ABRASIVE SLURRY REGENERATION METHOD
    4.
    发明申请

    公开(公告)号:US20180339399A1

    公开(公告)日:2018-11-29

    申请号:US15775128

    申请日:2016-12-01

    Abstract: An object of the present invention is to provide an abrasive slurry regeneration method capable of efficiently regenerating an abrasive slurry having a high polishing rate. The abrasive slurry regeneration method is an abrasive slurry regeneration method for polishing a polishing target containing silicon oxide as a main component using an abrasive slurry containing abrasive particles and a plurality of kinds of additives and then regenerating a collected abrasive slurry, characterized by including a regeneration step of collecting an additive having a molecular weight of 500 or more and an additive adsorbed by the abrasive particles among additives contained in the collected abrasive slurry together with the abrasive particles while an abrasive concentration (% by mass) is maintained within a range of 0.2 to 3000% with respect to an abrasive concentration (% by mass) of an unused abrasive slurry when being used for polishing a polishing target.

    Polishing Material Particles, Method For Producing Polishing Material, And Polishing Processing Method
    5.
    发明申请
    Polishing Material Particles, Method For Producing Polishing Material, And Polishing Processing Method 有权
    抛光材料颗粒,抛光材料的制造方法和抛光加工方法

    公开(公告)号:US20160194538A1

    公开(公告)日:2016-07-07

    申请号:US14910986

    申请日:2014-07-28

    Abstract: Disclosed are polishing material particles which have polishing performance suitable for precision polishing and also have a high polishing speed and high monodispersibility; a polishing material containing the polishing material particles; and a polishing processing method using the polishing material. The polishing material particles are spherical particles having an average aspect ratio of 1.00 to 1.15, wherein the particle diameter (D50 (nm)) of the polishing material particles as determined from a particle diameter cumulative distribution curve falls within the range from 50 to 1500 nm. The average content of cerium or the total content of cerium and at least one element selected from lanthanum (La), praseodymium (Pr), neodymium (Nd), samarium (Sm) and europium (Eu) in the polishing material particles is 81 mol % or more relative to the total content of all of rare earth elements that constitute the polishing material particles.

    Abstract translation: 公开了具有适合于精密抛光的抛光性能并且还具有高抛光速度和高单分散性的抛光材料颗粒; 包含抛光材料颗粒的抛光材料; 以及使用研磨材料的研磨处理方法。 抛光材料颗粒是平均纵横比为1.00至1.15的球形颗粒,其中由粒径累积分布曲线确定的抛光材料颗粒的粒径(D50(nm))落在50至1500nm的范围内 。 在研磨材料颗粒中,铈的平均含量或铈和至少一种选自镧(La),镨(Pr),钕(Nd),钐(Sm)和铕(Eu)的元素的含量为81mol 相对于构成抛光材料颗粒的所有稀土元素的总含量为%以上。

    PREPARATION METHOD OF RECYCLED POLISHING AGENT SLURRY AND POLISHING AGENT SLURRY

    公开(公告)号:US20220356372A1

    公开(公告)日:2022-11-10

    申请号:US17658574

    申请日:2022-04-08

    Abstract: A recycled polishing agent slurry is prepared from a used polishing agent slurry after polishing a silicon material using a reference polishing agent slurry including a cerium oxide polishing agent and a dispersing agent. The preparation method includes: slurry collecting in which the used slurry discharged from a polishing machine is collected; separation and concentration in which the cerium oxide polishing agent in the collected slurry is separated from a component derived from the material to be polished and then concentrated, and polishing agent recycling in which a pH adjusting agent and the dispersing agent are added to the separated and concentrated cerium oxide polishing agent, and a recycled polishing agent slurry is adjusted to have a pH value at 25° C. of in a range of 6.0 to 10.5 and an electrical conductivity value in a range of 0.10 to 10.00 times that of the reference slurry.

    Polishing Material, Polishing Material Slurry
    7.
    发明申请
    Polishing Material, Polishing Material Slurry 审中-公开
    抛光材料,抛光材料浆料

    公开(公告)号:US20160194539A1

    公开(公告)日:2016-07-07

    申请号:US14911224

    申请日:2014-07-25

    CPC classification number: C09K3/1409 C09G1/02 C09K3/1463

    Abstract: A polishing material comprising a polishing material particle including cerium, wherein, the polishing material particle is a secondary particle obtained by baking a primary particle which is a polishing material precursor particle; the primary particle is a sphere shape; an average particle size of the primary particle is within a range of 100 to 1000 nm; and an average particle size of the secondary particle is within a range of 300 to 10000 nm.

