摘要:
A semiconductor device comprising floating body memory cells performs read and write operations by selectively connecting bit lines and inverted bit lines to sense bit lines and inverted sense bit lines.
摘要:
A semiconductor memory device including a transistor having a vertical channel structure is provided. The device comprises a first sub memory cell array comprising a first memory cell connected to a first bit lines and comprising a transistor having a vertical channel structure, a second sub memory cell array comprising a second memory cell connected to a first inverted bit lines and comprising a transistor having a vertical channel structure, and a plurality of precharge blocks. In addition, first and second precharge blocks are disposed at first and second sides of the first bit line and precharge the first bit line, and third and fourth precharge blocks are disposed at first and second sides of the first inverted bit line and precharge the first inverted bit line.
摘要:
A semiconductor memory device includes a memory cell array including a plurality of memory cells having a transistor with a floating body, a source line driver configured to control the source lines to select the memory cells in response to an address signal, a source line voltage generation unit configured to generate a source line target voltage, receive an source line output voltage from the source line driver, compare the level of the source line output voltage with the level of the source line target voltage, generate a source line voltage of which the level is adaptively varied according to a temperature, and a sense amplifier configured to sense a difference in current flowing through the bit lines in response to data read from a selected memory cell, amplify the difference to a level having high output driving capability and output the amplified current.
摘要:
In one aspect, a semiconductor memory device is provided which includes complementary first and second bit lines, a unit memory cell including complementary first and second floating body transistor capacitorless memory cells respectively coupled to the complementary first and second bit lines, and a voltage sense amplifier coupled between the complementary first and second bit lines which amplifies a voltage differential between the complementary first and second bit lines.
摘要:
A semiconductor memory device including a transistor having a vertical channel structure is provided. The device includes a first sub memory cell array including a first memory cell connected to a first bit lines and including a transistor having a vertical channel structure, a second sub memory cell array including a second memory cell connected to a first inverted bit lines and including a transistor having a vertical channel structure, and a plurality of precharge blocks. In addition, first and second precharge blocks are disposed at first and second sides of the first bit line and precharge the first bit line, and third and fourth precharge blocks are disposed at first and second sides of the first inverted bit line and precharge the first inverted bit line.
摘要:
A semiconductor memory device having the mismatch cell makes a capacitance difference between a bit line pair relatively large during a read operation using at least one dummy memory cell as a mismatch cell selected together with a corresponding memory cell. Therefore, data of a semiconductor memory device may be detected more easily.
摘要:
One embodiment includes a plurality of word lines, a plurality of bit lines intersecting with the plurality of word lines, a plurality of memory cells formed at intersections of and connected to the plurality of word lines and the plurality of bit lines. Each of the plurality of memory cells may be a floating body cell. A bit line selecting circuit may be configured to selectively connect each of the plurality of bit lines to an output bit line. The embodiment may further include plurality of sense amplifiers, where the plurality of sense amplifiers is greater than one and less than the plurality of bit lines in number. A sense amplifier switching structure may be configured to selectively connect each of the plurality of sense amplifiers to the output bit line.
摘要:
Example embodiments relate to a driver circuit and a semiconductor memory device including the driver circuit. The driver circuit includes a pull-up unit configured to connect an output node to a first power supply voltage in response to an input signal, an interface unit connected between the output node and a first node to decrease a voltage of the output node in response to a control signal, and a pull-down unit configured to connect the first node to a second power supply voltage. The interface unit includes a first transistor configured to connect the output node with the first node in response to the control signal and a first resistor connected between the output node and the first node. The interface unit may also include a second resistor and a second transistor connected in series between the output node and the first node.
摘要:
A semiconductor memory device includes first and second memory cells having floating bodies, each of which includes a gate connected to a word line and an electrode connected to a common source line to store data. A controller applies a first voltage to the common source line, a negative second voltage to the word line, a third voltage as a first sense enable control voltage and the first voltage as a second sense enable control voltage during a first write period of a write operation. The controller also applies a fourth voltage to the common source line and the first voltage to the word line during a second write period of the write operation. The sensing portion amplifies a bit line and an inverted bit line to the third voltage or the first voltage, respectively, during the first write period in response to the first and second sense enable control voltages.
摘要:
A semiconductor device is provided which includes an NMOS vertical channel transistor located on a substrate and including a p+ polysilicon gate electrode surrounding a vertical p-channel region, and a PMOS vertical channel transistor located on the substrate and including an n+ polysilicon gate electrode surrounding a vertical n-channel region. The NMOS and PMOS vertical channel transistors are optionally operable in a CMOS operational mode.