公开(公告)号：US07995263B1

公开(公告)日：2011-08-09

申请号：US12317603

申请日：2008-12-26

申请人： Ju-Ai Ruan

发明人： Ju-Ai Ruan

IPC分类号： G02B26/00

CPC分类号： G02B26/02

摘要： A spatial light modulator suitable for flat panel displays and methods of making the modulators are disclosed. The light modulator comprises a light separator, integrated circuits (IC), light switches (concurrently called light shutters), and optional color filters. The light separator is used to direct light uniformly illuminated on the incident surface (entrance surface) into individual pixels, and condenses the light within each pixel to a small fraction of pixel space on the viewing surface. ICs and light shutters are used to control color and light intensity at individual pixels. Several novel designs of the light modulator and light shutters are disclosed. Methods of building self-aligned structures for placing micro-spherical ball spacers for attaching protective screens to the light modulator is also disclosed.

摘要翻译： 公开了适用于平板显示器的空间光调制器和制造调制器的方法。 光调制器包括光分离器，集成电路（IC），光开关（同时称为光闸）和可选的滤色器。 光分离器用于将均匀地照射在入射表面（入射面）上的光引导到单独的像素中，并且将每个像素内的光聚焦到观察表面上的一小部分像素空间。 IC和光闸用于控制各个像素的颜色和光强度。 公开了光调制器和光闸的若干新颖设计。 还公开了用于将用于将防护屏幕附着到光调制器的微球形球隔离件的自对准结构的方法。

公开(公告)号：US06790777B2

公开(公告)日：2004-09-14

申请号：US10288717

申请日：2002-11-06

申请人： Glenn J. Tessmer ,  Ju-Ai Ruan ,  Mercer Lusk Brugler ,  Sarah Hartwig

发明人： Glenn J. Tessmer ,  Ju-Ai Ruan ,  Mercer Lusk Brugler ,  Sarah Hartwig

IPC分类号： H01L2144

CPC分类号： H01L21/76834 ,  Y10S438/906 ,  Y10S438/913 ,  Y10S438/974

摘要： The present invention relates to a method for improving an interface of a semiconductor device. The method comprises providing a first and second substrate having an oxidized region, and establishing a first loading position in a first process chamber. The first and second substrates are consecutively inserted into the first process chamber and generally simultaneously processed, wherein the oxidized region is reduced by exposure to a first plasma. The first and second substrates are then consecutively removed and the first substrate is inserted into a second process chamber and subsequently processed. The second substrate is then inserted into the second process chamber and the first and second substrates are simultaneously processed. The first substrate is the removed, and the second substrate is processed again. According to one exemplary aspect, the first and second substrates are exposed to a first temperature in the first process chamber for approximately half the time the first and second substrates are exposed to a higher second temperature in the second process chamber while maintaining throughput of substrates.

公开(公告)号：US06686283B1

公开(公告)日：2004-02-03

申请号：US09498083

申请日：2000-02-04

申请人： Shawn T. Walsh ,  John E. Campbell ,  Somit Joshi ,  James B. Friedmann ,  Michael J. McGranaghan ,  Janice D. Makos ,  Arun Sivasothy ,  Troy A. Yocum ,  Jaideep Mavoori ,  Wayne A. Bather ,  Joe G. Tran ,  Ju-Ai Ruan ,  Michelle L. Hartsell ,  Gregory B. Shinn

发明人： Shawn T. Walsh ,  John E. Campbell ,  Somit Joshi ,  James B. Friedmann ,  Michael J. McGranaghan ,  Janice D. Makos ,  Arun Sivasothy ,  Troy A. Yocum ,  Jaideep Mavoori ,  Wayne A. Bather ,  Joe G. Tran ,  Ju-Ai Ruan ,  Michelle L. Hartsell ,  Gregory B. Shinn

IPC分类号： H01L2176

CPC分类号： H01L21/76229 ,  H01L21/31056

摘要： A method for forming planar isolation structures for integrated circuits. A etch barrier is formed over the isolation fill material and an etch back is performed to remove material above unetched portions of the substrate. The exposed fill material is etched and planarized to form a planar isolation structure.

摘要翻译： 一种用于形成用于集成电路的平面隔离结构的方法。 在隔离填充材料上形成蚀刻阻挡层，并且执行回蚀以去除衬底的未蚀刻部分上方的材料。 将暴露的填充材料蚀刻并平坦化以形成平面隔离结构。