公开(公告)号：US20180022789A1

公开(公告)日：2018-01-25

申请号：US15650142

申请日：2017-07-14

Applicant: Yasuhiko TABATA ,  Konica Minolta, Inc.

Inventor： Natsumi HIRAYAMA ,  Chie INUI ,  Akihiro MAEZAWA ,  Yasuhiko TABATA

IPC: C07K14/78 ,  A61K9/48 ,  A61K9/00

CPC classification number: C07K14/78 ,  A61K9/0053 ,  A61K9/0056 ,  A61K9/48 ,  A61K9/4808 ,  A61K9/5068 ,  A61K38/00 ,  C07K1/00 ,  C07K14/00

Abstract: Gelatin particles include: gelatin that serves as a main component; and an auxiliary component carried on the gelatin, the gelatin particles being configured such that where the particle size of the gelatin particles is X, the ratio A/B of the average concentration A (mass %) of the auxiliary component contained in a surface part having a thickness of 0.01X from the surface of the gelatin particles based on the total mass of the gelatin particles to the average concentration B (mass %) of the auxiliary component contained in an inner part of the particles deeper than the surface part based on the total mass of the gelatin particles is less than 0.25.

公开(公告)号：US20200338218A1

公开(公告)日：2020-10-29

申请号：US16761138

申请日：2018-11-05

Applicant: Yasuhiko TABATA ,  Konica Minolta, Inc.

Inventor： Makoto MOCHIZUKI ,  Chie INUI ,  Natsumi HIRAYAMA ,  Akihiro MAEZAWA ,  Yasuhiko TABATA

IPC: A61K49/18 ,  A61B5/055 ,  A61L27/52 ,  A61K47/02 ,  A61K47/42 ,  A61K9/14 ,  C08L101/14 ,  C08J3/075

Abstract: The present invention addresses the problem of providing: a hydrogel particle which can be taken into a cell by the action of the cell and can control the release of a magnetic particle enclosed therein into the cell so as to retain the magnetic particle in the cell for a long period; a method for producing the hydrogel particle; a cell or a cell structure each enclosing the hydrogel particle therein; and a method for evaluating the activity of a cell using the hydrogel particle. The present invention solves the problem by a hydrogel particle including: a domain which is composed of a first hydrogel; a matrix which encloses the domain and is composed of a second hydrogel having a different crosslinking degree or composition from that of the first hydrogel; and a magnetic particle which is supported by at least the first hydrogel.

公开(公告)号：US20180339399A1

公开(公告)日：2018-11-29

申请号：US15775128

申请日：2016-12-01

Applicant: Konica Minolta, Inc.

Inventor： Chie INUI ,  Akihiro MAEZAWA ,  Yuuki NAGAI ,  Natsumi HIRAYAMA

IPC: B24B57/02

Abstract: An object of the present invention is to provide an abrasive slurry regeneration method capable of efficiently regenerating an abrasive slurry having a high polishing rate. The abrasive slurry regeneration method is an abrasive slurry regeneration method for polishing a polishing target containing silicon oxide as a main component using an abrasive slurry containing abrasive particles and a plurality of kinds of additives and then regenerating a collected abrasive slurry, characterized by including a regeneration step of collecting an additive having a molecular weight of 500 or more and an additive adsorbed by the abrasive particles among additives contained in the collected abrasive slurry together with the abrasive particles while an abrasive concentration (% by mass) is maintained within a range of 0.2 to 3000% with respect to an abrasive concentration (% by mass) of an unused abrasive slurry when being used for polishing a polishing target.

公开(公告)号：US20160194538A1

公开(公告)日：2016-07-07

申请号：US14910986

申请日：2014-07-28

Applicant: KONICA MINOLTA, INC.

Inventor： Keisuke MIZOGUCHI ,  Akihiro MAEZAWA ,  Natsuki ITO ,  Atsushi TAKAHASHI ,  Hideaki WAKAMATSU ,  Yuuki NAGAI ,  Chie INUI

IPC: C09K3/14 ,  B24C11/00 ,  C09G1/02

CPC classification number: C09K3/1409 ,  B24C11/00 ,  C01F17/0043 ,  C01P2004/03 ,  C01P2004/32 ,  C01P2004/52 ,  C01P2004/54 ,  C01P2004/61 ,  C01P2004/62 ,  C01P2004/64 ,  C09G1/02 ,  C09K3/1463

Abstract: Disclosed are polishing material particles which have polishing performance suitable for precision polishing and also have a high polishing speed and high monodispersibility; a polishing material containing the polishing material particles; and a polishing processing method using the polishing material. The polishing material particles are spherical particles having an average aspect ratio of 1.00 to 1.15, wherein the particle diameter (D50 (nm)) of the polishing material particles as determined from a particle diameter cumulative distribution curve falls within the range from 50 to 1500 nm. The average content of cerium or the total content of cerium and at least one element selected from lanthanum (La), praseodymium (Pr), neodymium (Nd), samarium (Sm) and europium (Eu) in the polishing material particles is 81 mol % or more relative to the total content of all of rare earth elements that constitute the polishing material particles.

Abstract translation: 公开了具有适合于精密抛光的抛光性能并且还具有高抛光速度和高单分散性的抛光材料颗粒; 包含抛光材料颗粒的抛光材料; 以及使用研磨材料的研磨处理方法。 抛光材料颗粒是平均纵横比为1.00至1.15的球形颗粒，其中由粒径累积分布曲线确定的抛光材料颗粒的粒径（D50（nm））落在50至1500nm的范围内 。 在研磨材料颗粒中，铈的平均含量或铈和至少一种选自镧（La），镨（Pr），钕（Nd），钐（Sm）和铕（Eu）的元素的含量为81mol 相对于构成抛光材料颗粒的所有稀土元素的总含量为％以上。