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48 条记录 (耗时 0.02 秒)

    Method of detecting condensing spot position in laser beam processing apparatus
    5.
    发明授权
    Method of detecting condensing spot position in laser beam processing apparatus 有权
    检测激光束处理装置中聚光点位置的方法

    公开(公告)号：US08957347B2

    公开(公告)日：2015-02-17

    申请号：US13617046

    申请日：2012-09-14

    申请人： Toshiyuki Yoshikawa ,  Hironari Ohkubo ,  Noboru Takeda

    发明人： Toshiyuki Yoshikawa ,  Hironari Ohkubo ,  Noboru Takeda

    IPC分类号： H01L21/30 ,  H01L21/304 ,  B23K26/00 ,  B23K26/04 ,  B23K26/40

    CPC分类号： B23K26/048 ,  B23K26/00 ,  B23K26/0006 ,  B23K26/40 ,  B23K2103/50 ,  B23K2103/56 ,  H01L21/30 ,  H01L21/304 ,  H01L21/3043 ,  H01L2221/00

    摘要： A method of detecting a condensing spot position in a laser beam processing apparatus, including: a detection position setting step of setting a plurality of Z-axis directional positions in a range from a starting point to an ending point of detection positions into which the condenser is positioned; a laser beam processed groove forming step of sequentially positioning the condenser into the detection positions in the range from the starting point to the ending point, performing a predetermined interval indexing feeding by operating indexing feeding means each time the detection position for the condenser is changed, and forming a laser beam processed groove of a predetermined length in the plate-shaped body at each of the detection positions for the condenser; and a laser beam processed groove imaging step of imaging the laser beam processed grooves formed in the plate-shaped body by imaging means.

    摘要翻译： 一种检测激光束处理装置中的聚光点位置的方法，包括：检测位置设定步骤，在从所述冷凝器的检测位置的起始点到终点的范围内设定多个Z轴方向位置 定位 激光束处理槽形成步骤，将冷凝器顺序地定位在从起点到终点的范围内的检测位置，每当改变冷凝器的检测位置时，通过操作分度输送装置执行预定的间隔分度进给， 以及在所述冷凝器的每个检测位置处，在所述板状体中形成预定长度的激光束处理槽; 以及激光束处理槽成像步骤，通过成像装置对形成在板状体中的激光束处理槽进行成像。

    Film base material for adhesive skin patch and adhesive skin patch
    6.
    发明授权
    Film base material for adhesive skin patch and adhesive skin patch 有权
    薄膜基材，用于粘贴皮肤贴片和粘合剂皮肤贴片

    公开(公告)号：US07678959B2

    公开(公告)日：2010-03-16

    申请号：US11711111

    申请日：2007-02-27

    申请人： Katsuhiro Okada ,  Seishi Suzuki ,  Yasuyuki Sasaki ,  Yuko Ueda ,  Toshiyuki Yoshikawa

    发明人： Katsuhiro Okada ,  Seishi Suzuki ,  Yasuyuki Sasaki ,  Yuko Ueda ,  Toshiyuki Yoshikawa

    IPC分类号： A61F15/00

    CPC分类号： A61F13/0253 ,  A61F13/0209 ,  A61F13/0226 ,  A61F2013/00327 ,  A61F2013/00412 ,  A61F2013/00582 ,  Y10T428/24355

    摘要： The present invention relates to a film base material for an adhesive skin patch, which includes an elastomer film unevenly having unevenness on at least one surface thereof, in which, in one unevenness in which the distance perpendicular to the surface of the elastomer film between the top of the unevenness and the bottom thereof is the longest among the plurality of unevenness, the distance is within the range of from 1 to 5 μm; in another unevenness in which the distance perpendicular to the surface of the elastomer film between the top of the unevenness and the bottom thereof is the shortest among the plurality of unevenness, the distance is within the range of from 0.1 to 0.9 μm; and the 10-point average roughness of the surface is within the range of from 0.5 μm to 3 μm, and which is decreased in glossy texture on the surface thereof and inconspicuous when it is applied to the skin or the like; and the adhesive skin patch including the film base material.