    Abstract translation: 1.一种研磨材料,其特征在于,具备包括铈的研磨材料粒子,其中,所述研磨材料粒子是通过焙烧作为研磨材料前体粒子的一次粒子得到的二次粒子, 初级粒子是球形; 初级粒子的平均粒径在100〜1000nm的范围内; 二次粒子的平均粒径在300〜10000nm的范围内。

    Core/Shell-Type Inorganic Particles
    8.
    发明申请
    Core/Shell-Type Inorganic Particles 审中-公开
    核/壳型无机颗粒

    公开(公告)号:US20150353795A1

    公开(公告)日:2015-12-10

    申请号:US14763070

    申请日:2014-01-22

    Abstract: An object of the present invention is to provide an inorganic core/shell particle to be contained in an abrasive material that contains a reduced amount of cerium, can polish harder workpieces at a high polishing rate, and can decrease the surface roughness of the workpieces. The inorganic core/shell particle P of the present invention is to be contained in an abrasive material and includes a core (1) containing a salt of at least one element selected from yttrium (Y), titanium (Ti), strontium (Sr), barium (Ba), samarium (Sm), europium (Eu), gadolinium (Gd), and terbium (Tb) and a shell (2) containing a salt of at least one element selected from these eight elements and a salt of cerium (Ce), wherein the crystallites in the shell (2) have an average diameter within a range of 4 to 30 nm.

    Abstract translation: 本发明的目的在于提供一种含有少量铈的研磨材料的无机核/壳粒子,能够以高抛光速度对较硬的工件进行抛光,能够降低工件的表面粗糙度。 本发明的无机核/壳粒子P包含在研磨材料中,并且包括含有选自钇(Y),钛(Ti),锶(Sr) ,钡(Ba),钐(Sm),铕(Eu),钆(Gd)和铽(Tb)和含有选自这八元素中的至少一种元素的盐的壳(2) (Ce),其中壳(2)中的微晶的平均直径在4〜30nm的范围内。

    Abrasive Regeneration Method
    9.
    发明申请
    Abrasive Regeneration Method 有权
    磨料再生方法

    公开(公告)号:US20150306788A1

    公开(公告)日:2015-10-29

    申请号:US14379060

    申请日:2013-02-14

    Abstract: Technique to provide an abrasive regeneration method which, from a used abrasive, can recover an abrasive by an efficient method and can thereafter obtain a high-purity regenerated abrasive by a simple method. This abrasive regeneration method uses an abrasive comprising at least one type of abrasive selected from diamond, boron nitride, silicon carbide, alumina, alumina zirconia, zirconium oxide and cerium oxide. The abrasive regeneration involves a slurry recovery step (A) for recovering an abrasive slurry discharged from a polishing machine, a separation and concentration step (B) for adding an alkaline earth metal salt as an inorganic salt to the recovered abrasive slurry to aggregate the abrasive, and separating and concentrating the abrasive from a mother liquor, an abrasive recovery step (C) for recovering the separated and concentrated abrasive, and a second concentration step (D) for filter-treating the concentrated abrasive.

    Abstract translation: 提供一种研磨再生方法,其从使用的研磨剂中可以通过有效的方法回收磨料,然后可以通过简单的方法获得高纯度再生磨料。 该磨料再生方法使用包含选自金刚石,氮化硼,碳化硅,氧化铝,氧化铝氧化锆,氧化锆和氧化铈中的至少一种类型的磨料的磨料。 研磨再生包括用于回收从抛光机排出的磨料浆料的浆料回收步骤(A),用于将回收的磨料浆料中的碱土金属盐作为无机盐添加到分离和浓缩步骤(B)中以将磨料 ,以及从母液中分离和浓缩研磨剂,用于回收分离和浓缩研磨剂的研磨回收步骤(C)和用于过滤处理浓缩磨料的第二浓缩步骤(D)。

    POLISHING SYSTEM
    10.
    发明公开
    POLISHING SYSTEM 审中-公开

    公开(公告)号:US20230191554A1

    公开(公告)日:2023-06-22

    申请号:US17921391

    申请日:2021-04-12

    CPC classification number: B24B37/013

    Abstract: A polishing system performs chemical-mechanical polishing of an object to be polished using an abrasive slurry. The polishing system includes a polishing amount calculator that measures an amount of free metal ions of a metallic element derived from the object to be polished in a processed slurry and calculates a polishing amount of the object to be polished from the amount of the free metal ions. The object to be polished is a glass containing the metallic element of Group 1 or Group 2 of a periodic table.

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