公开(公告)号：US20180348147A1

公开(公告)日：2018-12-06

申请号：US15828632

申请日：2017-12-01

Applicant: KLA-Tencor Corporation

Inventor： Eugene Shifrin ,  Bjorn Brauer ,  Sumit Sen ,  Ashok Mathew ,  Sreeram Chandrasekaran ,  Lisheng Gao

IPC: G01N21/95 ,  G01N21/956

Abstract: Defects from a hot scan can be saved, such as on persistent storage, random access memory, or a split database. The persistent storage can be patch-based virtual inspector virtual analyzer (VIVA) or local storage. Repeater defect detection jobs can determined and the wafer can be inspected based on the repeater defect detection jobs. Repeater defects can be analyzed and corresponding defect records to the repeater defects can be read from the persistent storage. These results may be returned to the high level defect detection controller.

公开(公告)号：US10127651B2

公开(公告)日：2018-11-13

申请号：US15356729

申请日：2016-11-21

Applicant: KLA-Tencor Corporation

Inventor： Ashok Kulkarni ,  Saibal Banerjee ,  Santosh Bhattacharyya ,  Bjorn Brauer

IPC: G06K9/00 ,  G06T7/00

Abstract: Criticality of a detected defect can be determined based on context codes. The context codes can be generated for a region, each of which may be part of a die. Noise levels can be used to group context codes. The context codes can be used to automatically classify a range of design contexts present on a die without needing certain information a priori.

公开(公告)号：US20180276808A1

公开(公告)日：2018-09-27

申请号：US15858264

申请日：2017-12-29

Applicant: KLA-Tencor Corporation

Inventor： Bjorn Brauer ,  Benjamin Murray ,  Shishir Suman ,  Lisheng Gao

IPC: G06T7/00 ,  G06T7/73 ,  G06F17/50

Abstract: Systems and methods of a two-pass inspection methodology that dynamically creates micro care areas for inspection of repeater defects. Micro care areas can be formed around each location of a repeater defect. After inspection, additional repeater defects in the micro care areas can be identified. Attributes of the repeater defects can be compared and any repeater defects with attributes that deviate from an expected group attribute distribution can be classified as nuisance.

公开(公告)号：US20180157933A1

公开(公告)日：2018-06-07

申请号：US15720272

申请日：2017-09-29

Applicant: KLA-Tencor Corporation

Inventor： Bjorn Brauer ,  Vijay Ramachandran ,  Richard Wallingford ,  Scott Allen Young

IPC: G06K9/62 ,  G06T7/00

CPC classification number: G06K9/6255 ,  G06K9/6274 ,  G06K2209/19 ,  G06N3/0454 ,  G06N3/082 ,  G06T7/0004 ,  G06T7/0008 ,  G06T7/001 ,  G06T2207/20021 ,  G06T2207/20084 ,  G06T2207/30148

Abstract: Systems and methods for providing an augmented input data to a convolutional neural network (CNN) are disclosed. Wafer images are received at a processor. The wafer image is divided into a plurality of references images each associated with a die in the wafer image. Test images are received. A plurality of difference images are created by differences the test images with the reference images. The reference images and difference images are assembled into the augmented input data for the CNN and provided to the CNN.

公开(公告)号：US11010885B2

公开(公告)日：2021-05-18

申请号：US16406374

申请日：2019-05-08

Applicant: KLA-Tencor Corporation

Inventor： Bjorn Brauer ,  Richard Wallingford ,  Kedar Grama ,  Hucheng Lee ,  Sangbong Park

IPC: G06K9/00 ,  G06T7/00 ,  G06K9/62 ,  G01R31/265

Abstract: One or more semiconductor wafers or portions thereof are scanned using a primary optical mode, to identify defects. A plurality of the identified defects, including defects of a first class and defects of a second class, are selected and reviewed using an electron microscope. Based on this review, respective defects of the plurality are classified as defects of either the first class or the second class. The plurality of the identified defects is imaged using a plurality of secondary optical modes. One or more of the secondary optical modes are selected for use in conjunction with the primary optical mode, based on results of the scanning using the primary optical mode and the imaging using the plurality of secondary optical modes. Production semiconductor wafers are scanned for defects using the primary optical mode and the one or more selected secondary optical modes.

公开(公告)号：US10964016B2

公开(公告)日：2021-03-30

申请号：US16295715

申请日：2019-03-07

Applicant: KLA-TENCOR CORPORATION

Inventor： Bjorn Brauer

IPC: G06T7/00

Abstract: A best optical inspection mode to detect defects can be determined when no defect examples or only a limited number of defect examples are available. A signal for a defect of interest at the plurality of sites and for the plurality of modes can be determined using electromagnetic simulation. A ratio of the signal for the defect of interest to the noise at each combination of the plurality of sites and the plurality of modes can be determined. A mode with optimized signal-to-noise characteristics can be determined based on the ratios.

公开(公告)号：US10801968B2

公开(公告)日：2020-10-13

申请号：US16389442

申请日：2019-04-19

Applicant: KLA-TENCOR CORPORATION

Inventor： Bjorn Brauer

IPC: G01N21/88 ,  G01N21/95 ,  G01N21/956

Abstract: Based on job dumps for defects of interest and nuisance events for multiple optical modes, detection algorithms, and attributes, the best combination of the aforementioned is identified. Combinations of each of the modes with each of the detection algorithms can be compared for all the defects of interest detected at an offset of zero. Capture rate versus nuisance rate can be determined for one of the attributes in each of the combinations.

公开(公告)号：US10713534B2

公开(公告)日：2020-07-14

申请号：US16109631

申请日：2018-08-22

Applicant: KLA-Tencor Corporation

Inventor： Bjorn Brauer

IPC: G06K9/00 ,  H01L21/00 ,  G06K9/62 ,  G06T7/00

Abstract: Methods and systems for training a learning based defect classifier are provided. One method includes training a learning based defect classifier with a training set of defects that includes identified defects of interest (DOIs) and identified nuisances. The DOIs and nuisances in the training set include DOIs and nuisances identified on at least one training wafer and at least one inspection wafer. The at least one training wafer is known to have an abnormally high defectivity and the at least one inspection wafer is expected to have normal defectivity.

公开(公告)号：US20200132610A1

公开(公告)日：2020-04-30

申请号：US16389442

申请日：2019-04-19

Applicant: KLA-TENCOR CORPORATION

Inventor： Bjorn Brauer

IPC: G01N21/88 ,  G01N21/95 ,  G01N21/956

Abstract: Based on job dumps for defects of interest and nuisance events for multiple optical modes, detection algorithms, and attributes, the best combination of the aforementioned is identified. Combinations of each of the modes with each of the detection algorithms can be compared for all the defects of interest detected at an offset of zero. Capture rate versus nuisance rate can be determined for one of the attributes in each of the combinations.

公开(公告)号：US20190361363A1

公开(公告)日：2019-11-28

申请号：US16400756

申请日：2019-05-01

Applicant: KLA-TENCOR CORPORATION

Inventor： Bjorn Brauer

IPC: G03F9/00 ,  G06F11/34

Abstract: Alignment can be monitored by positioning at least one alignment verification location per alignment frame. The alignment verification location is a coordinate within the alignment frame. A distance between each of the alignment verification locations and a closest instance of an alignment target is determined. An alignment score can be determined based on the distance. The alignment score can include a number of the alignment frames between the alignment verification location and the alignment target. If the alignment score is below a threshold, then alignment setup can be performed.