,  Steffen Jordan

IPC分类号： H01L23/495 ,  H01L21/02

CPC分类号： H01L23/3107 ,  H01L23/4334 ,  H01L23/49586 ,  H01L24/28 ,  H01L24/31 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/078 ,  H01L2924/12044 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H05K3/3426 ,  H05K2201/10689 ,  H05K2203/124 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package includes a leadframe defining a die pad, a chip electrically coupled to the die pad, encapsulation material covering the chip and the die pad, and a plurality of lead ends exposed relative to the encapsulation material and configured for electrical communication with the chip, and a nitrogen-containing hydrocarbon coating disposed over at least the lead ends of the leadframe, where the hydrocarbon coating is free of metal particles.

摘要翻译： 半导体封装包括限定芯片焊盘的引线框架，电耦合到管芯焊盘的芯片，覆盖芯片和管芯焊盘的封装材料以及相对于封装材料暴露的多个引线端子，并被配置为与芯片电连通 ，以及设置在引线框架的至少引线端上的含氮烃涂层，其中烃涂层不含金属颗粒。

公开(公告)号：US07989930B2

公开(公告)日：2011-08-02

申请号：US11924134

申请日：2007-10-25

申请人： Edmund Riedl ,  Joachim Mahler ,  Johannes Lodermeyer ,  Mathias Vaupel ,  Steffen Jordan

发明人： Edmund Riedl ,  Joachim Mahler ,  Johannes Lodermeyer ,  Mathias Vaupel ,  Steffen Jordan

IPC分类号： H01L21/00

CPC分类号： H01L23/3107 ,  H01L23/4334 ,  H01L23/49586 ,  H01L24/28 ,  H01L24/31 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/078 ,  H01L2924/12044 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H05K3/3426 ,  H05K2201/10689 ,  H05K2203/124 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package includes a leadframe defining a die pad, a chip electrically coupled to the die pad, encapsulation material covering the chip and the die pad, and a plurality of lead ends exposed relative to the encapsulation material and configured for electrical communication with the chip, and a nitrogen-containing hydrocarbon coating disposed over at least the lead ends of the leadframe, where the hydrocarbon coating is free of metal particles.

摘要翻译： 半导体封装包括限定芯片焊盘的引线框架，电耦合到管芯焊盘的芯片，覆盖芯片和管芯焊盘的封装材料以及相对于封装材料暴露的多个引线端子，并被配置为与芯片电连通 ，以及设置在引线框架的至少引线端上的含氮烃涂层，其中烃涂层不含金属颗粒。

公开(公告)号：US08410586B2

公开(公告)日：2013-04-02

申请号：US12247031

申请日：2008-10-07

申请人： Edmund Riedl ,  Steffen Jordan ,  Christof Matthias Schilz ,  Fee Hoon Wong

发明人： Edmund Riedl ,  Steffen Jordan ,  Christof Matthias Schilz ,  Fee Hoon Wong

IPC分类号： H01L21/50 ,  H01L23/495

CPC分类号： H01L23/3142 ,  C25D3/56 ,  H01L23/4952 ,  H01L23/49582 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/4554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48655 ,  H01L2224/73265 ,  H01L2224/85455 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor package includes a semiconductor component including a circuit carrier with a plurality of inner contact pads, a semiconductor chip, and a plurality of electrical connections. An adhesion promotion layer is disposed on at least areas of the semiconductor component and a plastic encapsulation material encapsulates at least the semiconductor chip, the plurality of electrical connections and the plurality of the inner contact pads. Surface regions of the semiconductor component are selectively activated.

摘要翻译： 半导体封装包括半导体部件，其包括具有多个内部接触焊盘的电路载体，半导体芯片和多个电连接。 粘合促进层设置在半导体部件的至少一部分上，并且塑料封装材料至少封装半导体芯片，多个电连接和多个内部接触焊盘。 选择性地激活半导体部件的表面区域。

公开(公告)号：US20090065912A1

公开(公告)日：2009-03-12

申请号：US12247031

申请日：2008-10-07

申请人： Edmund Riedl ,  Steffen Jordan ,  Christof Matthias Schilz ,  Fee Hoon Wong

发明人： Edmund Riedl ,  Steffen Jordan ,  Christof Matthias Schilz ,  Fee Hoon Wong

IPC分类号： H01L21/50 ,  H01L23/495

CPC分类号： H01L23/3142 ,  C25D3/56 ,  H01L23/4952 ,  H01L23/49582 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/4554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48655 ,  H01L2224/73265 ,  H01L2224/85455 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor package includes a semiconductor component including a circuit carrier with a plurality of inner contact pads, a semiconductor chip, and a plurality of electrical connections. An adhesion promotion layer is disposed on at least areas of the semiconductor component and a plastic encapsulation material encapsulates at least the semiconductor chip, the plurality of electrical connections and the plurality of the inner contact pads. Surface regions of the semiconductor component are selectively activated.

