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11.发明授权Interposer based imaging sensor for high-speed image acquisition and inspection systems 有权基于内插器的成像传感器，用于高速图像采集和检测系统公开(公告)号：US09299738B1
公开(公告)日：2016-03-29
申请号：US14299749
申请日：2014-06-09
IPC分类号： G01T1/20 , H01L27/146 , H04N5/335
CPC分类号： H01L27/14636 , G01N21/9501 , H01L27/14618 , H01L27/14634 , H01L27/1464 , H01L27/14806 , H01L2224/16225 , H01L2924/15311 , H01L2924/19105 , H04N5/3355 , H04N5/369 , H05K13/00 , Y10T29/49117
摘要： The present invention includes an interposer disposed on a surface of a substrate, a light sensing array sensor disposed on the interposer, the light sensing array sensor being back-thinned and configured for back illumination, the light sensing array sensor including columns of pixels, one or more amplification circuitry elements configured to amplify an output of the light sensing array sensor, the amplification circuits being operatively connected to the interposer, one or more analog-to-digital conversion circuitry elements configured to convert an output of the light sensing array sensor to a digital signal, the ADC circuitry elements being operatively connected to the interposer, one or more driver circuitry elements configured to drive a clock or control signal of the array sensor, the interposer configured to electrically couple at least two of the light sensing array sensor, the amplification circuits, the conversion circuits, the driver circuits, or one or more additional circuits.
摘要翻译： 本发明包括设置在基板的表面上的插入器，设置在插入件上的光感测阵列传感器，光感测阵列传感器被背面薄化并被配置为用于背光照明，光感测阵列传感器包括像素列，一 或多个放大电路元件，被配置为放大光感测阵列传感器的输出，放大电路可操作地连接到插入器，一个或多个模拟 - 数字转换电路元件，被配置为将光感测阵列传感器的输出转换成 数字信号，所述ADC电路元件可操作地连接到所述插入器，配置成驱动所述阵列传感器的时钟或控制信号的一个或多个驱动器电路元件，所述插入器被配置为电耦合所述光感测阵列传感器中的至少两个， 放大电路，转换电路，驱动器电路或一个或多个附加电路 电话
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12.发明申请公开(公告)号：US20160064184A1
公开(公告)日：2016-03-03
申请号：US14834991
申请日：2015-08-25
发明人： David L. Brown , Yung-Ho Alex Chuang , John Fielden , Marcel Trimpl , Jingjing Zhang , Devis Contarato , Venkatraman Iyer
IPC分类号： H01J37/244 , H01J37/28 , H01J37/20 , H01J37/285
CPC分类号： G01N30/72 , G01T1/24 , G06F19/00 , H01J37/244 , H01J37/28 , H01J49/02 , H01J2237/2441 , H01J2237/2446 , H01J2237/24475 , H01J2237/24495 , H01J2237/24592 , H01L27/1464 , H01L27/14659 , H01L27/14661 , H01L31/00
摘要： A scanning electron microscope incorporates a multi-pixel solid-state electron detector. The multi-pixel solid-state detector may detect back-scattered and/or secondary electrons. The multi-pixel solid-state detector may incorporate analog-to-digital converters and other circuits. The multi-pixel solid state detector may be capable of approximately determining the energy of incident electrons and/or may contain circuits for processing or analyzing the electron signals. The multi-pixel solid state detector is suitable for high-speed operation such as at a speed of about 100 MHz or higher. The scanning electron microscope may be used for reviewing, inspecting or measuring a sample such an unpatterned semiconductor wafer, a patterned semiconductor wafer, a reticle or a photomask. A method of reviewing or inspecting a sample is also described.
摘要翻译： 扫描电子显微镜结合了多像素固态电子检测器。 多像素固体检测器可以检测反向散射和/或二次电子。 多像素固态检测器可以并入模数转换器和其他电路。 多像素固态检测器可以能够近似地确定入射电子的能量和/或可以包含用于处理或分析电子信号的电路。 多像素固态检测器适用于高速操作，例如以大约100MHz或更高的速度。 扫描电子显微镜可以用于检查，检查或测量诸如未图案化的半导体晶片，图案化半导体晶片，掩模版或光掩模的样品。 还描述了检查或检查样品的方法。
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公开(公告)号：US20150200216A1
公开(公告)日：2015-07-16
申请号：US14591325
申请日：2015-01-07
发明人： Masaharu Muramatsu , Hisanori Suzuki , Yasuhito Yoneta , Shinya Otsuka , Jehn-Huar Chem , David L. Brown , Yung-Ho Alex Chuang , John Fielden , Venkatraman Iyer
IPC分类号： H01L27/146
CPC分类号： H01L27/1462 , H01L27/1464 , H01L27/14685 , H01L27/14687
摘要： An image sensor for short-wavelength light includes a semiconductor membrane, circuit elements formed on one surface of the semiconductor membrane, and a pure boron layer on the other surface of the semiconductor membrane. An anti-reflection or protective layer is formed on top of the pure boron layer. This image sensor has high efficiency and good stability even under continuous use at high flux for multiple years. The image sensor may be fabricated using CCD (charge coupled device) or CMOS (complementary metal oxide semiconductor) technology. The image sensor may be a two-dimensional area sensor, or a one-dimensional array sensor.
