公开(公告)号：US20080233711A1

公开(公告)日：2008-09-25

申请号：US12038280

申请日：2008-02-27

申请人： Kazuma Sekiya

发明人： Kazuma Sekiya

IPC分类号： H01L21/78

CPC分类号： H01L21/78 ,  B23K26/0622 ,  B23K26/364 ,  B23K26/40 ,  B23K2103/172 ,  B23K2103/42 ,  B23K2103/50 ,  H01L21/6835 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/3512

摘要： A manufacturing method for devices including a wafer supporting step of mounting an adhesive film to the lower surface of a wafer and attaching the wafer through the adhesive film to the upper surface of a dicing tape mounted on an annular frame, a laser processing step of applying a pulsed laser beam having an absorption wavelength to the wafer along separation lines formed on the upper surface of the wafer after mounting the adhesive film to the dicing tape, thereby separating the wafer into the individual devices and cutting the adhesive film, and a pickup step of expanding the dicing tape after performing the laser processing step to thereby increase the spacing between any adjacent ones of the individual devices, and peeling off to pick up each of the individual devices from the dicing tape in the condition where the adhesive film is mounted on the lower surface of each device.

摘要翻译： 一种装置的制造方法，其特征在于，包括将粘接膜安装在晶片的下表面并将所述晶片通过所述粘合膜附着到安装在环形框架上的切割带的上表面的晶片支撑工序;激光加工工序， 一种脉冲激光束，其在将粘合剂膜安装到切割带上之后，沿着形成在晶片的上表面上的分离线具有到晶片的吸收波长，从而将晶片分离成各个器件并切割粘合剂膜，以及拾取步骤 在执行激光加工步骤之后扩大切割带，从而增加各个相邻装置之间的间隔，并且在安装粘合剂膜的状态下剥离剥离每个单独装置与切割胶带 每个设备的下表面。

公开(公告)号：US07316174B2

公开(公告)日：2008-01-08

申请号：US11012110

申请日：2004-12-16

申请人： Kazuma Sekiya

发明人： Kazuma Sekiya

IPC分类号： B26D1/143 ,  B26D5/02 ,  B26D7/06 ,  H01L21/78 ,  H01L21/304

CPC分类号： B28D5/024 ,  B28D5/029 ,  Y10T83/02 ,  Y10T83/0304 ,  Y10T83/6476

摘要： When a plate-shaped material, such as a CSP substrate, that does not require exact precision is divided, a cutting machine is provided with not only first and second chuck tables, but also first and second cutting units. Then, each plate-shaped material, which is placed on a respective chuck table, is aligned immediately before it is cut, so that the Y-axis index control and the X-axis cutting movement control are established for cutting by the cutting units. A cutting portion is cut in the first direction by the first cutting unit according to the Y-axis index control and the X-axis cutting movement control, and subsequently a cutting portion is cut in the second direction by the second cutting unit. Hence, the cutting portions of the plate-shaped materials placed on the first and second chuck tables are cut by the first and second cutting units by sharing a role.

摘要翻译： 当不需要精确精度的诸如CSP基板的板状材料被分割时，切割机不仅设置有第一和第二卡盘台，而且还设置有第一和第二切割单元。 然后，放置在相应的卡盘台上的每个板状材料在切割之前立即对准，从而建立Y轴索引控制和X轴切割移动控制以切割单元进行切割。 根据Y轴指标控制和X轴切割移动控制，通过第一切割单元沿第一方向切割切割部分，随后通过第二切割单元沿第二方向切割切割部分。 因此，通过共同的作用，通过第一和第二切割单元切割放置在第一和第二卡盘台上的板状材料的切割部分。

公开(公告)号：US20060255431A1

公开(公告)日：2006-11-16

申请号：US11413149

申请日：2006-04-28

申请人： Kazuma Sekiya

发明人： Kazuma Sekiya

IPC分类号： H01L23/544

CPC分类号： H01L23/57 ,  H01L22/34 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor wafer comprising a plurality of devices which are formed in a plurality of areas sectioned by streets formed in a lattice pattern on the front surface of a semiconductor substrate, and having test metal patterns formed on the streets, wherein the test metal patterns are formed on one side of the center of each street and connected to a device formed on the other side of the street by a conducting wire laid across the center of the street.