摘要翻译： 半导体封装包括半导体部件，其包括具有多个内部接触焊盘的电路载体，半导体芯片和多个电连接。 粘合促进层设置在半导体部件的至少一部分上，并且塑料封装材料至少封装半导体芯片，多个电连接和多个内部接触焊盘。 选择性地激活半导体部件的表面区域。

公开(公告)号：US08246330B2

公开(公告)日：2012-08-21

申请号：US12403290

申请日：2009-03-12

申请人： Dogan Ay ,  Steffen Jordan ,  Ingo Stumberg ,  Herbert Schlensker

发明人： Dogan Ay ,  Steffen Jordan ,  Ingo Stumberg ,  Herbert Schlensker

IPC分类号： A61M1/00

CPC分类号： F04B39/12 ,  F04B39/121 ,  F04B39/125 ,  F04B39/16

摘要： The invention relates to an air compressor having a catalyst that is disposed in a reception block. The reception block is interposed between a valve block and a cylinder cover, comprises an inlet port in the region of a valve block outlet port, and an outlet port in the region of a cylinder head inlet port, so the compressed air exiting the valve block outlet port flows through said catalyst and through the outlet port into the cylinder cover.

摘要翻译： 本发明涉及一种具有设置在接收块中的催化剂的空气压缩机。 接收块插入在阀块和气缸盖之间，包括在阀块出口端口的区域中的入口端口和在气缸盖入口端口的区域中的出口，因此离开阀块的压缩空气 出口端口流过所述催化剂并通过出口进入气缸盖。

公开(公告)号：US20090232686A1

公开(公告)日：2009-09-17

申请号：US12403290

申请日：2009-03-12

申请人： Dogan Ay ,  Steffen Jordan ,  Ingo Stumberg ,  Herbert Schlensker

发明人： Dogan Ay ,  Steffen Jordan ,  Ingo Stumberg ,  Herbert Schlensker

IPC分类号： A61M1/00 ,  F04B25/00 ,  B01J19/00

CPC分类号： F04B39/12 ,  F04B39/121 ,  F04B39/125 ,  F04B39/16

摘要： The invention relates to an air compressor having a catalyst that is disposed in a reception block. The reception block is interposed between a valve block and a cylinder cover, comprises an inlet port in the region of a valve block outlet port, and an outlet port in the region of a cylinder head inlet port, so the compressed air exiting the valve block outlet port flows through said catalyst and through the outlet port into the cylinder cover.

摘要翻译： 本发明涉及一种具有设置在接收块中的催化剂的空气压缩机。 接收块插入在阀块和气缸盖之间，包括在阀块出口端口的区域中的入口端口和在气缸盖入口端口的区域中的出口，因此离开阀块的压缩空气 出口端口流过所述催化剂并通过出口进入气缸盖。

公开(公告)号：US20110200455A1

公开(公告)日：2011-08-18

申请号：US12932000

申请日：2011-02-14

申请人： Steffen Jordan ,  Christoph Wilken

发明人： Steffen Jordan ,  Christoph Wilken

IPC分类号： F04B25/00 ,  F04B49/00

CPC分类号： F04B49/035 ,  B60T13/268 ,  B60T17/02 ,  F04B49/24

摘要： A compressed-air compressor for producing compressed air for a compressed-air system of a vehicle includes a cylinder and a piston. The piston is arranged in the cylinder and divides the interior space of the cylinder into a compression chamber, which can be connected to the compressed-air system of the vehicle for the purpose of conveying compressed air, and a neutral chamber. The neutral chamber is charged with an auxiliary pressure such that the pressure in the neutral chamber is temporally on average higher than atmospheric pressure. The compressed air production by means of the piston/cylinder-type compressed-air compressor is improved such that the maximum value of the torque to be imparted for driving the compressor is reduced.

