Method of fabricating microelectromechanical system structures
    11.
    发明授权
    Method of fabricating microelectromechanical system structures 失效
    制造微机电系统结构的方法

    公开(公告)号:US07405466B2

    公开(公告)日:2008-07-29

    申请号:US11643584

    申请日:2006-12-21

    摘要: A method of simultaneously bonding components, comprising the following steps. At least first, second and third components are provided and comprise: at least one glass component; and at least one conductive or semiconductive material component. The order of stacking of the components is determined to establish interfaces between the adjacent components. A hydrogen-free amorphous film is applied to one of the component surfaces at each interface comprising an adjacent: glass component; and conductive or semiconductive component. A sol gel with or without alkaline ions film is applied to one of the component surfaces at each interface comprising an adjacent: conductive or semiconductive component; and conductive or semiconductive component. The components are simultaneously anodically bonded in the determined order of stacking.

    摘要翻译: 一种同时结合部件的方法,包括以下步骤。 提供至少第一,第二和第三部件,并且包括:至少一个玻璃部件; 和至少一种导电或半导体材料组分。 确定组件的堆叠顺序以建立相邻部件之间的界面。 在包含相邻玻璃组分的每个界面处,将一个无氢非晶膜施加到一个部件表面上; 和导电或半导体组件。 具有或不具有碱性离子膜的溶胶凝胶被施加到包括相邻导电或半导体组分的每个界面处的一个部件表面; 和导电或半导体组件。 这些组分以确定的堆叠顺序同时阳极结合。

    Projection lamp
    13.
    外观设计

    公开(公告)号:USD981638S1

    公开(公告)日:2023-03-21

    申请号:US29780141

    申请日:2021-04-22

    申请人: Jun Wei

    设计人: Jun Wei

    Projection lamp
    14.
    外观设计

    公开(公告)号:USD891682S1

    公开(公告)日:2020-07-28

    申请号:US29666725

    申请日:2018-10-15

    申请人: Jun Wei

    设计人: Jun Wei

    Apogossypolone derivatives as anticancer agents
    15.
    发明授权
    Apogossypolone derivatives as anticancer agents 有权
    聚鸟苷酸衍生物作为抗癌剂

    公开(公告)号:US08937193B2

    公开(公告)日:2015-01-20

    申请号:US12900378

    申请日:2010-10-07

    摘要: The disclosure provides compounds and methods of using Apogossypolone derivatives for treating diseases and disorders. In particular, the disclosure provides compounds of Formula I: or a pharmaceutically acceptable salt, hydrate, or solvate thereof, and provides methods for the preparation of compounds of Formula I; and methods for treating cancer, autoimmune diseases, and inflammation by administering a compound of Formula I.

    摘要翻译: 本公开提供了使用果聚酚衍生物治疗疾病和病症的化合物和方法。 特别地,本公开提供式I化合物或其药学上可接受的盐,水合物或溶剂合物,并提供制备式I化合物的方法; 以及通过给予式I化合物治疗癌症,自身免疫疾病和炎症的方法。

    CLINIC COMPLIANT METHOD FOR BANKING HUMAN PLACENTAL MESENCHYMAL CELLS
    16.
    发明申请
    CLINIC COMPLIANT METHOD FOR BANKING HUMAN PLACENTAL MESENCHYMAL CELLS 审中-公开
    用于储存人类细胞胚胎细胞的临床合适方法

    公开(公告)号:US20100272694A1

    公开(公告)日:2010-10-28

    申请号:US12747307

    申请日:2008-10-17

    摘要: The present invention relates to a method for processing human placental cell sample, a human placental cell sample obtained according to said method for processing human placental cell sample, a human placental cell bank, a method for banking human placental cells, a method for searching human placental cell sample in said human placental cell bank according to the present invention, a method for preparing human cord blood serum, use of human placental cells obtained by said method for processing human placental cell sample or human placental cell bank established by said method for banking human placental cells in treating human dysfunction and diseases due to cell injury or cell malfunction, as well as a method for treating human dysfunction and diseases due to cell injury or cell malfunction.

