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11.发明授权Polyimide film, method of manufacture, and metal interconnect board with polyimide film substrate 有权聚酰亚胺膜，制造方法和具有聚酰亚胺膜基材的金属互连板公开(公告)号：US06908685B2
公开(公告)日：2005-06-21
申请号：US10343277
申请日：2001-08-23
Applicant: Kenji Uhara , Kouichi Sawasaki , Naofumi Yasuda , Brian C. Auman , John D. Summers
Inventor： Kenji Uhara , Kouichi Sawasaki , Naofumi Yasuda , Brian C. Auman , John D. Summers
CPC classification number: H05K1/0346 , C08G73/1042 , Y10S428/901 , Y10T428/24917 , Y10T428/31678 , Y10T428/31721
Abstract: The invention provides a polyimide film manufactured from a polyamic acid prepared from pyromellitic dianhydride in combination with 10 to 60 mol % of phenylenediamine and 40 to 90 mol % of 3,4′-oxydianiline, based on the overall diamine. The polyimide film, when used as a metal interconnect board substrate in flexible circuits, chip scale packages (CSP), ball grid arrays (BGA) or tape-automated bonding (TAB) tape by providing metal interconnects on the surface thereof, achieves a good balance between a high elastic modulus, a low thermal expansion coefficient, alkali etchability and film formability.
Abstract translation: 本发明提供一种聚酰亚胺膜，其由均苯四酸二酐制备的聚酰胺酸与10至60mol％的苯二胺和40至90mol％的3,4'-氧二苯胺（基于总二胺）组合。 聚酰亚胺薄膜通过在其表面上提供金属互连作为柔性电路中的金属互连板基板，芯片级封装（CSP），球栅阵列（BGA）或带自动键合（TAB） 高弹性模量，低热膨胀系数，碱蚀刻性和成膜性之间的平衡。
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公开(公告)号：US5426071A
公开(公告)日：1995-06-20
申请号：US205440
申请日：1994-03-04
Applicant: John D. Summers
Inventor： John D. Summers
IPC: C08G73/10 , C08J5/18 , H01L21/027 , H01L21/28
CPC classification number: C08J5/18 , C08G73/1039 , H01L21/0272 , C08J2379/08
Abstract: A polyimide copolymer derived from 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride, oxydiphthalic dianhydride, m-phenylene diamine and 4,4'-oxydianiline, for use as a high-temperature resistant lift-off layer in the fabrication of integrated circuit substrates.
Abstract translation: 衍生自2,2-双（3,4-二羧基苯基）六氟丙烷二酐，氧联二邻苯二甲酸二酐，间苯二胺和4,4'-氧二苯胺的聚酰亚胺共聚物，用作制造中的耐高温剥离层 的集成电路基板。
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公开(公告)号：US5202412A
公开(公告)日：1993-04-13
申请号：US591225
申请日：1990-10-02
Applicant: Brian C. Auman , John D. Summers
Inventor： Brian C. Auman , John D. Summers
CPC classification number: C08G73/1042 , C08G73/14
Abstract: Soluble polymeric precursors having oligomeric imide and amic acid segments, which are suitable to form segmented, preferably insoluble, polyimide copolymers.
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公开(公告)号：US5026823A
公开(公告)日：1991-06-25
申请号：US406677
申请日：1989-09-12
Applicant: John D. Summers , Thomas O. Jeanes
Inventor： John D. Summers , Thomas O. Jeanes
IPC: C08G73/10
CPC classification number: C08G73/1082 , C08G73/10 , C08G73/1046 , C08G73/1057
Abstract: This invention relates to novel polyimides derived from alicyclic dianhydrides and a process for synthesizing the polyimides.
Abstract translation: 本发明涉及衍生自脂环族二酐的新型聚酰亚胺和聚酰亚胺的合成方法。
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公开(公告)号：US4988371A
公开(公告)日：1991-01-29
申请号：US406675
申请日：1989-09-12
Applicant: Thomas O. Jeanes , John D. Summers , Edgar S. Sanders, Jr.
Inventor： Thomas O. Jeanes , John D. Summers , Edgar S. Sanders, Jr.
CPC classification number: C08G73/105 , B01D71/64 , C08G73/10 , C08G73/1064 , C08G73/1082
Abstract: This invention relates to novel polyimide gas separation membranes derived from alicyclic dianhydrides and aliphatic, alicyclic, or aromatic diamines, and a process for using such membranes.
Abstract translation: 本发明涉及衍生自脂环族二酸酐和脂族，脂环族或芳族二胺的新型聚酰亚胺气体分离膜及其使用方法。
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Patent Agency Ranking
公开(公告)号：US09255208B2
公开(公告)日：2016-02-09
申请号：US13383491
申请日：2010-06-11
Applicant: Jay Robert Dorfman , John D. Summers
Inventor： Jay Robert Dorfman , John D. Summers
Abstract: The present invention uses a silver/silver chloride composition and ink jet technology in the art of digital printing, especially for use in blood glucose sensors.