摘要翻译： 一种半导体晶片，包括多个器件，其形成在由半导体衬底的前表面上形成为格子图案的街道划分的多个区域中，并且形成在街道上的测试金属图案，其中形成测试金属图案 在每条街的中心的一侧，并通过横穿街道中心的导线连接到街道另一侧形成的装置。

公开(公告)号：US07057136B2

公开(公告)日：2006-06-06

申请号：US10483122

申请日：2003-04-28

申请人： Kazuma Sekiya

发明人： Kazuma Sekiya

IPC分类号： B23K26/00

CPC分类号： B23Q11/0046 ,  B08B15/04 ,  B23K26/0853 ,  B23K26/123 ,  B23K26/14 ,  B23K26/142 ,  B23K26/1476 ,  B23K26/38 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/50

摘要： A machining device comprises workpiece holding means for holding a workpiece, laser beam machining means for shining a laser beam to the workpiece held by the workpiece holding means to machine the workpiece, and moving means for moving the workpiece held by the workpiece holding means, and a laser beam shone to the workpiece relative to each other. Suction means is disposed for sucking from a machining region where the laser beam is shone to the workpiece. The suction means includes a central hood, a central suction source for sucking through the central hood, an outer hood, and an outer suction source for sucking through the outer hood, and the suction force of the central suction source is greater than the suction force of the outer suction source.

摘要翻译： 加工装置包括用于保持工件的工件保持装置，用于将激光束照射到由工件保持装置保持的工件以加工工件的激光束加工装置，以及用于移动由工件保持装置保持的工件的移动装置，以及 激光束相对于彼此照射到工件。 抽吸装置用于从激光束照射到加工区域的加工区域进行吸取。 抽吸装置包括中央罩，用于吸入中心罩的中央抽吸源，外罩，以及用于通过外罩抽吸的外吸入源，并且中央抽吸源的抽吸力大于吸力 的外吸源。

公开(公告)号：US06998571B2

公开(公告)日：2006-02-14

申请号：US10827284

申请日：2004-04-20

申请人： Kazuma Sekiya ,  Toshiyuki Yoshikawa

发明人： Kazuma Sekiya ,  Toshiyuki Yoshikawa

IPC分类号： B23K26/00

CPC分类号： B23K26/0884 ,  B23K26/0853 ,  B23K26/18 ,  B23K26/40 ,  B23K26/702 ,  B23K37/047 ,  B23K2101/40 ,  B23K2103/50 ,  B28D1/221 ,  B28D5/0058 ,  H01L21/78

摘要： A laser beam processing machine comprising a chuck table for holding a workpiece and a laser beam application means for applying a laser beam to the workpiece held on the chuck table, wherein the machine further comprises a protective film forming means for forming a protective film on the to-be-processed surface of the workpiece before laser beam processing.

摘要翻译： 一种激光束处理机，包括用于保持工件的卡盘台和用于将激光束施加到保持在卡盘台上的工件的激光束施加装置，其中该机器还包括用于在保持膜上形成保护膜的保护膜形成装置 在激光束处理之前工件的待处理表面。

公开(公告)号：US06944370B2

公开(公告)日：2005-09-13

申请号：US10471401

申请日：2003-01-16

申请人： Kazuma Sekiya

发明人： Kazuma Sekiya

IPC分类号： B24B1/00 ,  B24B7/22 ,  B28D5/02 ,  H01L21/00 ,  H01L21/301 ,  H01L21/304 ,  G02B6/42

CPC分类号： H01L21/67092 ,  B24B1/00 ,  B24B7/228 ,  B28D5/024

摘要： A method of processing a semiconductor wafer that has circuits in each of a plurality of regions sectioned by a plurality of streets on the front surface and has a coating layer formed on the front surface having the circuits to a predetermined thickness, the method comprising a stress-reducing step of reducing the stress of the coating layer by forming a plurality of grooves in the coating layer formed on the front surface of the semiconductor wafer; and a grinding step of processing the back surface of the semiconductor wafer by grinding to a predetermined thickness after the stress-reducing step.

摘要翻译： 一种处理半导体晶片的方法，所述半导体晶片在前表面上由多个街道划分的多个区域中的每一个中具有电路，并且具有形成在具有预定厚度的电路的前表面上的涂层，所述方法包括应力 - 通过在形成在半导体晶片的前表面上的涂层中形成多个凹槽来减小涂层的应力的还原步骤; 以及研磨步骤，在减压步骤之后通过研磨至预定厚度来处理半导体晶片的背面。

公开(公告)号：US06726526B2

公开(公告)日：2004-04-27

申请号：US10145893

申请日：2002-05-16

申请人： Kazuma Sekiya ,  Naoki Ohmiya

发明人： Kazuma Sekiya ,  Naoki Ohmiya

IPC分类号： B24B4900

CPC分类号： H01L21/67092 ,  B28D5/0082 ,  B28D5/029

摘要： A cutting machine includes two cutting means. In a front half of a housing, a chucking zone is located in a widthwise center. A cassette placing zone is located on one side of the chucking zone, and a cleaning zone is located on the other side of the chucking zone. In a latter half of the housing, a cutting zone is disposed in a widthwise center. Rotating shafts of the two cutting means extend straightly in a width direction in the rear half of the housing.