    摘要翻译: 本发明涉及一种处理人胎盘细胞样品的方法,根据所述用于处理人胎盘细胞样品的方法获得的人胎盘细胞样品,人胎盘细胞库,人类胎盘细胞的储存方法,人类检索方法 根据本发明的所述人胎盘细胞库中的胎盘细胞样品,用于制备人脐带血清的方法,使用通过所述方法获得的人胎盘细胞,所述方法用于处理通过所述银行方法建立的人胎盘细胞样品或人胎盘细胞库 人胎盘细胞治疗人类功能障碍和由于细胞损伤或细胞功能障碍引起的疾病,以及用于治疗人类功能障碍和由细胞损伤或细胞故障引起的疾病的方法。

    Method of fabricating microelectromechanical system structures
    17.
    发明申请
    Method of fabricating microelectromechanical system structures 失效
    制造微机电系统结构的方法

    公开(公告)号:US20070105342A1

    公开(公告)日:2007-05-10

    申请号:US11643584

    申请日:2006-12-21

    IPC分类号: H01L21/30 H01L21/46

    摘要: A method of simultaneously bonding components, comprising the following steps. At least first, second and third components are provided and comprise: at least one glass component; and at least one conductive or semiconductive material component. The order of stacking of the components is determined to establish interfaces between the adjacent components. A hydrogen-free amorphous film is applied to one of the component surfaces at each interface comprising an adjacent: glass component; and conductive or semiconductive component. A sol gel with or without alkaline ions film is applied to one of the component surfaces at each interface comprising an adjacent: conductive or semiconductive component; and conductive or semiconductive component. The components are simultaneously anodically bonded in the determined order of stacking.

    摘要翻译: 一种同时结合部件的方法,包括以下步骤。 提供至少第一,第二和第三部件,并且包括:至少一个玻璃部件; 和至少一种导电或半导体材料组分。 确定组件的堆叠顺序以建立相邻部件之间的界面。 在包含相邻玻璃组分的每个界面处,将一个无氢非晶膜施加到一个部件表面上; 和导电或半导体组件。 具有或不具有碱性离子膜的溶胶凝胶被施加到包括相邻导电或半导体组分的每个界面处的一个部件表面; 和导电或半导体组件。 这些组分以确定的堆叠顺序同时阳极结合。

    Ultra-small Profile, Low Cost Chip Scale Accelerometers of Two and Three Axes Based on Wafer Level Packaging
    20.
    发明申请
    Ultra-small Profile, Low Cost Chip Scale Accelerometers of Two and Three Axes Based on Wafer Level Packaging 审中-公开
    基于晶圆级封装的两轴和三轴超小型,低成本芯片尺寸加速度计

    公开(公告)号:US20060179940A1

    公开(公告)日:2006-08-17

    申请号:US10906269

    申请日:2005-02-11

    IPC分类号: G01P15/00

    CPC分类号: G01P15/18 G01P15/008

    摘要: Several micro-machined, ultra-profile two-axis and three-axis accelerometers are fabricated by CMOS-compatible process, which makes them suitable for volume production. The x, y axis signal is based on natural thermal convection, and z-axis signal may be based on thermal convention or piezoresistive in nature. The bulk MEMS (Micro-Electro-Mechanical-Systems) process is based on Deep Reactive Ion Etching (DRIE). After the front-end fabrication process, the accelerometers are packaged at wafer level by glass frit and/or anodic bonding, which lowers the device cost.

    摘要翻译: 通过CMOS兼容工艺制造出几个微加工的超型二轴和三轴加速度计,使其适合批量生产。 x,y轴信号基于自然热对流,z轴信号可以基于热惯性或压阻性质。 大容量MEMS(微机电系统)工艺基于深反应离子蚀刻(DRIE)。 在前端制造过程之后,加速度计通过玻璃料和/或阳极粘合在晶片级封装,这降低了器件成本。