Abstract translation: 本发明在数字印刷领域中使用银/氯化银组合物和喷墨技术，特别是用于血糖传感器。
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17.发明申请Methods for creating electronic circuitry comprising phenolic epoxy binder compositions 审中-公开制备包含酚醛环氧粘合剂组合物的电子电路的方法公开(公告)号：US20080118633A1
公开(公告)日：2008-05-22
申请号：US11982766
申请日：2007-11-05
Applicant: Cheng-Chung Chen , Thomas Eugene Dueber , Shane Fang , John D. Summers
Inventor： Cheng-Chung Chen , Thomas Eugene Dueber , Shane Fang , John D. Summers
IPC: B05D5/12
CPC classification number: H01C17/06586 , H01C7/005 , H05K1/095 , H05K1/167
Abstract: The invention relates generally to methods for creating circuitry components from binder materials having a hydrophobic phenolic component and a hydrophobic epoxy component. The phenolic/epoxy based liquids, solutions, suspensions and/or pastes can generally be screen printed or otherwise formed on an electronic substrate, pattern or device, to provide an electronic component having low water sorption properties.
Abstract translation: 本发明一般涉及从具有疏水性酚类成分和疏水环氧组分的粘合剂材料制备电路元件的方法。 酚醛/环氧基液体，溶液，悬浮液和/或糊剂通常可以丝网印刷或以其它方式形成在电子基材，图案或装置上，以提供具有低吸水性质的电子部件。
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18.发明授权Polyimide compositions having resistance to water sorption, and methods relating thereto 失效具有耐水吸附性的聚酰亚胺组合物及其相关方法公开(公告)号：US07348373B2
公开(公告)日：2008-03-25
申请号：US10782326
申请日：2004-02-19
Applicant: Thomas E. Dueber , John D. Summers , Xin Fang
Inventor： Thomas E. Dueber , John D. Summers , Xin Fang
IPC: C08G73/10
CPC classification number: C08G73/1032 , C08G73/1039 , C08G73/1042 , C08G73/1064 , C08K5/0008 , C08L79/08 , H05K1/0346
Abstract: Water absorption resistant polyimide pastes (or solutions), are particularly useful to make electronic screen printable pastes and the electronic components made from these pastes. A group of soluble polyimides and their solvents were discovered to be particularly resistant to moisture absorption. These polyimide solutions optionally contain polyimides also containing cross-linkable monomers and/or thermal cross-linking agents. In addition, these polyimide pastes may optionally contain adhesion promoting agents, blocked isocyanates, metals, metal oxides, and other inorganic fillers. The polyimide pastes (or solutions) of the present invention have a polyimide with a glass transition temperature greater than 250° C., have a water absorption factor of less than 2%, and a have a positive solubility measurement.
Abstract translation: 吸水性聚酰亚胺浆料（或溶液）对于制造电子丝网印刷浆料和由这些浆料制成的电子部件特别有用。 发现一组可溶性聚酰亚胺及其溶剂特别耐吸湿性。 这些聚酰亚胺溶液任选地含有也含有可交联单体和/或热交联剂的聚酰亚胺。 此外，这些聚酰亚胺浆料可任选地含有粘合促进剂，封闭的异氰酸酯，金属，金属氧化物和其它无机填料。 本发明的聚酰亚胺膏（或溶液）具有玻璃化转变温度大于250℃的聚酰亚胺，吸水系数小于2％，并且具有正的溶解度测量。
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公开(公告)号：US20070290379A1
公开(公告)日：2007-12-20
申请号：US11453388
申请日：2006-06-15
Applicant: Thomas E. Dueber , John D. Summers
Inventor： Thomas E. Dueber , John D. Summers
IPC: H01L23/29
CPC classification number: C08G73/1039 , C08G73/1064 , C09D179/08 , H01G4/224 , H01G9/08 , H05K1/162 , H05K2201/0154 , H05K2201/0187 , H05K2201/0355 , H05K2201/09763
Abstract: Disclosed area compositions comprising: a polyimide resin with a water absorption of 2% or less and, optionally, one or more of an electrically insulated filler, a defoamer and a colorant and one or more organic solvents. The compositions are useful as encapsulants and have a consolidation temperature of 190° C. or less.
Abstract translation: 公开的区域组合物包括：吸水率为2％或更低的聚酰亚胺树脂，以及任选的一种或多种电绝缘填料，消泡剂和着色剂以及一种或多种有机溶剂。 该组合物可用作密封剂并具有190℃或更低的固结温度。
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20.发明授权
公开(公告)号：US5393864A
公开(公告)日：1995-02-28
申请号：US051828
申请日：1993-04-26
Applicant: John D. Summers
Inventor： John D. Summers
CPC classification number: C08G73/1039 , H01B3/306 , H05K1/0346 , H05K3/4676
Abstract: A random polyimide copolymer, based on a rigid dianhydride, a rigid diamine and an additional diamine and/or dianhydride containing one or more flexibilizing linkages. Soft-baked coatings of the poly(amic acid) precursor are readily processed using conventional aqueous base developers, such as tetramethylammonium hydroxide. The polyimide and soft-baked coatings are useful as a dielectric layer In multichip module applications or as a stress buffer coating.
Abstract translation: 基于刚性二酸酐的无规聚酰亚胺共聚物，刚性二胺和含有一个或多个柔性键的另外的二胺和/或二酐。 使用常规的水性碱性显影剂如氢氧化四甲基铵容易地加工聚（酰胺酸）前体的软烘烤涂层。 聚酰亚胺和软烘烤涂层可用作多芯片模块应用中的介电层或作为应力缓冲涂层。
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