公开(公告)号：US20070138616A1

公开(公告)日：2007-06-21

申请号：US11703702

申请日：2007-02-08

申请人： Tetsuya Fujisawa ,  Kaname Ozawa ,  Mitsutaka Sato

发明人： Tetsuya Fujisawa ,  Kaname Ozawa ,  Mitsutaka Sato

IPC分类号： H01L23/48

CPC分类号： H01L23/49827 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/50 ,  H01L23/5384 ,  H01L23/5386 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L24/85 ,  H01L24/91 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/18 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/06135 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2224/85 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/15162 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19104 ,  H01L2924/30105 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device, includes a supporting board; and a semiconductor element mounted on a first main surface of the supporting board. The supporting board includes a first electrode formed on the first main surface, a second electrode formed on a second main surface, and an opening or notch forming part. A first electrode pad of the semiconductor element faces and is connected to the first electrode of the supporting board. A second electrode pad of the semiconductor element and the second electrode of the supporting board are electrically connected via the opening or notch forming part.

摘要翻译： 一种半导体器件，包括支撑板; 以及安装在所述支撑板的第一主表面上的半导体元件。 支撑板包括形成在第一主表面上的第一电极，形成在第二主表面上的第二电极和开口或凹口形成部分。 半导体元件的第一电极焊盘面对并连接到支撑板的第一电极。 半导体元件的第二电极焊盘和支撑板的第二电极经由开口或凹口形成部分电连接。