Polishing Material, Polishing Material Slurry
    1.
    发明申请
    Polishing Material, Polishing Material Slurry 审中-公开
    抛光材料,抛光材料浆料

    公开(公告)号:US20160194539A1

    公开(公告)日:2016-07-07

    申请号:US14911224

    申请日:2014-07-25

    CPC classification number: C09K3/1409 C09G1/02 C09K3/1463

    Abstract: A polishing material comprising a polishing material particle including cerium, wherein, the polishing material particle is a secondary particle obtained by baking a primary particle which is a polishing material precursor particle; the primary particle is a sphere shape; an average particle size of the primary particle is within a range of 100 to 1000 nm; and an average particle size of the secondary particle is within a range of 300 to 10000 nm.

    Abstract translation: 1.一种研磨材料,其特征在于,具备包括铈的研磨材料粒子,其中,所述研磨材料粒子是通过焙烧作为研磨材料前体粒子的一次粒子得到的二次粒子, 初级粒子是球形; 初级粒子的平均粒径在100〜1000nm的范围内; 二次粒子的平均粒径在300〜10000nm的范围内。

    Core/Shell-Type Inorganic Particles
    2.
    发明申请
    Core/Shell-Type Inorganic Particles 审中-公开
    核/壳型无机颗粒

    公开(公告)号:US20150353795A1

    公开(公告)日:2015-12-10

    申请号:US14763070

    申请日:2014-01-22

    Abstract: An object of the present invention is to provide an inorganic core/shell particle to be contained in an abrasive material that contains a reduced amount of cerium, can polish harder workpieces at a high polishing rate, and can decrease the surface roughness of the workpieces. The inorganic core/shell particle P of the present invention is to be contained in an abrasive material and includes a core (1) containing a salt of at least one element selected from yttrium (Y), titanium (Ti), strontium (Sr), barium (Ba), samarium (Sm), europium (Eu), gadolinium (Gd), and terbium (Tb) and a shell (2) containing a salt of at least one element selected from these eight elements and a salt of cerium (Ce), wherein the crystallites in the shell (2) have an average diameter within a range of 4 to 30 nm.

    Abstract translation: 本发明的目的在于提供一种含有少量铈的研磨材料的无机核/壳粒子,能够以高抛光速度对较硬的工件进行抛光,能够降低工件的表面粗糙度。 本发明的无机核/壳粒子P包含在研磨材料中,并且包括含有选自钇(Y),钛(Ti),锶(Sr) ,钡(Ba),钐(Sm),铕(Eu),钆(Gd)和铽(Tb)和含有选自这八元素中的至少一种元素的盐的壳(2) (Ce),其中壳(2)中的微晶的平均直径在4〜30nm的范围内。

    Method For Preparing Recycled Abrasive Slurry
    8.
    发明申请
    Method For Preparing Recycled Abrasive Slurry 审中-公开
    制备循环磨料浆料的方法

    公开(公告)号:US20160376468A1

    公开(公告)日:2016-12-29

    申请号:US15189833

    申请日:2016-06-22

    CPC classification number: C09G1/02 B24B57/02 Y02P70/605

    Abstract: A method for preparing a recycled abrasive slurry includes: polishing a material to be polished, which includes silicon as a main component, with an abrasive slurry including a plurality of kinds of additives added for different purposes; and preparing a recycled abrasive slurry from a collected abrasive slurry collected after the polishing, wherein the recycled abrasive slurry is prepared through: step 1 of removing, from the collected abrasive slurry, at least an additive B capable of decreasing a polishing rate among the plurality of additives, and step 2 of replenishing at least an additive A capable of increasing a polishing rate among the plurality of additives, to the abrasive slurry from which an additive has been removed, which has been prepared in step 1.

    Abstract translation: 一种制备再循环磨料浆料的方法包括:用包含硅作为主要成分的抛光材料,研磨含有多种添加剂的磨料浆料,用于不同目的; 以及从抛光后收集的收集的磨料浆料制备回收的磨料浆料,其中通过以下步骤制备回收的磨料浆料:步骤1,从收集的磨料浆料中除去至少一种能够降低多个磨料浆料中的抛光速率的添加剂B 的添加剂,以及步骤2,其至少补充了能够将多种添加剂中的抛光速率提高到在步骤1中制备的已除去添加剂的研磨浆料的添加剂A.

    RECOVERY METHOD FOR ABRASIVE
    10.
    发明申请

    公开(公告)号:US20180056483A1

    公开(公告)日:2018-03-01

    申请号:US15556910

    申请日:2016-03-09

    CPC classification number: B24B57/00 B24B37/02 B24B37/24 B24B37/34 B24B57/02

    Abstract: A method for collecting an abrasive from an abrasive slurry which has been used for polishing an object including silicon as a main component includes: (i) adding a solvent to the abrasive slurry; (ii) dissolving particles of the polished object among components of the polished object contained in the abrasive slurry; and (iii) filtering the abrasive slurry to collect the abrasive, in which the steps (i) to (iii) are carried out without a pH adjuster to remove components of the polished object to collect the abrasive.

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