摘要翻译： 切割机包括两个切割装置。 在壳体的前半部分中，夹紧区域位于宽度方向的中心。 盒放置区位于夹紧区的一侧，清洁区位于夹紧区的另一侧。 在壳体的后半部分中，切割区域设置在宽度方向的中心。 两个切割装置的旋转轴在壳体的后半部中沿宽度方向直线延伸。

公开(公告)号：US06341740B2

公开(公告)日：2002-01-29

申请号：US09496964

申请日：2000-02-03

申请人： Kazuma Sekiya ,  Takayuki Mahashi ,  Shinichi Namioka ,  Takeo Hidaka ,  Masahiro Yoshii

发明人： Kazuma Sekiya ,  Takayuki Mahashi ,  Shinichi Namioka ,  Takeo Hidaka ,  Masahiro Yoshii

IPC分类号： B02C1918

CPC分类号： H01L21/67144 ,  B28D5/0082 ,  B28D5/0094 ,  H01L21/67092 ,  Y10T83/6494

摘要： Disclosed is an improved cutting-and-transferring system for cutting and separating a workpiece into pellets. The workpiece is held by a holder member. The system comprises: a holding table for holding a workpiece to be cut; a cutting unit including at least cutting means for cutting the workpiece on the holding table into pellets; a transferring unit including at least transferring means for picking up the pellets from the holder member and for transferring to a selected carrier tray; and a shuttle transfer unit for transferring a selected cut workpiece from the cutting unit to the transferring unit. All these parts work automatically in unison, thus reducing the length of time involved for cutting workpieces into pellets and for loading carrier trays with pellets to possible minimum.

摘要翻译： 公开了一种用于将工件切割和分离成颗粒的改进的切割和传送系统。 工件由保持器构件保持。 该系统包括：用于保持要切割的工件的保持台; 切割单元，至少包括用于将保持台上的工件切割成颗粒的切割装置; 转印单元，至少包括用于从保持器构件拾取颗粒并用于转移到选定的载体托盘的转印装置; 以及用于将选择的切割工件从切割单元传送到转印单元的梭转移单元。 所有这些部件一致地自动工作，从而减少将工件切割成颗粒所需的时间长度，以及将带有颗粒的载体托盘装载到可能的最小值。

公开(公告)号：US08417579B2

公开(公告)日：2013-04-09

申请号：US13192929

申请日：2011-07-28

申请人： Kazuma Sekiya

发明人： Kazuma Sekiya

IPC分类号： G06Q30/00

CPC分类号： G06Q30/0641 ,  G06Q10/087 ,  G06Q30/06

摘要： A method of managing a plurality of parts of an apparatus includes creating a part database of part information including at least the weights, part numbers, and shapes of individual parts, measuring the weight of a part to be ordered, entering the measured weight through input means of an information terminal and accessing the part database, extracting part information of all parts having weights which fall in a predetermined allowable range similar to the entered weight, from the part database, and displaying the extracted part information on display means of the information terminal, identifying the part number of the part to be ordered based on shapes of the parts represented by the displayed part information, and ordering the part with the identified part number.

摘要翻译： 一种管理设备的多个部分的方法包括：创建零件信息的零件数据库，该零件信息至少包括各个零件的重量，零件号和形状，测量要排序零件的重量，通过输入输入测量重量 信息终端的装置和访问部件数据库，从部件数据库中提取具有与输入的重量类似的预定允许范围的权重的所有部件的部分信息，并且将提取的部件信息显示在信息终端的显示装置上 根据由所显示的部件信息表示的部件的形状来识别要排序的部件的部件号，并对所述部件编号进行排序。

公开(公告)号：US08025553B2

公开(公告)日：2011-09-27

申请号：US12175197

申请日：2008-07-17

申请人： Kazuma Sekiya ,  Yusuke Kimura ,  Takashi Mori ,  Toshiharu Daii

发明人： Kazuma Sekiya ,  Yusuke Kimura ,  Takashi Mori ,  Toshiharu Daii

IPC分类号： B24B1/00

CPC分类号： B24B7/228

摘要： A back grinding method for a wafer includes covering a face-side surface of the wafer with a resin film, and cutting the surface of the resin film to form a flat surface parallel to the face-side surface of the wafer. The wafer is held with the surface of the resin film in contact with a suction surface of a chuck table in a grinding apparatus, and the exposed back-side surface of the wafer is ground. Unevenness in thickness of the resin film is suppressed, whereby the thickness of the wafer subjected to back grinding is made to be uniform.

摘要翻译： 用于晶片的背面磨削方法包括用树脂膜覆盖晶片的表面表面，并且切割树脂膜的表面以形成平行于晶片的表面侧表面的平坦表面。 将晶片保持在树脂膜的表面与研磨装置中的夹盘的吸入面接触，并且将晶片的暴露的背面表面研磨。 抑制树脂膜的厚度不匀，进行后磨削的晶片的厚度均匀。