公开(公告)号：US20180164228A1

公开(公告)日：2018-06-14

申请号：US15882946

申请日：2018-01-29

Applicant: KLA-Tencor Corporation

Inventor： Anatoly Romanovsky ,  Ivan Maleev ,  Daniel Kavaldjiev ,  Yury Yuditsky ,  Dirk Woll ,  Stephen Biellak ,  Mehdi Vaez-Iravani ,  Guoheng Zhao

IPC: G01N21/95 ,  G01N21/47 ,  G01N21/956 ,  G01N21/88

CPC classification number: G01N21/9501 ,  G01N21/47 ,  G01N21/8806 ,  G01N21/8851 ,  G01N21/956

Abstract: Systems configured to inspect a wafer are provided. One system includes an illumination subsystem configured to direct pulses of light to an area on a wafer; a scanning subsystem configured to scan the pulses of light across the wafer; a collection subsystem configured to image pulses of light scattered from the area on the wafer to a sensor, wherein the sensor is configured to integrate a number of the pulses of scattered light that is fewer than a number of the pulses of scattered light that can be imaged on the entire area of the sensor, and wherein the sensor is configured to generate output responsive to the integrated pulses of scattered light; and a computer subsystem configured to detect defects on the wafer using the output generated by the sensor.

公开(公告)号：US20150369753A1

公开(公告)日：2015-12-24

申请号：US14838194

申请日：2015-08-27

Applicant: KLA-Tencor Corporation

Inventor： Anatoly Romanovsky ,  Ivan Maleev ,  Daniel Kavaldjiev ,  Yury Yuditsky ,  Dirk Woll ,  Stephen Biellak ,  Mehdi Vaez-Iravani ,  Guoheng Zhao

IPC: G01N21/88 ,  G01N21/95

CPC classification number: G01N21/9501 ,  G01N21/47 ,  G01N21/8806 ,  G01N21/8851 ,  G01N21/956

Abstract: Systems configured to inspect a wafer are provided. One system includes an illumination subsystem configured to direct pulses of light to an area on a wafer; a scanning subsystem configured to scan the pulses of light across the wafer; a collection subsystem configured to image pulses of light scattered from the area on the wafer to a sensor, wherein the sensor is configured to integrate a number of the pulses of scattered light that is fewer than a number of the pulses of scattered light that can be imaged on the entire area of the sensor, and wherein the sensor is configured to generate output responsive to the integrated pulses of scattered light; and a computer subsystem configured to detect defects on the wafer using the output generated by the sensor.

Abstract translation: 提供了配置用于检查晶片的系统。 一个系统包括被配置为将光脉冲引导到晶片上的区域的照明子系统; 扫描子系统，被配置为扫描穿过所述晶片的光脉冲; 配置为将从晶片上的区域散射的光脉冲成像到传感器的集合子系统，其中，所述传感器被配置为将少数散射光的脉冲的数量积分成散射光的脉冲数， 在传感器的整个区域成像，并且其中传感器被配置为响应于散射光的积分脉冲产生输出; 以及计算机子系统，被配置为使用由所述传感器产生的输出来检测所述晶片上的缺陷。

公开(公告)号：US20140278188A1

公开(公告)日：2014-09-18

申请号：US13826790

申请日：2013-03-14

Applicant: KLA-TENCOR CORPORATION

Inventor： Yury Yuditsky ,  Alexander Slobodov ,  Anatoly Romanovsky

IPC: G01N21/93 ,  G01B21/22

CPC classification number: G01B21/045 ,  G01N21/9501 ,  G03F1/84

Abstract: A wafer is moved under an inspection spot by a rotary inspection system. The system rotates the wafer about an axis of rotation and translates the wafer along a linear trajectory. When the inspection spot is not aligned with the trajectory of the axis of rotation, an angular error is introduced in the representation of the position of the inspection spot with respect to the wafer by the rotary encoder. The angular error is corrected based on an angular error correction value. The angular error correction value is determined based on the distance between the inspection spot and the trajectory of the axis of rotation, the radial distance between the axis of rotation and the inspection spot at a first instance of a particular angular position, and a second radial distance between the axis of rotation and the inspection location at a second instance of the angular position.