摘要翻译： 用于短波长光的图像传感器包括半导体膜，形成在半导体膜的一个表面上的电路元件和在半导体膜的另一个表面上的纯硼层。 在纯硼层的顶部形成防反射层或保护层。 该图像传感器具有高效率和良好的稳定性，即使在高通量下连续使用多年。 图像传感器可以使用CCD（电荷耦合器件）或CMOS（互补金属氧化物半导体）技术来制造。 图像传感器可以是二维区域传感器或一维阵列传感器。
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14.发明申请Integrated Multi-Channel Analog Front End And Digitizer For High Speed Imaging Applications 有权用于高速成像应用的集成多通道模拟前端和数字转换器公开(公告)号：US20140240562A1
公开(公告)日：2014-08-28
申请号：US14272454
申请日：2014-05-07
发明人： David L. Brown , Mansour Kermat , Lance Glasser , Henrik Nielsen , Guowu Zheng , Kurt Lehman , Kenneth F. Hatch , Yung-Ho Chuang , Venkatraman Iyer
IPC分类号： H04N5/378
CPC分类号： H04N5/378 , H01L27/14634 , H04N5/3694 , H04N5/37206 , H04N5/37213
摘要： A module for high speed image processing includes an image sensor for generating a plurality of analog outputs representing an image and a plurality of HDDs for concurrently processing the plurality of analog outputs. Each HDD is an integrated circuit configured to process in parallel a predetermined set of the analog outputs. Each channel of the HDD can include an AFE for conditioning a signal representing one sensor analog output, an ADC for converting a conditioned signal into a digital signal, and a data formatting block for calibrations and formatting the digital signal for transport to an off-chip device. The HDDs and drive electronics are combined with the image sensor into one package to optimize signal integrity and high dynamic range, and to achieve high data rates through use of synchronized HDD channels. Combining multiple modules results in a highly scalable imaging subsystem optimized for inspection and metrology applications.
摘要翻译： 用于高速图像处理的模块包括用于产生表示图像的多个模拟输出的图像传感器和用于同时处理多个模拟输出的多个HDD。 每个HDD是被配置为并行处理预定的一组模拟输出的集成电路。 HDD的每个通道可以包括用于调节表示一个传感器模拟输出的信号的AFE，用于将经调节的信号转换成数字信号的ADC，以及用于校准和格式化数字信号以传送到芯片外的数据格式化块 设备。 HDD和驱动电子设备与图像传感器组合成一个封装，以优化信号完整性和高动态范围，并通过使用同步的HDD通道实现高数据速率。 组合多个模块可实现高度可扩展的成像子系统，以优化检测和计量应用。
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15.发明申请INTERPOSER BASED IMAGING SENSOR FOR HIGH-SPEED IMAGE ACQUISITION AND INSPECTION SYSTEMS 有权用于高速图像采集和检测系统的基于插座的成像传感器公开(公告)号：US20130176552A1
公开(公告)日：2013-07-11
申请号：US13622155
申请日：2012-09-18
发明人： David L. Brown , Guowu Zheng , Yung-Ho Chuang , Venkatraman Iyer
CPC分类号： H01L27/14636 , G01N21/9501 , H01L27/14618 , H01L27/14634 , H01L27/1464 , H01L27/14806 , H01L2224/16225 , H01L2924/15311 , H01L2924/19105 , H04N5/3355 , H04N5/369 , H05K13/00 , Y10T29/49117
摘要： The present invention includes an interposer disposed on a surface of a substrate, a light sensing array sensor disposed on the interposer, the light sensing array sensor being back-thinned and configured for back illumination, the light sensing array sensor including columns of pixels, one or more amplification circuitry elements configured to amplify an output of the light sensing array sensor, the amplification circuits being operatively connected to the interposer, one or more analog-to-digital conversion circuitry elements configured to convert an output of the light sensing array sensor to a digital signal, the ADC circuitry elements being operatively connected to the interposer, one or more driver circuitry elements configured to drive a clock or control signal of the array sensor, the interposer configured to electrically couple at least two of the light sensing array sensor, the amplification circuits, the conversion circuits, the driver circuits, or one or more additional circuits.
摘要翻译： 本发明包括设置在基板的表面上的插入器，设置在插入件上的光感测阵列传感器，光感测阵列传感器被背面薄化并被配置为用于背光照明，光感测阵列传感器包括像素列，一 或多个放大电路元件，被配置为放大光感测阵列传感器的输出，放大电路可操作地连接到插入器，一个或多个模拟 - 数字转换电路元件，被配置为将光感测阵列传感器的输出转换成 数字信号，所述ADC电路元件可操作地连接到所述插入器，配置成驱动所述阵列传感器的时钟或控制信号的一个或多个驱动器电路元件，所述插入器被配置为电耦合所述光感测阵列传感器中的至少两个， 放大电路，转换电路，驱动器电路或一个或多个附加电路 电话
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