摘要翻译： 一种用于生产用于车辆的压缩空气系统的压缩空气的压缩空气压缩机包括气缸和活塞。 活塞设置在气缸中并将气缸的内部空间分成压缩室，该压缩室可以连接到车辆的压缩空气系统，以便输送压缩空气和中性室。 中性室充有辅助压力，使得中性室中的压力在时间上平均高于大气压。 通过活塞/缸型压缩空气压缩机的压缩空气生产得到改善，使得用于驱动压缩机的扭矩的最大值减小。

公开(公告)号：US09074594B2

公开(公告)日：2015-07-07

申请号：US12932000

申请日：2011-02-14

申请人： Steffen Jordan ,  Christoph Wilken

发明人： Steffen Jordan ,  Christoph Wilken

IPC分类号： F04B49/035 ,  B60T13/26 ,  B60T17/02 ,  F04B49/24

CPC分类号： F04B49/035 ,  B60T13/268 ,  B60T17/02 ,  F04B49/24

摘要： A compressed-air compressor for producing compressed air for a compressed-air system of a vehicle includes a cylinder and a piston. The piston is arranged in the cylinder and divides the interior space of the cylinder into a compression chamber, which can be connected to the compressed-air system of the vehicle for the purpose of conveying compressed air, and a neutral chamber. The neutral chamber is charged with an auxiliary pressure such that the pressure in the neutral chamber is temporally on average higher than atmospheric pressure. The compressed air production using the piston/cylinder-type compressed-air compressor is improved such that the maximum value of the torque to be imparted for driving the compressor is reduced.

摘要翻译： 一种用于生产用于车辆的压缩空气系统的压缩空气的压缩空气压缩机包括气缸和活塞。 活塞设置在气缸中并将气缸的内部空间分成压缩室，该压缩室可以连接到车辆的压缩空气系统，以便输送压缩空气和中性室。 中性室充有辅助压力，使得中性室中的压力在时间上平均高于大气压。 改善了使用活塞/圆柱型压缩空气压缩机的压缩空气生产，从而降低了用于驱动压缩机的扭矩的最大值。

公开(公告)号：US20130133768A1

公开(公告)日：2013-05-30

申请号：US13682002

申请日：2012-11-20

申请人： Konrad Feyerabend ,  Steffen Jordan ,  Sebastian Rakowshi

发明人： Konrad Feyerabend ,  Steffen Jordan ,  Sebastian Rakowshi

IPC分类号： F04B49/22

CPC分类号： F04B49/225 ,  F04B27/067 ,  F04B49/03 ,  Y10T137/86485

摘要： A compressor system for a compressed-air supply arrangement includes an adjustable throttle device arranged in the suction line of the compressor. The throttle device is adjustable between a fully open load position and an idle position with a predefined narrowed throttle cross section. The idle power of the compressor is reduced as a result of the reduction of the pressure level downstream of the throttle device without additional lines, filters or the like.

摘要翻译： 用于压缩空气供应装置的压缩机系统包括布置在压缩机的吸入管线中的可调节流装置。 节气门装置可在完全打开的负载位置和怠速位置之间进行调节，并具有预定义的窄节流横截面。 压缩机的空载功率因节流装置下游的压力水平的降低而减少，而没有额外的管线，过滤器等。

公开(公告)号：US20110123367A1

公开(公告)日：2011-05-26

申请号：US12994370

申请日：2009-02-24

申请人： Steffen Jordan ,  Christoph Wilken

发明人： Steffen Jordan ,  Christoph Wilken

IPC分类号： F04B35/00

CPC分类号： F04B35/04 ,  F04B39/064 ,  F04B39/12

摘要： The present invention relates to a device for operating an auxiliary assembly (16), comprising a housing (14), of a vehicle, in particular of a utility vehicle, having a drive unit (12) which comprises a further housing (18) and has the purpose of making available a torque, a shaft (30) for transmitting the torque from the drive unit (12) to the auxiliary assembly (16), wherein the shaft (30) projects into the housing (14) of the auxiliary assembly (16) or into the further housing (18) of the drive unit (12). Furthermore, the drive unit (12) and the auxiliary assembly (16) form a common coolant circuit (52) for cooling the drive unit (12) and the auxiliary assembly (16).

摘要翻译： 本发明涉及一种用于操作包括车辆（尤其是多功能车辆）的车辆（14）的辅助组件（16）的装置，具有驱动单元（12），该驱动单元包括另外的壳体（18）和 具有提供扭矩的目的，用于将扭矩从驱动单元（12）传递到辅助组件（16）的轴（30），其中轴（30）伸入辅助组件的壳体（14） （16）或进入驱动单元（12）的另一壳体（18）中。 此外，驱动单元（12）和辅助组件（16）形成用于冷却驱动单元（12）和辅助组件（16）的公共冷却剂回路（52）。