Abstract translation: 通过旋转检查系统将晶片在检查点下移动。 系统围绕旋转轴旋转晶片，并沿着线性轨迹平移晶片。 当检查点不与旋转轴线的轨迹对准时，通过旋转编码器在检查点相对于晶片的位置的表示中引入角度误差。 基于角度误差校正值校正角度误差。 角度误差校正值基于检查点与旋转轴线的轨迹之间的距离，旋转轴线与特定角度位置的第一阶段的检查点之间的径向距离和第二径向 在角位置的第二个实例处，旋转轴线与检查位置之间的距离。

公开(公告)号：US20170336329A1

公开(公告)日：2017-11-23

申请号：US15477885

申请日：2017-04-03

Applicant: KLA-Tencor Corporation

Inventor： Frank Li ,  Zhiwei Xu ,  Timothy Swisher ,  Kwan Auyeung ,  Yury Yuditsky

IPC: G01N21/88 ,  G01N21/95

CPC classification number: G01N21/8806 ,  G01N21/9501 ,  G01N21/956 ,  G02B26/108

Abstract: A system includes a beam steering assembly configured to adjust an incident beam to form a corrected beam; a beam monitoring assembly configured to generate monitoring data for the corrected beam including one or more offset parameters of the corrected beam; and a controller configured to store one or more zero parameters of the corrected beam, calculate at least one difference between the one or more zero parameters and the one or more offset parameters of the corrected beam, determine one or more beam position adjustments of the incident beam based on the at least one difference between the one or more zero parameters and the one or more offset parameters of the corrected beam, and direct the beam steering assembly via one or more motor drivers to actuate one or more motors to adjust the incident beam to form the corrected beam.

公开(公告)号：US09915622B2

公开(公告)日：2018-03-13

申请号：US14838194

申请日：2015-08-27

Applicant: KLA-Tencor Corporation

Inventor： Anatoly Romanovsky ,  Ivan Maleev ,  Daniel Kavaldjiev ,  Yury Yuditsky ,  Dirk Woll ,  Stephen Biellak ,  Mehdi Vaez-Iravani ,  Guoheng Zhao

IPC: G01N21/95 ,  G01N21/47 ,  G01N21/88 ,  G01N21/956

CPC classification number: G01N21/9501 ,  G01N21/47 ,  G01N21/8806 ,  G01N21/8851 ,  G01N21/956

Abstract: Systems configured to inspect a wafer are provided. One system includes an illumination subsystem configured to direct pulses of light to an area on a wafer; a scanning subsystem configured to scan the pulses of light across the wafer; a collection subsystem configured to image pulses of light scattered from the area on the wafer to a sensor, wherein the sensor is configured to integrate a number of the pulses of scattered light that is fewer than a number of the pulses of scattered light that can be imaged on the entire area of the sensor, and wherein the sensor is configured to generate output responsive to the integrated pulses of scattered light; and a computer subsystem configured to detect defects on the wafer using the output generated by the sensor.

公开(公告)号：US09587936B2

公开(公告)日：2017-03-07

申请号：US13826790

申请日：2013-03-14

Applicant: KLA-Tencor Corporation

Inventor： Yury Yuditsky ,  Alexander Slobodov ,  Anatoly Romanovsky

IPC: G01B21/04 ,  G01N21/95 ,  G03F1/84

CPC classification number: G01B21/045 ,  G01N21/9501 ,  G03F1/84

Abstract: A wafer is moved under an inspection spot by a rotary inspection system. The system rotates the wafer about an axis of rotation and translates the wafer along a linear trajectory. When the inspection spot is not aligned with the trajectory of the axis of rotation, an angular error is introduced in the representation of the position of the inspection spot with respect to the wafer by the rotary encoder. The angular error is corrected based on an angular error correction value. The angular error correction value is determined based on the distance between the inspection spot and the trajectory of the axis of rotation, the radial distance between the axis of rotation and the inspection spot at a first instance of a particular angular position, and a second radial distance between the axis of rotation and the inspection location at a second instance of the angular position.