    摘要翻译： 本发明涉及一种用于粘合性皮肤贴剂的薄膜基材，其包括在其至少一个表面上不均匀地具有不均匀性的弹性体膜，其中在垂直于弹性体膜表面之间的距离 凹凸的顶部和底部是多个凹凸中最长的距离，在1〜5μm的范围内; 在垂直于弹性体膜的表面之间的凹凸的顶部与其底部之间的距离在多个凹凸之中最短的另一个凹凸中，该距离在0.1至0.9μm的范围内; 并且表面的10点平均粗糙度在0.5μm至3μm的范围内，并且其表面上的光泽质地减小并且当其施加到皮肤等时不显眼; 以及包括膜基材的粘合性皮肤贴剂。

    Lightguide having trapezoidally-shaped main body with a level surface at an angle to a rear surface
    8.
    发明授权
    Lightguide having trapezoidally-shaped main body with a level surface at an angle to a rear surface 有权
    具有梯形主体的光导，其具有与后表面成一定角度的水平表面

    公开(公告)号：US06215936B1

    公开(公告)日：2001-04-10

    申请号：US09147594

    申请日：1999-01-29

    申请人： Toshiyuki Yoshikawa ,  Osamu Shinji ,  Toshitaka Kunisawa ,  Kouzo Yasuda

    发明人： Toshiyuki Yoshikawa ,  Osamu Shinji ,  Toshitaka Kunisawa ,  Kouzo Yasuda

    IPC分类号： G02B634

    CPC分类号： G02B6/0036 ,  G02B6/00 ,  G02B6/0001 ,  G02B6/0061 ,  G02B6/0065 ,  Y10S385/901

    摘要： A transparent lightguide (3) which guide light at least from one side end plane is characterized in that a large number of speckled, solid-line shaped or broken-line shaped protruding patterns whose cross-sectional width W (&mgr;m) at a cross section perpendicular to the axis of a linear light source is 10≦W≦200 are arranged on a light emitting surface at a low density in a region close to the linear light source and at a high density in a region far from the linear light source so as to make the luminance distribution of the light emitted from the light emitting surface approximately uniform. Here, the cross section of the protruding pattern is preferable to be approximately trapezoidal while having a straight part partially and the ratio H/W to be 0.2≦H/W≦1.0, where W and H denote cross-sectional width and height of the protruding pattern, respectively, or the cross section of the protruding pattern is preferable to be approximately circular-arc and the ratio H/W to be 0.2≦H/W≦0.5, where W and H denote cross-sectional width and height of the protruding pattern, respectively.

    摘要翻译： 至少从一个侧端引导光的透明光导（3）的特征在于，在横截面处的横截面宽度W（mum）的大量斑点状，实线形或虚线形的突出图案 垂直于线性光源的轴的10 <= W <= 200在靠近线性光源的区域以低密度布置在发光表面上，并且在远离线性光的区域中以高密度布置 源，使得从发光表面发射的光的亮度分布近似均匀。 这里，突出图案的截面优选为大致梯形，同时具有部分直线部分，并且比率H / W为0.2 <= H / W <= 1.0，其中W和H表示横截面宽度和高度 或突出图案的横截面优选为大致圆弧，比率H / W为0.2 <= H / W <= 0.5，其中W和H表示横截面宽度 和突出图案的高度。

    Wafer laser processing method
    10.
    发明授权
    Wafer laser processing method 有权
    晶圆激光加工方法

    公开(公告)号：US07446022B2

    公开(公告)日：2008-11-04

    申请号：US11384355

    申请日：2006-03-21

    申请人： Toshiyuki Yoshikawa ,  Nobuyasu Kitahara ,  Noboru Takeda

    发明人： Toshiyuki Yoshikawa ,  Nobuyasu Kitahara ,  Noboru Takeda

    IPC分类号： H01L21/301 ,  B23K26/38

    CPC分类号： B23K26/40 ,  B23K2103/172

    摘要： A wafer laser processing method for forming a groove in a wafer having a protective film on the processing surface of a substrate along a predetermined processing line, comprising a first step for forming a first groove in the protective film along the dividing lines by applying a first pulse laser beam set to an output at which the protective film can be processed but the substrate can not be processed, to the protective film along the processing lines; and a second step for forming a second groove in the substrate along the first grooves by applying a second pulse laser beam set to an output at which the substrate can be processed, along the first grooves.

    摘要翻译： 一种用于在沿着预定处理线的基板的处理表面上具有保护膜的晶片中形成凹槽的晶片激光加工方法，包括：通过施加第一工序，沿着分割线在保护膜中形成第一凹槽的第一步骤 将脉冲激光束设置到可以处理保护膜但不能处理衬底的输出到处理线的保护膜; 以及第二步骤，通过沿着第一凹槽施加第二脉冲激光束设置到可以处理基板的输出端，沿着第一凹槽在基板中形成第二凹槽。