公开(公告)号：US20150369753A1

公开(公告)日：2015-12-24

申请号：US14838194

申请日：2015-08-27

Applicant: KLA-Tencor Corporation

Inventor： Anatoly Romanovsky ,  Ivan Maleev ,  Daniel Kavaldjiev ,  Yury Yuditsky ,  Dirk Woll ,  Stephen Biellak ,  Mehdi Vaez-Iravani ,  Guoheng Zhao

IPC: G01N21/88 ,  G01N21/95

CPC classification number: G01N21/9501 ,  G01N21/47 ,  G01N21/8806 ,  G01N21/8851 ,  G01N21/956

Abstract: Systems configured to inspect a wafer are provided. One system includes an illumination subsystem configured to direct pulses of light to an area on a wafer; a scanning subsystem configured to scan the pulses of light across the wafer; a collection subsystem configured to image pulses of light scattered from the area on the wafer to a sensor, wherein the sensor is configured to integrate a number of the pulses of scattered light that is fewer than a number of the pulses of scattered light that can be imaged on the entire area of the sensor, and wherein the sensor is configured to generate output responsive to the integrated pulses of scattered light; and a computer subsystem configured to detect defects on the wafer using the output generated by the sensor.

Abstract translation: 提供了配置用于检查晶片的系统。 一个系统包括被配置为将光脉冲引导到晶片上的区域的照明子系统; 扫描子系统，被配置为扫描穿过所述晶片的光脉冲; 配置为将从晶片上的区域散射的光脉冲成像到传感器的集合子系统，其中，所述传感器被配置为将少数散射光的脉冲的数量积分成散射光的脉冲数， 在传感器的整个区域成像，并且其中传感器被配置为响应于散射光的积分脉冲产生输出; 以及计算机子系统，被配置为使用由所述传感器产生的输出来检测所述晶片上的缺陷。

公开(公告)号：US10921488B2

公开(公告)日：2021-02-16

申请号：US16005333

申请日：2018-06-11

Applicant: KLA-Tencor Corporation

Inventor： Ivan Maleev ,  Donald Pettibone

IPC: G02B1/02 ,  G01N21/88 ,  G01N21/95 ,  G02B27/28 ,  G02B5/30

Abstract: A polarization control device includes a first wave plate having a first surface profile and a second wave plate having a second surface profile complementary to the first surface profile. The optical axis of the first wave plate is orthogonal to the optical axis of the second wave plate. The first wave plate and the second wave plate are positioned to align the first surface profile with the second surface profile and maintain a constant thickness across the polarization control device. The first wave plate and the second wave plate may control polarization rotation as a continuous function of transverse position across a pupil plane of an optical system. The first wave plate and the second wave plate are separated by a sufficiently small distance so as to limit wave front distortion below a selected level.

公开(公告)号：US09915622B2

公开(公告)日：2018-03-13

申请号：US14838194

申请日：2015-08-27

Applicant: KLA-Tencor Corporation

Inventor： Anatoly Romanovsky ,  Ivan Maleev ,  Daniel Kavaldjiev ,  Yury Yuditsky ,  Dirk Woll ,  Stephen Biellak ,  Mehdi Vaez-Iravani ,  Guoheng Zhao

IPC: G01N21/95 ,  G01N21/47 ,  G01N21/88 ,  G01N21/956

CPC classification number: G01N21/9501 ,  G01N21/47 ,  G01N21/8806 ,  G01N21/8851 ,  G01N21/956

Abstract: Systems configured to inspect a wafer are provided. One system includes an illumination subsystem configured to direct pulses of light to an area on a wafer; a scanning subsystem configured to scan the pulses of light across the wafer; a collection subsystem configured to image pulses of light scattered from the area on the wafer to a sensor, wherein the sensor is configured to integrate a number of the pulses of scattered light that is fewer than a number of the pulses of scattered light that can be imaged on the entire area of the sensor, and wherein the sensor is configured to generate output responsive to the integrated pulses of scattered light; and a computer subsystem configured to detect defects on the wafer using the output generated by the sensor.

公开(公告)号：US09377416B2

公开(公告)日：2016-06-28

申请号：US14709427

申请日：2015-05-11

Applicant: KLA-Tencor Corporation

Inventor： Ivan Maleev ,  Venkata Kode

IPC: G01N21/00 ,  G01N21/95 ,  G01N21/55 ,  G01N21/47

CPC classification number: G01N21/9503 ,  G01N21/47 ,  G01N21/55 ,  G01N2201/025 ,  G01N2201/061

Abstract: Methods and systems for determining wafer inspection coordinates for fixed location(s) on a wafer are provided. One system includes an illumination subsystem configured to direct light to a spot on an edge of a wafer. The spot extends beyond the edge of the wafer. The system also includes a stage that rotates the wafer thereby causing the spot to be scanned over the edge of the wafer. The system also includes a detector configured to detect light from the spot while the spot is being scanned over the edge and to generate output responsive thereto. The system further includes a computer processor configured to determine wafer inspection coordinates of two or more locations on the edge of the wafer based on the output and to determine wafer inspection coordinates of fixed location(s) on the wafer based on the wafer inspection coordinates of the two or more locations on the edge.

Abstract translation: 提供了用于确定晶片上固定位置的晶片检查坐标的方法和系统。 一个系统包括被配置为将光引导到晶片边缘上的点的照明子系统。 斑点延伸超过晶片的边缘。 该系统还包括使晶片旋转的台，从而使光斑在晶片的边缘上扫描。 该系统还包括检测器，其被配置为在斑点被扫描在边缘上时检测来自斑点的光并且响应于此产生输出。 该系统还包括计算机处理器，其被配置为基于输出来确定晶片边缘上的两个或更多个位置的晶片检查坐标，并且基于晶片的晶片检查坐标来确定晶片上固定位置的晶片检查坐标 边缘上的两个或多个位置。

公开(公告)号：US20150330914A1

公开(公告)日：2015-11-19

申请号：US14709427

申请日：2015-05-11

Applicant: KLA-Tencor Corporation

Inventor： Ivan Maleev ,  Venkata Kode

IPC: G01N21/95 ,  G01N21/47 ,  G01N21/55

CPC classification number: G01N21/9503 ,  G01N21/47 ,  G01N21/55 ,  G01N2201/025 ,  G01N2201/061

Abstract: Methods and systems for determining wafer inspection coordinates for fixed location(s) on a wafer are provided. One system includes an illumination subsystem configured to direct light to a spot on an edge of a wafer. The spot extends beyond the edge of the wafer. The system also includes a stage that rotates the wafer thereby causing the spot to be scanned over the edge of the wafer. The system also includes a detector configured to detect light from the spot while the spot is being scanned over the edge and to generate output responsive thereto. The system further includes a computer processor configured to determine wafer inspection coordinates of two or more locations on the edge of the wafer based on the output and to determine wafer inspection coordinates of fixed location(s) on the wafer based on the wafer inspection coordinates of the two or more locations on the edge.

Abstract translation: 提供了用于确定晶片上固定位置的晶片检查坐标的方法和系统。 一个系统包括被配置为将光引导到晶片边缘上的点的照明子系统。 斑点延伸超过晶片的边缘。 该系统还包括使晶片旋转的台，从而使光斑在晶片的边缘上扫描。 该系统还包括检测器，其被配置为在斑点被扫描在边缘上时检测来自斑点的光并且响应于此产生输出。 该系统还包括计算机处理器，其被配置为基于输出来确定晶片边缘上的两个或更多个位置的晶片检查坐标，并且基于晶片的晶片检查坐标来确定晶片上固定位置的晶片检查坐标 边缘上的两个或多个位置。