Abstract translation: 通过旋转检查系统将晶片在检查点下移动。 系统围绕旋转轴旋转晶片，并沿着线性轨迹平移晶片。 当检查点不与旋转轴线的轨迹对准时，通过旋转编码器在检查点相对于晶片的位置的表示中引入角度误差。 基于角度误差校正值校正角度误差。 角度误差校正值基于检查点与旋转轴线的轨迹之间的距离，旋转轴线与特定角度位置的第一阶段的检查点之间的径向距离和第二径向 在角位置的第二个实例处，旋转轴线与检查位置之间的距离。

公开(公告)号：US09426400B2

公开(公告)日：2016-08-23

申请号：US14096911

申请日：2013-12-04

Applicant: KLA-Tencor Corporation

Inventor： David L. Brown ,  Yung-Ho Chuang ,  Yury Yuditsky

IPC: H04N5/374 ,  H04N5/225 ,  G01N21/956

CPC classification number: H04N5/3742 ,  G01N21/8851 ,  G01N2021/8896 ,  G01N2021/95676 ,  H04N5/2256 ,  H04N5/3743

Abstract: A method of operating an image sensor with a continuously moving object is described. In this method, a timed delay integration mode (TDI-mode) operation can be performed during an extended-time illumination pulse. During this TDI-mode operation, charges stored by pixels of the image sensor are shifted only in a first direction, and track the image motion. Notably, a split-readout operation is performed only during non-illumination. During this split-readout operation, first charges stored by first pixels of the image sensor are shifted in the first direction and second charges stored by second pixels of the image sensor are concurrently shifted in a second direction, the second direction being opposite to the first direction.

Abstract translation: 描述了一种使用连续移动物体操作图像传感器的方法。 在该方法中，可以在扩展时间照明脉冲期间执行定时延迟积分模式（TDI模式）操作。 在该TDI模式操作期间，图像传感器的像素存储的电荷仅在第一方向移动，并且跟踪图像运动。 值得注意的是，仅在非照明期间执行分离读出操作。 在该分离读出操作期间，图像传感器的第一像素存储的第一电荷在第一方向上移动，并且第二方向上的图像传感器的第二像素存储的第二电荷同时移位，第二方向与第一方向相反 方向。

公开(公告)号：US20140158864A1

公开(公告)日：2014-06-12

申请号：US14096911

申请日：2013-12-04

Applicant: KLA-Tencor Corporation

Inventor： David L. Brown ,  Yung-Ho Chuang ,  Yury Yuditsky

IPC: H04N3/14

CPC classification number: H04N5/3742 ,  G01N21/8851 ,  G01N2021/8896 ,  G01N2021/95676 ,  H04N5/2256 ,  H04N5/3743

Abstract: A method of operating an image sensor with a continuously moving object is described. In this method, a timed delay integration mode (TDI-mode) operation can be performed during an extended-time illumination pulse. During this TDI-mode operation, charges stored by pixels of the image sensor are shifted only in a first direction, and track the image motion. Notably, a split-readout operation is performed only during non-illumination. During this split-readout operation, first charges stored by first pixels of the image sensor are shifted in the first direction and second charges stored by second pixels of the image sensor are concurrently shifted in a second direction, the second direction being opposite to the first direction.

Abstract translation: 描述了一种使用连续移动物体操作图像传感器的方法。 在该方法中，可以在扩展时间照明脉冲期间执行定时延迟积分模式（TDI模式）操作。 在该TDI模式操作期间，图像传感器的像素存储的电荷仅在第一方向移动，并且跟踪图像运动。 值得注意的是，仅在非照明期间执行分离读出操作。 在该分离读出操作期间，图像传感器的第一像素存储的第一电荷在第一方向上移动，并且第二方向上的图像传感器的第二像素存储的第二电荷同时移位，第二方向与第一方向相反 方向。